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    Light Engine for Light Emitting Element
    32.
    发明申请
    Light Engine for Light Emitting Element 审中-公开
    发光元件轻型发动机

    公开(公告)号：US20160334080A1

    公开(公告)日：2016-11-17

    申请号：US15142189

    申请日：2016-04-29

    Applicant: Point Engineering Co., Ltd.

    Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Tae Hwan Song

    IPC: F21V15/00 ,  F21V29/70 ,  H05B33/08 ,  F21V23/06

    CPC classification number: H05B33/0815 ,  F21K9/00 ,  F21V23/005 ,  F21V29/70 ,  F21Y2115/10 ,  H05B33/0803 ,  H05K1/0209 ,  H05K2201/10106 ,  Y02B20/341

    Abstract: A light engine for a light emitting element includes an element substrate on which a plurality of light emitting elements is mounted, a plurality of circuit substrates connected to one another in an insulated state in order to apply a drive voltage to the light emitting elements and connected to the element substrate in an insulated state, and a plurality of protection substrates configured to surround the element substrate and the circuit substrates and to make contact with the element substrate and the circuit substrates in an insulated state.

    Abstract translation: 用于发光元件的光引擎包括其上安装有多个发光元件的元件基板，在绝缘状态下彼此连接的多个电路基板，以便向发光元件施加驱动电压并连接 绝缘状态的元件基板和多个保护基板，其被配置为围绕元件基板和电路基板，并且与绝缘状态的元件基板和电路基板接触。

    Optical device integrated with driving circuit and power supply circuit, method for manufacturing optical device substrate used therein, and substrate thereof
    33.
    发明授权
    Optical device integrated with driving circuit and power supply circuit, method for manufacturing optical device substrate used therein, and substrate thereof 有权
    与驱动电路和电源电路集成的光学器件，其中使用的光学器件衬底的制造方法及其衬底

    公开(公告)号：US09018651B2

    公开(公告)日：2015-04-28

    申请号：US14365408

    申请日：2012-10-04

    Applicant: Point Engineering Co., Ltd.

    Inventor： Bum Mo Ahn ,  Ki Myung Nam ,  Seung Ho Park

    IPC: H01L33/00 ,  H01L27/15 ,  H05B33/08 ,  H01L25/16 ,  H01L33/62 ,  H01L33/64 ,  H01L25/075

    CPC classification number: H01L27/15 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/005 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/48091 ,  H01L2224/48465 ,  H05B33/0803 ,  H05B33/0806 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: The present invention relates to an optical device integrated with a driving circuit and a power supply circuit, a method for manufacturing an optical device substrate used therein, and a substrate thereof, which are capable of reducing the overall size and facilitating the handling and management thereof by mounting a plurality of optical elements, driving circuits thereof, and power supply circuits thereof on a single substrate for an optical device having a vertical insulating layer. The objective of the present invention is to provide the optical device integrated with the driving circuit and the power supply circuit, the method for manufacturing the optical device substrate used therein, and the substrate thereof which are capable of reducing the overall size and facilitating the handling and the management thereof by mounting the plurality of optical elements, the driving circuits thereof, and the power supply circuits thereof on the single substrate for the optical device having the vertical insulating layer.

    Abstract translation: 本发明涉及与驱动电路和电源电路集成的光学器件，其中使用的光学器件衬底的制造方法及其基板，其能够减小总体尺寸并且便于其处理和管理 通过将多个光学元件，其驱动电路及其电源电路安装在具有垂直绝缘层的光学器件的单个基板上。 本发明的目的是提供与驱动电路和电源电路集成的光学装置，其中使用的光学器件基板的制造方法及其基板，其能够减小总体尺寸并便于处理 并且通过将多个光学元件及其驱动电路及其电源电路安装在具有垂直绝缘层的光学器件的单个基板上来进行管理。

    Light Emitting Device Substrate and Method for Manufacturing the Same
    34.
    发明申请
    Light Emitting Device Substrate and Method for Manufacturing the Same 有权
    发光装置基板及其制造方法

    公开(公告)号：US20150103541A1

    公开(公告)日：2015-04-16

    申请号：US14513601

    申请日：2014-10-14

    Applicant: Point Engineering Co., Ltd.

