-
公开(公告)号：US20230388712A1
公开(公告)日：2023-11-30
申请号：US18449859
申请日：2023-08-15
Applicant: SHENZHEN SHOKZ CO., LTD.
Inventor： Wenbing ZHOU , Yongshuai YUAN , Wenjun DENG , Yujia HUANG , Xin QI , Fengyun LIAO
Abstract: The present disclosure provides a vibration component. The vibration component may include: a mass element; and an elastic element, the elastic element including a connection region and a first preprocessing region, wherein the connection region is configured to support the mass element; and a deformation quantity of the first preprocessing region is greater than a deformation quantity of a region of the elastic element other than the first preprocessing region when the mass element vibrates.
-
公开(公告)号：US20230353932A1
公开(公告)日：2023-11-02
申请号：US18344905
申请日：2023-06-30
Applicant: SHENZHEN SHOKZ CO., LTD.
Inventor： Wenbing ZHOU , Wenjun DENG , Yongshuai YUAN , Yujia HUANG , Xin QI , Fengyun LIAO
Abstract: One of the embodiments of the present disclosure provides a sensor device, including: a housing and a transducer unit, wherein the housing has an accommodating cavity inside, the transducer unit includes a vibration pickup structure configured to pick up a vibration of the housing and produce an electrical signal, and the transducer unit in the accommodating cavity separates the accommodating cavity to form a front cavity and a rear cavity on opposite sides of the vibration pickup structure. At least one cavity of the front cavity and the rear cavity is filled with liquid, the liquid is in contact with the vibration pickup structure, and an air cavity is formed between the liquid and the housing.
-
公开(公告)号：US20230349862A1
公开(公告)日：2023-11-02
申请号：US18349120
申请日：2023-07-07
Applicant: SHENZHEN SHOKZ CO., LTD.
Inventor： Wenbing ZHOU , Wenjun DENG , Yongshuai YUAN , Yujia HUANG , Xin QI , Fengyun LIAO
IPC: G01N29/036 , G01N29/24
CPC classification number: G01N29/036 , G01N29/2437 , G01N29/2406 , G01N2291/014 , G01N2291/022
Abstract: The present disclosure provides a sensing device, comprising: a housing, an accommodation cavity being provided inside the housing; a transduction unit, including a vibration-pickup structure used to pick up vibration of the housing to generate an electrical signal, wherein the transduction unit divides the accommodation cavity into a front cavity and a rear cavity located on opposite sides of the vibration-pickup structure, at least one of the front cavity or the rear cavity is filled with liquid, and the liquid is in contact with the vibration-pickup structure; and one or more pipeline structures, each pipeline structure being configured to connect the accommodation cavity to an outside of the housing, the liquid being at least partially located in the one or more pipeline structures.
-
公开(公告)号：US20230300536A1
公开(公告)日：2023-09-21
申请号：US18200798
申请日：2023-05-23
Applicant: Shenzhen Shokz Co., Ltd.
Inventor： Wenjun DENG , Wenbing ZHOU , Yongshuai YUAN
CPC classification number: H04R17/025 , H04R7/20 , H04R19/04 , H10N30/308 , H10N30/50 , H10N30/872
Abstract: A vibration sensor and a microphone are provided. The vibration sensor includes a piezoelectric system and a capacitive system. The piezoelectric system includes a vibration component and a piezoelectric sensing component collecting a first electrical signal generated due to deformation of the vibration component. The capacitive system uses the vibration component in the piezoelectric system as a movable capacitive plate and a fixed substrate opposite to the vibration component to form a capacitive vibration sensor. The deformation of the vibration component changes a distance between the vibration component and the fixed substrate. A capacitive sensing component collects a second electrical signal generated due to the distance change. The capacitive sensing component is disposed in a region where the first electrical signal in the piezoelectric system is low, thereby better using space of the vibration sensor, and enhancing the second electrical signal without affecting output of the first electrical signal.
-
公开(公告)号：US20230188911A1
公开(公告)日：2023-06-15
申请号：US18166497
申请日：2023-02-09
Applicant: SHENZHEN SHOKZ CO., LTD.
Inventor： Wenbing ZHOU , Yongshuai YUAN , Wenjun DENG , Xin QI , Fengyun LIAO
IPC: H04R25/00
CPC classification number: H04R25/606 , H04R2460/13
Abstract: The present disclosure is of a bone conduction sound transmission device. The bone conduction sound transmission device comprises a laminated structure and a base structure. The laminated structure is formed by a vibration unit and an acoustic transducer unit. A base structure is configured to load the laminated structure, and at least one side of the laminated structure is physically connected to the base structure. The base structure vibrates based on an external vibration signal, and the vibration unit deforms in response to the vibration of the base structure; and the acoustic transducer unit generates an electrical signal based on the deformation of the vibration unit.
