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    THERMALLY CURABLE COMPOSITE RESIN COMPOSITION, PREPREG, COMPOSITE FILM AND LAMINATED MATERIAL FOR CIRCUIT HAVING THE SAME
    34.
    发明申请
    THERMALLY CURABLE COMPOSITE RESIN COMPOSITION, PREPREG, COMPOSITE FILM AND LAMINATED MATERIAL FOR CIRCUIT HAVING THE SAME 有权
    具有相同电路的热固性复合树脂组合物，PREPREG，复合膜和层压材料

    公开(公告)号：US20090011262A1

    公开(公告)日：2009-01-08

    申请号：US11857034

    申请日：2007-09-18

    Applicant: Myong Jae Yoo ,  Woo Sung Lee ,  Seong Dae Park ,  Se Hoon Park

    Inventor： Myong Jae Yoo ,  Woo Sung Lee ,  Seong Dae Park ,  Se Hoon Park

    IPC: B32B27/34 ,  C08K3/04 ,  C08K3/10 ,  C08L39/04

    CPC classification number: H05K1/0353 ,  C08F222/40 ,  C08G73/126 ,  C08L79/085 ,  H05K2201/0158 ,  Y10T428/31721

    Abstract: The present invention relates to a prepreg, a composite film, and a laminated material for circuit used for thermosetting composite resin compositions and printed circuit boards, and particularly to a thermosetting composite resin composition mixed with COP (Cyclo Olefin Polymer) and thermally cross-linkable resin, wherein the COP having excellent electrical characteristics at a high frequency and thermally cross-linkable resin are blended to allow having a less dielectric constant and a less dielectric loss than those of the conventional composite resin composition, and inorganic fillers such as ceramic material, metal material, carbon black are added to allow having dielectric characteristics covering from a low dielectric constant to a high dielectric constant.

    Abstract translation: 本发明涉及用于热固性复合树脂组合物和印刷电路板的预浸料，复合膜和电路用层压材料，特别涉及与COP（环烯烃聚合物）和热交联性混合物的热固性复合树脂组合物 树脂，其中在高频率和可热交联的树脂上具有优异电特性的COP被共混以允许具有比常规复合树脂组合物更低的介电常数和更低的介电损耗，以及无机填料如陶瓷材料， 添加金属材料，炭黑以允许具有从低介电常数到高介电常数的介电特性。

    Method of Forming a Low Dielectric Loss Composite Material
    35.
    发明申请
    Method of Forming a Low Dielectric Loss Composite Material 审中-公开
    形成低介电损耗复合材料的方法

    公开(公告)号：US20080188153A1

    公开(公告)日：2008-08-07

    申请号：US11671722

    申请日：2007-02-06

    Applicant: Brian G. Morin

    Inventor： Brian G. Morin

    IPC: B32B5/22

    CPC classification number: B32B5/10 ,  B32B5/22 ,  H05K1/0366 ,  H05K3/022 ,  H05K2201/0129 ,  H05K2201/0158 ,  H05K2201/0278 ,  Y10T442/2475

    Abstract: Disclosed are composite materials that can exhibit low transmission energy loss and can also be temperature resistant. The composites include reinforcement fibers held in a polymeric matrix. The polymeric matrix can include an amorphous polymer component. Also disclosed are methods of forming the composites. Methods can include forming amorphous thermoplastic polymer fibers, forming a fabric from the fibers, combining the fabric with reinforcement fibers, and molding the structure thus formed under heat and pressure such that the amorphous thermoplastic polymer flows and forms a polymeric matrix incorporating the reinforcement fibers. The composites can be molded from multi-layer structures that can include layers of differing materials, for instance layers formed of polyaramids, fiberglass, or carbon fiber wovens or nonwovens. The composites can advantageously be utilized in low loss dielectric applications, such as in forming circuit board substrates, radomes, antennas, and the like.

    Abstract translation: 公开了可以表现出低的透射能量损失并且也可以是耐温的复合材料。 复合材料包括保持在聚合物基质中的增强纤维。 聚合物基质可以包括无定形聚合物组分。 还公开了形成复合材料的方法。 方法可以包括形成无定形热塑性聚合物纤维，从纤维形成织物，将织物与增强纤维相结合，以及在热和压力下模制由此形成的结构，使得无定型热塑性聚合物流动并形成结合增强纤维的聚合物基体。 复合材料可以由可以包括不同材料的层的多层结构模制，例如由聚芳酰胺，玻璃纤维或碳纤维织物或无纺布形成的层。 复合材料可有利地用于低损耗介电应用中，例如形成电路板基板，天线罩，天线等。

    Assemblies useful for the preparation of electronic components and methods for making same
    36.
    发明申请
    Assemblies useful for the preparation of electronic components and methods for making same 审中-公开
    用于制备电子部件的组件及其制造方法

    公开(公告)号：US20080009211A1

    公开(公告)日：2008-01-10

    申请号：US11482537

    申请日：2006-07-07

    Applicant: Matthew Raymond Himes ,  John Charles Frankosky

    Inventor： Matthew Raymond Himes ,  John Charles Frankosky

    IPC: D03D15/00

    CPC classification number: D03D15/02 ,  B32B27/08 ,  D03D1/0082 ,  H05K1/024 ,  H05K1/036 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/0129 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0278 ,  Y10T442/30