    Inventor： Bum Mo Ahn ,  Seung Ho Park

    IPC: F21V19/00 ,  F21K99/00

    CPC classification number: F21K9/90 ,  F21Y2101/00 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/62 ,  H01L2224/48 ,  H01L2924/0002 ,  H01L2933/0066 ,  Y10T29/49126 ,  H01L2924/00

    Abstract: This invention relates to an optical device, more particularly, to a method for manufacturing an optical device substrate in which an optical device can be arranged in a various manner. The method includes manufacturing a plurality of unit block substrates by stacking n (n>1) number of flat panel metal substrates and cutting a first metal substrate-bonded body made by forming insulating members between stacked surfaces of the flat panel metal substrates such that each unit block substrate is partitioned into n number of optical device attachment areas by (n−1) number of the insulating members; manufacturing a second metal substrate-bonded body by stacking at least m (m>1) number of the unit block substrates in a manner that the insulating members are oriented in a vertical direction, inserting at least one of the insulating members and metal electrode substrates between the stacked surfaces, and bonding the metal electrode substrates onto a top and a bottom of the second metal substrate-bonded body; and manufacturing the optical device substrate by cutting the second metal substrate-bonded body from the top to the bottom such that each cut surface has m×n number of the optical device attachment areas.

    Abstract translation: 光学装置技术领域本发明涉及一种光学装置，更具体地说，涉及可以以各种方式布置光学装置的光学装置基板的制造方法。 该方法包括通过堆叠n（n≥1）个数量的平板金属基板来制造多个单位块基片，并且切割通过在平板金属基片的堆叠表面之间形成绝缘件制成的第一金属基底粘结体， 单元块基板通过（n-1）个绝缘构件被划分成n个光学装置附接区域; 通过以绝缘构件沿垂直方向取向的方式堆叠至少m（m> 1）个单位块基板来制造第二金属基板结合体，插入至少一个绝缘构件和金属电极基板 在所述堆叠表面之间，并且将所述金属电极基板接合到所述第二金属基板接合体的顶部和底部; 并且通过将第二金属基板接合体从顶部切割到底部来制造光学器件基板，使得每个切割表面具有m×n个光学器件附接区域。

    Probe card
    36.
    发明授权
    Probe card 有权

    公开(公告)号：US12270828B2

    公开(公告)日：2025-04-08

    申请号：US17919742

    申请日：2021-04-20

    Applicant: POINT ENGINEERING CO., LTD.

    Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

    IPC: G01R1/073 ,  G01R31/28

    Abstract: Proposed is a probe card. The probe card according to the present disclosure includes: a circuit board; a probe head having a guide plate, and through which a plurality of probes pass; and a connection member electrically connecting the circuit board and the probes to each other, wherein an insulating part of the connection member and the guide plate are made of an anodic aluminum oxide film formed by anodizing a metal as a base material.

    Probe card for testing a pattern formed on a wafer
    40.
    发明授权
    Probe card for testing a pattern formed on a wafer 有权

    公开(公告)号：US11619655B2

    公开(公告)日：2023-04-04

    申请号：US17029979

    申请日：2020-09-23

    Applicant: POINT ENGINEERING CO., LTD.

    Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

    IPC: G01R1/073 ,  G01R31/28

    Abstract: A probe card is configured to perform a circuit test on a wafer to realize a reduction in size and pitch of probe insertion holes. The probe card includes a first plate, a second plate coupled to a lower portion of the first plate, an upper guide plate provided on an upper surface of the first plate, a lower guide plate provided on a lower surface of the second plate, and a reinforcing plate coupled to at least a surface of each of the upper and lower guide plates. At least one of the upper and lower guide plates is made of an anodic oxide film material, and as viewed from above, the upper and lower guide plates and the reinforcing plate are configured to have smaller areas than the first and second plates, so that upper and lower surfaces of the first and second plates are exposed.

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