-
Patent Agency Ranking
公开(公告)号：US20230049441A1
公开(公告)日：2023-02-16
申请号：US17814222
申请日：2022-07-21
Applicant: SHENZHEN SHOKZ CO., LTD.
Inventor： Yongshuai YUAN , Wenjun DENG , Wenbing ZHOU , Yujia HUANG , Fengyun LIAO , Xin QI
Abstract: The embodiments of the present disclosure disclose a system and method. The system may include at least one storage device configured to storage computer instruction; and at least one processor, in communication with the storage device. When executing the computer instructions, the at least one processor is configured to direct the system to perform operations including: obtaining a sensing signal of at least one sensing device; identifying a signal feature of the sensing signal; and determining, based on the signal feature, an operation of a target object associated with the at least one sensing device.
-
公开(公告)号：US20230047687A1
公开(公告)日：2023-02-16
申请号：US17816019
申请日：2022-07-29
Applicant: SHENZHEN SHOKZ CO., LTD.
Inventor： Wenbing ZHOU , Yujia HUANG , Yongshuai YUAN , Wenjun DENG , Xin QI , Fengyun LIAO
Abstract: The present disclosure may provide a microphone. The microphone may include: a shell structure and a vibration pickup portion, wherein the vibration pickup portion may generate vibration in response to vibration of the shell structure; the vibration transmission portion may be configured to transmit the vibration generated by the vibration pickup portion; and an acoustic-electric conversion component configured to receive the vibration transmitted by the vibration transmission portion to generate an electrical signal, wherein the vibration transmission portion and at least a portion of vibration pickup portion may form a vacuum cavity, and the acoustic-electric conversion component may be located in the vacuum cavity.
-
公开(公告)号：US20220341964A1
公开(公告)日：2022-10-27
申请号：US17812176
申请日：2022-07-13
Applicant: SHENZHEN SHOKZ CO., LTD.
Inventor： Wenbing ZHOU , Wenjun DENG , Yongshuai YUAN , Yujia HUANG , Xin QI , Fengyun LIAO
IPC: G01P15/125 , G01P1/02
Abstract: The present disclosure discloses an acoustic device and a support assembly. The support assembly may include a shell configured to provide a space for accommodating one or more components of the acoustic device. The support assembly may further include an interaction assembly configured to realize an interaction between a user and the acoustic device, wherein the interaction assembly include a first component and one or more second components, in response to receiving an operation of the user, the first component is configured to trigger at least one of the one or more second components to cause the acoustic device to perform a function corresponding to the at least one of the one or more second components.
-
公开(公告)号：US20250097622A1
公开(公告)日：2025-03-20
申请号：US18963742
申请日：2024-11-28
Applicant: SHENZHEN SHOKZ CO., LTD.
Inventor： Wenjun DENG , Yongshuai YUAN , Yujia HUANG , Wenbing ZHOU , Fengyun LIAO , Xin QI
Abstract: Disclosed is an earphone including: two speaker assemblies, a connection member, and a processing circuit. The connection member is configured to connect the two speaker assemblies, and the connection member provides, through a bending deformation, a clamping force for placing the two speaker assemblies on a head of a user, and the connection member includes a housing with an accommodation cavity. A bending sensor is disposed in the accommodating cavity, and the bending sensor is configured to generate a bending signal based on a bending state of the connection member. The processing circuit is configured to determine a placement state of the earphone based on the bending signal. The placement state includes one of a normal wearing state, an abnormal wearing state, or a free placement state.
-
公开(公告)号：US20250088814A1
公开(公告)日：2025-03-13
申请号：US18957926
申请日：2024-11-25
Applicant: SHENZHEN SHOKZ CO., LTD.
Inventor： Wenjun DENG , Yujia HUANG , Yongshuai YUAN , Wenbing ZHOU , Fengyun LIAO , Xin QI
Abstract: Embodiments of the present disclosure provide an acoustic output device, comprising: an acoustic output unit, a contact detection sensor, and a processor. The acoustic output unit includes a vibration unit and a casing, the casing at least including a contact region which is in contact with the face of a user; the contact detection sensor is located at the contact region; and the processor is configured to determine whether the user wears the acoustic output device based on an electrical signal generated when the contact detection sensor is in contact with the face of the user.
-
-
-
-
-
-
-
-
-
Search Results
50
records
(took 0.021 seconds)
