公开(公告)号：US11068770B2

公开(公告)日：2021-07-20

申请号：US16267387

申请日：2019-02-05

Applicant: David Finn ,  Mustafa Lotya

Inventor： David Finn ,  Mustafa Lotya

IPC: G06K19/06 ,  G06K19/077 ,  H01Q1/22

Abstract: Connection bridges (CBR) for dual-interface transponder chip modules (TCM) 200 may have an area which is substantially equal to or greater than an area of a contact pad (CP) of a contact pad array (CPA). A given connection bridge may be L-shaped and may comprise (i) a first portion disposed external to the contact pad array and extending parallel to the insertion direction, and (ii) a second portion extending from an end of the first portion perpendicular to the insertion direction to within the contact pad array (CPA) such as between C1 and C5. The connection bridge may extend around a corner of the contact pad array, may be large enough to accommodate wire bonding, and may be integral with a coupling frame (CF) extending around the contact pad array. The transponder chip modules may be integrated into a smart card (SC).

公开(公告)号：US20210182650A1

公开(公告)日：2021-06-17

申请号：US17006795

申请日：2020-08-29

Applicant: Mustafa Lotya ,  David Finn ,  Darren Molloy

Inventor： Mustafa Lotya ,  David Finn ,  Darren Molloy

IPC: G06K19/077 ,  H01Q1/22 ,  H01Q21/29 ,  H01Q7/00 ,  H05K1/16

Abstract: RFID devices comprising (i) a transponder chip module (TCM, 1410) having an RFIC chip (IC) and a module antenna (MA), and (ii) a coupling frame (CF) having an electrical discontinuity comprising a slit (S) or non-conductive stripe (NCS). The coupling frame may be disposed closely adjacent the transponder chip module so that the slit overlaps the module antenna. The RFID device may be a payment object such as a jewelry item having a metal component modified with a slit (S) to function as a coupling frame. The coupling frame may be moved (such as rotated) to position the slit to selectively overlap the module antennas (MA) of one or more transponder chip modules (TCM-1, TCM-2) disposed in the payment object, thereby selectively enhancing (including enabling) contactless communication between a given transponder chip module in the payment object and another RFID device such as an external contactless reader. The coupling frame may be tubular. A card body construction for a metal smart card is disclosed.

公开(公告)号：US10824931B2

公开(公告)日：2020-11-03

申请号：US16246495

申请日：2019-01-13

Applicant: David Finn ,  Mustafa Lotya ,  Darren Molloy

Inventor： David Finn ,  Mustafa Lotya ,  Darren Molloy

IPC: G06K19/06 ,  G06K19/077 ,  H01Q1/22 ,  H01Q21/29 ,  H01Q7/00 ,  H05K1/16 ,  H04B5/00 ,  H05K3/10 ,  H01F38/14

Abstract: A smartcard (SC) having at least a contactless interface, such as having a dual interface transponder chip module (TCM) with a chip (IC), a module antenna (MA) for the contactless interface, and contact pads (CP) for a contact interface. Metal layers (ML) may have openings (MO) for receiving the module, and slits (S) or nonconductive stripes (NCS) extending to the openings, thereby forming coupling frames (CF). A card body (CB) for the smartcard may comprise two such metal layers (front and rear coupling frames) separated by a layer of non-conductive (dielectric) material. A front face card layer and a rear face card layer may complete a multiple coupling frame stack-up for a smartcard.

公开(公告)号：US10783426B2

公开(公告)日：2020-09-22

申请号：US16260110

申请日：2019-01-29

Applicant: David Finn ,  Mustafa Lotya ,  Darren Molloy

Inventor： David Finn ,  Mustafa Lotya ,  Darren Molloy

IPC: G06K19/06 ,  G06K19/077 ,  H01Q1/22 ,  H01Q7/00 ,  H05K1/16 ,  H01Q21/29 ,  H05K3/10 ,  H01F38/14

Abstract: A dual-interface metal hybrid smartcard comprising a plastic card body (CB), a booster antenna (BA) and a metal frame (CMF, DMF) disposed in the card body, in the form of a rectangular metal frame disposed external to the booster antenna (BA). The metal frame may extend continuously around the periphery of the card body as a continuous metal frame (CMF), or may have a slit (S), thereby forming a discontinuous metal frame (DMF). A second metal slug (MS-2) may be disposed at a lower portion of the card body (CB), inside the booster antenna. A smartcard may comprise a plastic card body (CB) and a generally rectangular metal slug (MS) having a main body portion slightly smaller than the card body, and having at least one protrusion extending from corresponding at least one corner of the main body portion of the metal slug to corresponding at least one corner of the card body.

