公开(公告)号：US06350980B1

公开(公告)日：2002-02-26

申请号：US09385123

申请日：1999-08-27

Applicant: David D. Bohn

Inventor： David D. Bohn

IPC: G01N2186

CPC classification number: H04N1/0312 ,  H04N1/0311 ,  H04N1/0314 ,  H04N1/107 ,  H04N2201/02456 ,  H04N2201/02458 ,  H04N2201/0247 ,  H04N2201/02485 ,  H04N2201/0471 ,  H04N2201/04713 ,  H04N2201/04734

Abstract: An optical imaging assembly comprises a mounting surface and at least one semiconductor die having a face and an edge portion. The edge portion of the at least one semiconductor die is mounted to the mounting surface. A light sensitive optical detector is located on the face of the at least one semiconductor die. An optical system is mounted to the mounting surface adjacent the at least one semiconductor die.

Abstract translation: 光学成像组件包括安装表面和至少一个具有面和边缘部分的半导体管芯。 至少一个半导体管芯的边缘部分安装到安装表面。 光敏光学检测器位于至少一个半导体管芯的表面上。 光学系统安装到邻近至少一个半导体管芯的安装表面。