公开(公告)号：US20180048359A1

公开(公告)日：2018-02-15

申请号：US15792017

申请日：2017-10-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaehyung KIM ,  Jae-Ho LIM ,  Hosaeng KIM ,  Jesun MOON ,  Sungyeul HONG ,  Kyung-Jong LEE ,  Jinkyu BANG ,  Hanbin LEE ,  Kyung-Bae KO ,  Donghwan KIM ,  Taegyu KIM ,  Jae-Bong CHUN

IPC: H04B7/0404 ,  H04B1/40

CPC classification number: H04B7/0404 ,  H01Q1/2266 ,  H01Q1/24 ,  H01Q1/243 ,  H01Q1/42 ,  H01Q13/10 ,  H04B1/40 ,  H04M1/0216 ,  H04M1/0235 ,  H04M1/026 ,  H04M1/0266 ,  H04M1/0268 ,  H04M2250/16

Abstract: An electronic device is provided. The electronic device includes a first housing a second housing, a first display disposed on the first housing and a second display disposed on the second housing, a connecting member configured to couple the first housing to the second housing such that the first housing and the second housing are foldable relative to each other, and the second surface and the fourth surface face each other when the first housing and the second housing are folded toward each other, a first conductive element disposed within the first housing and between the second surface and the first display, and an intermediate conductive plate disposed within the second housing and between the fourth surface and the second display, the intermediate conductive plate having an opening that faces the first conductive element when the first housing and the second housing are in a folded configuration.

公开(公告)号：US20240258699A1

公开(公告)日：2024-08-01

申请号：US18612494

申请日：2024-03-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sumin YUN ,  Hosaeng KIM ,  Seongjin PARK ,  Woomin JANG ,  Jehun JONG ,  Jaehoon JO

IPC: H01Q9/04 ,  H01Q1/24 ,  H01Q1/44

CPC classification number: H01Q9/0421 ,  H01Q1/44 ,  H01Q1/243

Abstract: An electronic device is provided that includes a housing, an antenna structure, an electronic component, and a wireless communication circuit. The antenna structure includes a substrate, at least one conductive patch disposed at the substrate, at least one power feeder disposed at a position of the at least one conductive patch, and at least one electrical connection structure. The at least one electrical connection structure includes a first conductive via disposed to pass through the at least one conductive patch and a ground layer of the substrate, and a second conductive via passing through the at least one conductive patch and electrically connected to the ground layer. The electronic component is disposed to overlap at least in part with the at least one conductive patch when the substrate is viewed from above, and is electrically connected to a main board through the at least one electrical connection structure. The wireless communication circuit is electrically connected to the at least one power feeder, and is configured to form a beam pattern in a first direction through the at least one conductive patch.

公开(公告)号：US20240039151A1

公开(公告)日：2024-02-01

申请号：US18482415

申请日：2023-10-06

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  POSTECH RESEARCH AND BUSINESS DEVELOPMENT FOUNDATION

Inventor： Wonbin HONG ,  Sumin YUN ,  Jaehoon JO ,  Dongkwon CHOI ,  Hosaeng KIM

IPC: H01Q3/26 ,  H01Q21/06

CPC classification number: H01Q3/26 ,  H01Q21/06 ,  H01Q23/00

Abstract: An example electronic device may include a memory; a processor; a communication circuit; an input/output expander (I/O expander); and an array antenna. The processor may control to store an input/output table in the memory and to radiate an RF signal through the array antenna based on the input/output table.

公开(公告)号：US20230411869A1

公开(公告)日：2023-12-21

申请号：US17687882

申请日：2022-03-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Woomin JANG ,  Hosaeng KIM ,  Seongjin PARK ,  Sumin YUN ,  Jehun JONG ,  Jaehoon JO ,  Jinwoo JUNG ,  Jaebong CHUN

IPC: H01Q21/06 ,  H01Q1/24 ,  H01Q1/38

CPC classification number: H01Q21/065 ,  H01Q1/243 ,  H01Q1/38

Abstract: According to various embodiments, an electronic device may include: a housing, an antenna structure disposed in the inner space of the housing, wherein the antenna structure includes: a substrate including a first substrate and a second substrate surface oriented in a direction opposite to the first substrate surface, and a first array antenna including a plurality of first chip antennas disposed at a specified interval in a first region of the first substrate surface, and a first wireless communication circuit disposed in the inner space and configured to transmit and/or receive a wireless signal of a first frequency band via the first array antenna.

公开(公告)号：US20230223695A1

公开(公告)日：2023-07-13

申请号：US18173337

申请日：2023-02-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sumin YUN ,  Soonheung KWON ,  Hosaeng KIM ,  Hyungjoo LEE

IPC: H01Q9/04 ,  H01Q1/24

CPC classification number: H01Q9/0407 ,  H01Q1/243

Abstract: An electronic device is provided. The electronic device includes a first conductive patch, a second conductive patch, a third conductive patch, and a wireless communication circuit. The first conductive patch includes a first edge facing the second conductive patch, a second edge perpendicularly meeting the first edge at a first corner, a third edge parallel to the first edge, and a fourth edge that is parallel to the second edge and perpendicularly meets the third edge at a second corner. The second conductive patch and the third conductive patch each have a shape identical to that of the first conductive patch. The wireless communication circuit feed power to a first point of the first edge, a second point of a fifth edge of the second conductive patch, and a third point of a sixth edge of the third conductive patch.