公开(公告)号：US20200250506A1

公开(公告)日：2020-08-06

申请号：US16826322

申请日：2020-03-23

Applicant: Mustafa Lotya ,  David Finn ,  Darren Molloy

Inventor： Mustafa Lotya ,  David Finn ,  Darren Molloy

IPC: G06K19/077 ,  H01Q1/22 ,  H01Q21/29 ,  H01Q7/00 ,  H05K1/16

Abstract: Smartcards having (i) a metal card body (MCB) with a slit (S) overlapping a module antenna (MA) of a chip module (TCM) or (ii) multiple metal layers (M1, M2, M3) each having a slit (S1, S2, S3) offset from or oriented differently than each other. A front metal layer may be continuous (no slit), and may be shielded from underlying metal layers by a shielding layer (SL). Metal backing inserts (MBI) reinforcing the slit(s) may also have a slit (S2) overlapping the module antenna. Diamond like carbon coating filling the slit. Key fobs similarly fabricated. Smart cards with metal card bodies (MCB). Plastic-Metal-Plastic smartcards and methods of manufacture are disclosed. Such cards may be contactless only, contact only, or may be dual-interface (contact and contactless) cards.

公开(公告)号：US20200050914A1

公开(公告)日：2020-02-13

申请号：US16267387

申请日：2019-02-05

Applicant: David Finn ,  Mustafa Lotya

Inventor： David Finn ,  Mustafa Lotya

IPC: G06K19/077 ,  H01Q1/22

Abstract: Connection bridges (CBR) for dual-interface transponder chip modules (TCM) 200 may have an area which is substantially equal to or greater than an area of a contact pad (CP) of a contact pad array (CPA). A given connection bridge may be L-shaped and may comprise (i) a first portion disposed external to the contact pad array and extending parallel to the insertion direction, and (ii) a second portion extending from an end of the first portion perpendicular to the insertion direction to within the contact pad array (CPA) such as between C1 and C5. The connection bridge may extend around a corner of the contact pad array, may be large enough to accommodate wire bonding, and may be integral with a coupling frame (CF) extending around the contact pad array. The transponder chip modules may be integrated into a smart card (SC).

公开(公告)号：US20200034578A1

公开(公告)日：2020-01-30

申请号：US16571194

申请日：2019-09-16

Applicant: David Finn ,  Mustafa Lotya ,  Darren Molloy

Inventor： David Finn ,  Mustafa Lotya ,  Darren Molloy

IPC: G06K7/00 ,  G06K19/077 ,  G06K19/07

Abstract: According to the invention, generally, a wireless connection may be established between two electronic modules (M1, M2) disposed in module openings (MO-1, MO-2) of a smartcard so that the two modules may communicate (signals, data) with each other. The connection may be implemented by a booster antenna (BA) having two coupler coils (CC-1, CC-2) disposed close to the two modules, and connected with one another. The booster antenna may also harvest energy from an external device such as a card reader, POS terminal, or a smartphone. A coupling antenna (CPA) may have only the two coupler coils connected with one another, without the peripheral card antenna (CA) component of a conventional booster antenna. A module may be disposed in only one of the two module openings.

