公开(公告)号：US10256380B2

公开(公告)日：2019-04-09

申请号：US15524413

申请日：2015-11-05

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Wolfgang Moench ,  Frank Singer ,  Thomas Schwarz ,  Jürgen Moosburger ,  Stefan Illek

IPC: H01L33/58 ,  H01L33/00 ,  H01L33/56 ,  H01L33/50 ,  H01L33/62 ,  H02N1/00

Abstract: A method of producing an optoelectronic component includes embedding an optoelectronic component part into a molded body such that an upper side of the optoelectronic component part is at least partially exposed on an upper side of the molded body; arranging and structuring a sacrificial layer above the upper side of the optoelectronic component part and the upper side of the molded body; arranging and structuring a layer of an optical material above the sacrificial layer; and removing the sacrificial layer.

公开(公告)号：US09978918B2

公开(公告)日：2018-05-22

申请号：US14902834

申请日：2014-07-03

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Michael Zitzlsperger ,  Tobias Gebuhr ,  Thomas Schwarz

IPC: H01L33/62 ,  H01L33/50 ,  H01L33/54 ,  H01L23/00 ,  H01L25/075 ,  H01L33/48

CPC classification number: H01L33/62 ,  H01L24/73 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/505 ,  H01L33/507 ,  H01L33/54 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/1815 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00 ,  H01L2224/4554

Abstract: A method can be used for producing an optoelectronic device. A first leadframe section with a component is provided. The component is designed to emit electromagnetic radiation on an emission side. The emission side faces away from the carrier. A second leadframe section is provided. In a first method step the component and the two leadframe sections are encapsulated with a first potting material in such a way that the component and the leadframe sections are embedded into a potting body, but wherein at least part of the emission area of the component remains free of the first potting material and a cutout is formed in the potting body at least above the emission area of the component. In a second method step a second potting material is molded into the cutout of the potting body, such that the emission side of the component is covered with the second potting material.

公开(公告)号：US09954150B2

公开(公告)日：2018-04-24

申请号：US14382578

申请日：2013-02-28

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thomas Schwarz ,  Stefan Illek

IPC: H01L33/64 ,  H01L33/54 ,  H01L33/62 ,  H01L25/075

CPC classification number: H01L33/54 ,  H01L25/0753 ,  H01L33/62 ,  H01L33/642 ,  H01L2924/0002 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2933/0075 ,  H01L2924/00

Abstract: The invention relates to a light-emitting semiconductor component comprising a light-emitting semiconductor chip with a semiconductor layer series, a light out-coupling surface, a rear surface lying opposite said light out-coupling surface and lateral surfaces, and a support body with a shaped body that directly covers the lateral surfaces in form-locked manner, two electric contact layers and a thermal contact layer being provided on the rear surface. The thermal contact layer is electrically insulated from the electric contact layers and the semiconductor layer series, the support body has electric connection elements in direct contact with the electric contact layers and a thermal connection element in direct contact with the thermal contact layer on the rear surface and the thermal connection element at least partially forms an assembly surface of the semiconductor component facing away from the semiconductor chip. The invention further relates to a method for producing a semiconductor component.

公开(公告)号：US20170331019A1

公开(公告)日：2017-11-16

申请号：US15525759

申请日：2015-10-26

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thomas Schwarz ,  Frank Singer

IPC: H01L33/62 ,  H01L25/075

CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/505 ,  H01L33/54 ,  H01L33/641 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An optoelectronic semiconductor component includes a carrier having a carrier top side and an opposing carrier underside, wherein the carrier top sides each have a larger area than the associated carrier undersides, the carrier parts fixedly connect to one another via at least one potting body and the potting body together with the carrier parts represents a bearing component of the semiconductor component so that all carrier undersides end flush with the potting body, the light-emitting semiconductor chips electrically connect in series, the metal layer on the carrier top side is structured into conductor tracks and into electrical connection surfaces, and the electrical connection surfaces on the carrier top side are electrically insulated from the associated carrier underside so that the carrier underside of the carrier part the semiconductor chips are arranged on is potential-free and is completely covered with the metal layer.

