公开(公告)号：US20180190881A1

公开(公告)日：2018-07-05

申请号：US15660245

申请日：2017-07-26

Applicant: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD. ,  LITE-ON TECHNOLOGY CORPORATION

Inventor： CHEN-HSIU LIN

IPC: H01L33/50 ,  H01L33/48 ,  H01L33/62 ,  H01L33/60 ,  H01L25/075 ,  H01L25/16 ,  H01L33/54

CPC classification number: H01L33/505 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/486 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: An LED package structure includes a substrate, an electrode layer and an insulating layer disposed on the substrate with a coplanar arrangement, an LED chip mounted on the electrode layer and the insulating layer, a phosphor plate covering a top surface of the LED chip, and a reflective housing disposed on the electrode layer and the insulating layer and covering side surfaces of the LED chip and side surfaces of the phosphor plate. An opening is formed on the top surface of the reflective housing so as to expose a light emitting surface of the phosphor plate. A distance between the top surface of the reflective housing and the substrate is greater than a distance between the light emitting surface of the phosphor plate and the substrate. A distance between the top surface of the reflective housing and the light emitting surface is in a range of 10˜30 μm.

公开(公告)号：US20150117033A1

公开(公告)日：2015-04-30

申请号：US14474449

申请日：2014-09-02

Applicant: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED ,  LITE-ON TECHNOLOGY CORPORATION

Inventor： KUO-MING CHIU ,  MENG-SUNG CHOU ,  CHEN-HSIU LIN

IPC: F21V19/00 ,  F21V23/00 ,  F21K99/00

CPC classification number: F21V19/0055 ,  F21Y2101/00 ,  F21Y2105/10 ,  F21Y2115/10

Abstract: A light-emitting structure comprises a carrier, a light-emitting diode package, and a fixing module. The light-emitting diode package comprises a brittle substrate and a light-emitting unit. The brittle substrate is disposed on the carrier and the light-emitting unit is disposed on the brittle substrate. The fixing module comprises at least two screw units and at least two elastic members which sleeve the screw unit respectively. Each of screw units is screwed onto the carrier and applies a force on the upper surface of the brittle substrate, so as to fasten the brittle substrates to the carrier. Each of elastic members is disposed between the respective screw unit and the carrier, so as to adjust the force from the screw unit.

Abstract translation: 发光结构包括载体，发光二极管封装和定影模块。 发光二极管封装包括脆性衬底和发光单元。 脆性基板设置在载体上，发光单元设置在脆性基板上。 固定模块包括至少两个螺钉单元和至少两个弹性构件，其分别套合螺钉单元。 将每个螺丝单元拧到载体上并在脆性基底的上表面上施加力，以将脆性基底固定到载体上。 每个弹性构件设置在相应的螺钉单元和载体之间，以便调节来自螺钉单元的力。

公开(公告)号：US20140299894A1

公开(公告)日：2014-10-09

申请号：US14230352

申请日：2014-03-31

Applicant: LITE-ON TECHNOLOGY CORPORATION ,  LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD.

Inventor： CHEN-HSIU LIN ,  CHIA-HAO WU

IPC: H01L27/15 ,  H01L33/60 ,  H01L33/62

CPC classification number: F21K9/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L33/10 ,  H01L33/405 ,  H01L33/486 ,  H01L33/60 ,  H01L2224/48091 ,  H05K1/021 ,  H05K2201/09054 ,  H05K2201/10106 ,  H01L2924/00014

Abstract: A light emitting diode (LED) package including a substrate unit, a light emitting unit and an encapsulant. The substrate unit includes a metal substrate and a circuit board. The metal substrate has a first carrier portion and a second carrier portion. The second carrier portion is projected from the first carrier portion. The first carrier portion has a first carrier face. The second carrier portion has a second carrier face located higher than the first carrier face. The circuit board is disposed on the first carrier face, and the second carrier portion passes through the circuit board. The light emitting unit includes at least one LED chip disposed on the second carrier face of the second carrier portion, and the LED chip electrically connected to the circuit board. The encapsulant encapsulates the LED chip.

Abstract translation: 一种包括基板单元，发光单元和密封剂的发光二极管（LED）封装。 基板单元包括金属基板和电路板。 金属基板具有第一载体部分和第二载体部分。 第二载体部分从第一载体部分突出。 第一载体部分具有第一载体面。 第二载体部分具有位于比第一载体面高的第二载体面。 电路板设置在第一载体面上，第二载体部分通过电路板。 发光单元包括设置在第二载体部分的第二载体面上的至少一个LED芯片，以及电连接到电路板的LED芯片。 密封剂封装了LED芯片。