公开(公告)号：US20230090826A1

公开(公告)日：2023-03-23

申请号：US17994233

申请日：2022-11-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seongjin PARK ,  Bumjin CHO ,  Yoonjung KIM ,  Hosaeng KIM ,  Jaehoon JO ,  Jinwoo JUNG

IPC: H01Q1/24 ,  H01Q25/00 ,  H01Q9/04

Abstract: An electronic device is provided. The electronic device includes a first frame, a first opening formed in one area of the first frame, a first antenna that includes a first printed circuit board including first conductive patches, a first dielectric material that is disposed in the first opening and has a first dielectric constant, a second dielectric material disposed between the first dielectric material and the first conductive patches, and a wireless communication circuit that is electrically connected to the first antenna, wherein the second dielectric material may have a second dielectric constant that is lower than the first dielectric constant of the first dielectric material, and the wireless communication circuit may be configured to feed power to the first conductive patches to transmit and/or receive a signal in a frequency band of 10 gigahertz (GHz) or higher.

公开(公告)号：US20230089687A1

公开(公告)日：2023-03-23

申请号：US17955770

申请日：2022-09-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Soonheung KWON ,  Sumin YUN ,  Hosaeng KIM ,  Hyunjeong LEE ,  Hyungjoo LEE

IPC: H01Q1/24 ,  H01Q5/25 ,  H01Q1/48 ,  H01Q9/04 ,  H01Q5/307

Abstract: An electronic device includes a housing providing a front surface and a rear surface, an antenna including a printed circuit board within the housing and including a first surface facing the front surface and a second surface facing the rear surface. The printed circuit board includes a first conductive layer including a first antenna element and a second antenna element that do not overlap each other when viewed from above the first surface, a second conductive layer operating as a ground plane, and a dielectric between the first and second conductive layers. A conductive pattern is located between the front surface and the second surface when the first surface faces the rear surface and is located between the rear surface and the second surface when the first surface faces the front surface. The conductive pattern overlaps a part of the second conductive layer when viewed from above the first surface.

公开(公告)号：US20220336967A1

公开(公告)日：2022-10-20

申请号：US17719029

申请日：2022-04-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seongjin PARK ,  Hosaeng KIM ,  Sumin YUN ,  Woomin JANG ,  Jaehoon JO ,  Jinwoo JUNG

IPC: H01Q21/24 ,  H01Q5/307

Abstract: Disclosed is an electronic device including a housing, a wireless communication module, and an antenna module operatively connected to the wireless communication module and disposed inside the housing, wherein the antenna module includes a first substrate comprising at least one feed line, a first surface disposed in a first direction, and a second surface disposed in a second direction opposite the first surface, a second substrate disposed on the first surface of the first substrate and having a first antenna array and a second antenna array disposed on the second substrate, and a third substrate disposed in a portion of the second surface of the first substrate and having a third antenna array and a fourth antenna array disposed on the third substrate, wherein the second substrate and/or the third substrate is formed of a material having a higher permittivity than the first substrate.

公开(公告)号：US20220336962A1

公开(公告)日：2022-10-20

申请号：US17859597

申请日：2022-07-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seongjin PARK ,  Dongyeon KIM ,  Hosaeng KIM ,  Sumin YUN ,  Woomin JANG ,  Myunghun JEONG ,  Jehun JONG ,  Jaehoon JO

IPC: H01Q21/00 ,  H01Q5/35 ,  H01Q1/24 ,  H01Q9/04 ,  H01Q21/06 ,  H01Q21/24

Abstract: An electronic device is provided. The electronic devices includes a housing at least partially including a conductive portion, an antenna structure including a printed circuit board including a plurality of insulating layers, at least one first conductive patch including a first feeding point, and a second feeding point, and at least one second conductive patch including a third feeding point, and a fourth feeding point, and an antenna module including a wireless communication circuit configured to transmit or receive a first signal through the at least one first conductive patch and to transmit or receive a second signal of a second frequency band through the at least one second conductive patch.

公开(公告)号：US20220285854A1

公开(公告)日：2022-09-08

申请号：US17748670

申请日：2022-05-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Donghun SHIN ,  Mincheol SEO ,  Hosaeng KIM ,  Yoonjae LEE ,  Byungman LIM ,  Jaebong CHUN

IPC: H01Q21/06 ,  H01Q1/38

Abstract: An electronic device including an antenna and a conductive pattern formed around the antenna is provided. The electronic device includes a housing including a first plate, a second plate facing away from the first plate, and a side member surrounding a space between the first plate and the second plate, connected to the second plate or integrally formed with the second plate, and including a conductive material, an injection-molding material disposed in the space between the first plate and the second plate in the housing and formed of a non-conductive material, an antenna module including conductive radiators and supported by the injection-molding material, and a conductive pattern disposed on a first surface adjacent to the second plate of the injection-molding material or disposed inside the injection-molding material and disposed adjacent to a part of an edge of the antenna module corresponding to a boundary between the antenna module and the injection-molding material when viewed from the second plate in a direction of the first plate. A partial conductive radiator of the conductive radiators may be disposed to transmit and/or receive a signal through the second plate.