公开(公告)号：US20170294428A1

公开(公告)日：2017-10-12

申请号：US15529112

申请日：2015-11-30

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Frank Singer ,  Thomas Schwarz ,  Stefan Grötsch

IPC: H01L25/16 ,  H01L33/64 ,  H01L33/62 ,  H01L25/075 ,  H01L33/52

CPC classification number: H01L25/167 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/52 ,  H01L33/62 ,  H01L33/642 ,  H01L2933/005 ,  H01L2933/0066

Abstract: A method produces a plurality of optoelectronic modules, and includes: A) providing a metallic carrier assembly with a plurality of carrier units; B) applying a logic chip, each having at least one integrated circuit, to the carrier units; C) applying emitter regions that generate radiation, which can be individually electrically controlled; D) covering the emitter regions and the logic chips with a protective material; E) overmolding the emitter regions and the logic chips so that a cast body is formed, which joins the carrier units, the logic chips and the emitter regions to one another; F) removing the protective material and applying electrical conductor paths to the upper sides of the logic chips and to a cast body upper side; and G) dividing the carrier assembly into the modules.

公开(公告)号：US20170222092A1

公开(公告)日：2017-08-03

申请号：US15487277

申请日：2017-04-13

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Tobias Gebuhr ,  Matthias Knoerr ,  Klaus Mueller ,  Thomas Schwarz ,  Frank Singer ,  Michael Zitzlsperger

IPC: H01L33/48 ,  H01L25/075 ,  H01L33/62 ,  H01L23/498 ,  H01L51/56 ,  H01L51/52

CPC classification number: H01L33/483 ,  H01L21/4828 ,  H01L21/565 ,  H01L23/49861 ,  H01L24/32 ,  H01L25/0753 ,  H01L33/62 ,  H01L51/5237 ,  H01L51/5246 ,  H01L51/5296 ,  H01L51/56 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/92247 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2933/0033 ,  H01L2933/0066 ,  Y10T29/49121 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A housing for an optical component is provided in various embodiments. The housing has a leadframe section and a mold compound. The leadframe section is formed from an electrically conductive material and has a first side and a second side facing away from the first side. On the first side, the leadframe section has at least one first receiving region for receiving the optical component and/or at least one contact region for electrically contacting the optical component. The leadframe section has at least one trench which is formed in the leadframe section on the first side thereof alongside the receiving region and/or the contact region. The leadframe section is embedded in the mold compound. The mold compound has at least one receiving recess in which the first receiving region and/or the contact region and the trench are arranged.

公开(公告)号：US20170148966A1

公开(公告)日：2017-05-25

申请号：US15318660

申请日：2015-06-09

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thomas Schwarz ,  Frank Singer

IPC: H01L33/62 ,  H01L33/56 ,  H01L23/60 ,  H01L33/50 ,  H01L31/18 ,  H01L21/683 ,  H01L31/02 ,  H01L31/0203 ,  H01L31/0232 ,  H01L33/54 ,  H01L33/00

CPC classification number: H01L33/62 ,  H01C7/12 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/60 ,  H01L24/96 ,  H01L31/02002 ,  H01L31/0203 ,  H01L31/02327 ,  H01L31/1876 ,  H01L31/1892 ,  H01L33/0095 ,  H01L33/382 ,  H01L33/486 ,  H01L33/505 ,  H01L33/507 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066

Abstract: A surface-mountable semiconductor component and a method for producing the same are disclosed. In an embodiment the component includes an optoelectronic semiconductor chip, first and second contact elements and a molded body, wherein the chip includes a semiconductor body having a semiconductor layer sequence with an active region provided for producing and/or receiving electromagnetic radiation and arranged between a first semiconductor layer and a second semiconductor layer, wherein the first contact elements are electrically conductively connected to the first semiconductor layer and the second contact elements are electrically conductively connected to the second semiconductor layer, wherein the molded body at least partially encloses the optoelectronic semiconductor chip, wherein the semiconductor component includes a mounting face formed by a surface of the molded body, and wherein the first and second contact elements protrudes through the molded body in a region of the mounting face.

