公开(公告)号：US20190166686A1

公开(公告)日：2019-05-30

申请号：US16200401

申请日：2018-11-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaehoon JO ,  Sehyun PARK ,  Sumin YUN ,  Myunghun JEONG ,  Jehun JONG ,  Jinwoo JUNG ,  Jaebong CHUN ,  Eunseok HONG

IPC: H05K1/02 ,  H01Q1/22 ,  H01Q1/38

Abstract: According to various embodiments of the present disclosure, an electronic device may include: a housing including a first plate and a second plate; a printed circuit board having a first surface and a second surface; and a communication circuit arranged inside the housing. The printed circuit board may include: a plurality of insulating layers laminated on each other between the first surface and the second surface; an antenna element arranged in a first region above the second surface of the printed circuit board or between a first pair of insulating layers of the printed circuit board, when seen from above the second surface of the printed circuit board; and a plurality of first electroconductive patterns arranged in a second region that at least surrounds one surface of the first region. Various embodiments may be possible.