公开(公告)号：US20180341846A1

公开(公告)日：2018-11-29

申请号：US15939281

申请日：2018-03-29

Applicant: David Finn ,  Mustafa Lotya ,  Darren Molloy

Inventor： David Finn ,  Mustafa Lotya ,  Darren Molloy

IPC: G06K19/077 ,  H01Q1/22 ,  H04B5/00

Abstract: A metal smartcard (SC) having a transponder chip module (TCM) with a module antenna (MA), and a card body (CB) comprising two discontinuous metal layers (ML), each layer having a slit (S) overlapping the module antenna, the slits being oriented differently than one another. One metal layer can be a front card body (FCB, CF1), and the other layer may be a rear card body (RCB, CF2) having a magnetic stripe (MS) and a signature panel (SP).

公开(公告)号：US09272370B2

公开(公告)日：2016-03-01

申请号：US14281876

申请日：2014-05-19

Applicant: David Finn ,  Mustafa Lotya

Inventor： David Finn ,  Mustafa Lotya

IPC: B23K26/364 ,  B23K26/36 ,  H01Q1/22 ,  H01Q7/00 ,  B23K26/40 ,  H01Q1/38 ,  H01Q7/06 ,  G06K19/077

CPC classification number: B23K26/362 ,  B23K26/361 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/50 ,  G06K19/0775 ,  G06K19/07769 ,  G06K19/07771 ,  G06K19/07773 ,  H01Q1/2225 ,  H01Q1/38 ,  H01Q7/00 ,  H01Q7/06

Abstract: Laser etching antenna structures (AS) for RFID antenna modules (AM). Combining laser etching and chemical etching. Limiting the thickness of the contact pads (CP) to less than the skin depth (18 m) of the conductive material (copper) used for the contact pads (CP). Multiple antenna structures (AS1, AS2) in an antenna module (AM). Incorporating LEDs into the antenna module (AM) or smartcard (SC).

Abstract translation: 用于RFID天线模块（AM）的激光蚀刻天线结构（AS）。 组合激光蚀刻和化学蚀刻。 将接触垫（CP）的厚度限制为小于用于接触垫（CP）的导电材料（铜）的表皮深度（18μm）。 天线模块（AM）中的多个天线结构（AS1，AS2）。 将LED并入天线模块（AM）或智能卡（SC）。

公开(公告)号：US09251458B2

公开(公告)日：2016-02-02

申请号：US14225570

申请日：2014-03-26

Applicant: David Finn ,  Mustafa Lotya

Inventor： David Finn ,  Mustafa Lotya

IPC: G06K19/07 ,  G06K19/077 ,  H01Q1/22 ,  H01Q1/38 ,  H01Q7/00 ,  H05K1/02 ,  H01F38/14 ,  H01F27/36 ,  H01F41/16 ,  H05K1/18 ,  H05K3/12

CPC classification number: G06K19/07769 ,  G06K19/07794 ,  H01F27/365 ,  H01F38/14 ,  H01F41/16 ,  H01Q1/2225 ,  H01Q1/2283 ,  H01Q1/38 ,  H01Q7/00 ,  H05K1/0233 ,  H05K1/183 ,  H05K3/1275 ,  H05K2201/0218 ,  H05K2201/0723 ,  H05K2201/086 ,  H05K2201/10098

Abstract: Selective deposition of magnetic material such as particles, and producing a pre-laminated stack of shielding layers for offsetting attenuation of RF caused by a metal face plate of a smart card (or tag) or a metallized layer near a passive transponder. Coated or uncoated magnetic particles of different sizes may be used to increase the packing density of the material after its deposition on a substrate. Magnetography-based techniques may be used to apply the particles, at high packing density, including different-sized particles to a substrate such as PVC. Magnetic particles may be used as a carrier medium to deposit other particles nanoparticles. A system for selective deposition is disclosed.

Abstract translation: 选择性沉积诸如颗粒的磁性材料，并且产生用于抵消由智能卡（或标签）的金属面板或无源应答器附近的金属化层引起的RF衰减的屏蔽层的预叠层叠层。 可以使用不同尺寸的涂覆或未涂覆的磁性颗粒来增加材料沉积在基底上后的堆积密度。 可以使用基于磁图的技术将颗粒以高填充密度（包括不同大小的颗粒）施加到诸如PVC的基材上。 磁性颗粒可以用作载体介质以沉积其他颗粒纳米颗粒。 公开了用于选择性沉积的系统。