公开(公告)号：US09515015B2

公开(公告)日：2016-12-06

申请号：US14423835

申请日：2013-08-28

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Tobias Gebuhr ,  Thomas Schwarz ,  Michael Zitzlsperger

IPC: H01L23/495 ,  H01L23/498 ,  H01L33/48 ,  H01L21/48 ,  H01L51/52 ,  H01L33/64

CPC classification number: H01L23/49586 ,  H01L21/4839 ,  H01L23/49861 ,  H01L33/486 ,  H01L33/647 ,  H01L51/5212 ,  H01L51/5228 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2924/00014 ,  H01L2924/12044 ,  H01L2933/0033 ,  Y10T29/49121 ,  H01L2924/00 ,  H01L2224/4554

Abstract: A housing includes a lead frame formed from electrically conductive material having first and second sides, a contact section contacting an electronic component at the first side, and at least one receiving section arranging the electronic component at the first side, wherein the contact and receiving sections are separated and the contact section is formed thinner than the receiving section in a direction perpendicular, a molding material having an opening, the receiving and contact regions exposed in the opening, and into which the leadframe is embedded such that part of the molding material is formed between the contact and receiving sections and the second side is covered by the molding material in the contact section, and the second side is free of molding material in the receiving section, wherein the molding material at the second side has at least one opening filled with the electrically insulating material.

Abstract translation: 壳体包括由导电材料形成的引线框架，该引线框架具有第一和第二侧面，接触部分与第一侧面处的电子部件接触，以及至少一个接收部分，其在第一侧布置电子部件，其中接触部分和接收部分 被分离，并且接触部分在垂直方向上比接收部分形成得更薄，具有开口的成型材料，接触和接触区域暴露在开口中，并且引线框架被嵌入其中，使得部分成型材料为 形成在接触部分和接收部分之间的第二面被接触部分中的成型材料覆盖，并且第二侧在接收部分中没有成型材料，其中第二侧的成型材料具有至少一个开口 与电绝缘材料。

公开(公告)号：US09509117B2

公开(公告)日：2016-11-29

申请号：US14916660

申请日：2014-08-14

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thomas Schwarz ,  Thomas Dobbertin

IPC: H01S5/00 ,  H01S5/022 ,  H01S5/40

CPC classification number: H01S5/02272 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49107 ,  H01L2224/49111 ,  H01S5/022 ,  H01S5/02212 ,  H01S5/02276 ,  H01S5/4018 ,  H01S5/4031 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An optoelectronic component includes a housing including a base having an upper side and a lower side, and a cap, and a laser chip arranged between the upper side of the base and the cap, wherein a first solder contact pad and a second solder contact pad are formed on the lower side of the base, the laser chip includes a second electrical contact pad, and the second electrical contact pad electrically conductively connects to a section of the base electrically conductively connected to the second solder contact pad by a second bonding wire.

Abstract translation: 一种光电子部件包括：壳体，包括具有上侧和下侧的基座和盖;以及激光芯片，布置在基座的上侧和盖之间，其中第一焊料接触焊盘和第二焊接接触焊盘 形成在基座的下侧，激光芯片包括第二电接触焊盘，第二电接触焊盘通过第二接合线导电地连接到与第二焊接接触焊盘导电连接的基座的一部分。

公开(公告)号：US20160181491A1

公开(公告)日：2016-06-23

申请号：US15058667

申请日：2016-03-02

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Matthias Sabathil ,  Stefan Illek ,  Thomas Schwarz

IPC: H01L33/60 ,  H01L25/16 ,  H01L25/00 ,  H01L33/54

CPC classification number: H01L33/60 ,  H01L25/0753 ,  H01L25/167 ,  H01L25/50 ,  H01L31/00 ,  H01L31/02322 ,  H01L33/46 ,  H01L33/486 ,  H01L33/54 ,  H01L33/56 ,  H01L51/5271 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2924/00

Abstract: An optoelectronic semiconductor component including an optoelectronic semiconductor chip having a first surface, wherein the first surface is a radiation emission surface of the optoelectronic semiconductor chip, the semiconductor chip is embedded in a mold body, the first surface is elevated with respect to a top side of the mold body, and a reflective layer is arranged on the top side of the mold body.

Abstract translation: 一种包括具有第一表面的光电子半导体芯片的光电半导体部件，其中所述第一表面是所述光电子半导体芯片的辐射发射表面，所述半导体芯片被嵌入在模体中，所述第一表面相对于顶侧被升高 并且反射层设置在模体的顶侧。