    Abstract: In accordance with the present invention, assemblies have been developed which are useful for a variety of applications, e.g., in RF applications where low electrical loss products are desirable, e.g., in cellular communications, RF antennas, satellite communications, radar, power amplifiers, high speed digital applications, laminate-based chip carriers, and the like. Invention assemblies comprise a combination of a first reinforced thermoplastic-containing layer and a first non-reinforced thermoplastic-containing layer, wherein the reinforced and non-reinforced thermoplastic-containing layers are capable of forming a bond (e.g., a cohesive or adhesive bond) therebetween, thereby providing performance properties (e.g., electrical performance and cladding bond strength) that are superior to the performance properties of either material alone. The reinforced thermoplastic-containing layer can include a porous substrate impregnated with a composition comprising: a first component (i.e., a low loss, low dielectric constant, hydrocarbyl thermoplastic), a second component (i.e., a component able to crosslink and produce a thermoset in the presence of the first component), and a free radical source. Also provided in accordance with the present invention are methods for preparing the above-described assemblies.

    Abstract translation: 根据本发明，已经开发了可用于各种应用的组件，例如在需要低电损耗产品的RF应用中，例如在蜂窝通信，RF天线，卫星通信，雷达，功率放大器， 高速数字应用，基于层叠体的芯片载体等。 发明组件包括第一增强的含热塑性材料层和第一非增强的含热塑性层的组合，其中增强和非增强的含热塑性材料的层能够形成结合（例如，粘结或粘结粘合） 从而提供优于单独的任一材料的性能的性能（例如，电性能和包层粘合强度）。 增强的含热塑性材料层可以包括浸渍有组合物的多孔基材，所述组合物包含：第一组分（即低损耗，低介电常数，烃基热塑性塑料），第二组分（即，能够交联和产生热固性材料的组分 在第一组分的存在下）和自由基源。 根据本发明还提供了用于制备上述组件的方法。

    Composite materials including amorphous thermoplastic fibers
    37.
    发明申请
    Composite materials including amorphous thermoplastic fibers 有权
    复合材料包括无定形热塑性纤维

    公开(公告)号：US20070292674A1

    公开(公告)日：2007-12-20

    申请号：US11453502

    申请日：2006-06-15

    Applicant: Brian G. Morin

    Inventor： Brian G. Morin

    IPC: D04H13/00 ,  B32B27/04 ,  B32B17/02 ,  B32B27/00 ,  B32B27/12 ,  H01Q1/42

    CPC classification number: B32B27/02 ,  C08J5/043 ,  C08J5/048 ,  H05K1/0366 ,  H05K2201/0158 ,  H05K2201/0278 ,  H05K2201/029 ,  Y10T428/249924 ,  Y10T428/24994 ,  Y10T428/249946 ,  Y10T428/249947 ,  Y10T428/249949 ,  Y10T428/24995 ,  Y10T428/249952

    Abstract: Disclosed are composites that can exhibit low transmission energy loss and can also be temperature resistant. The composites include reinforcement fibers held in a polymeric matrix. The reinforcement fibers can include an amorphous polymer component. The fibers can be woven or knit to form a fabric or can be included in a nonwoven fabric. The composites can include other fibers as well, such as fiberglass. The composites can be multi-layer structures and can include layers of other materials, for instance layers formed of polyaramids, fiberglass, or carbon fiber wovens or nonwovens. The composites can advantageously be utilized in low loss dielectric applications, such as in forming circuit board substrates.

    Abstract translation: 公开了可以表现出低的传输能量损失并且也可以是耐温的复合材料。 复合材料包括保持在聚合物基质中的增强纤维。 增强纤维可以包括无定形聚合物组分。 纤维可以编织或编织以形成织物或可以包括在无纺织物中。 复合材料也可以包括其它纤维，例如玻璃纤维。 复合材料可以是多层结构，并且可以包括其它材料的层，例如由聚芳酰胺，玻璃纤维或碳纤维织物或无纺布形成的层。 复合材料可以有利地用于低损耗介电应用中，例如在形成电路板基底时。

    Low dielectric composite materials including high modulus polyolefin fibers
    38.
    发明申请
    Low dielectric composite materials including high modulus polyolefin fibers 有权
    低介电复合材料包括高模量聚烯烃纤维

    公开(公告)号：US20070290942A1

    公开(公告)日：2007-12-20

    申请号：US11205662

    申请日：2005-08-17

    Applicant: Brian Morin

    Inventor： Brian Morin

    IPC: D03D15/00 ,  A01K1/015 ,  B32B5/26 ,  B32B27/12 ,  D04H13/00 ,  D02G3/00 ,  B32B9/00 ,  H01Q1/42

    CPC classification number: H05K1/0366 ,  B29K2223/12 ,  B32B5/28 ,  H01Q1/422 ,  H05K1/024 ,  H05K2201/0158 ,  H05K2201/0278 ,  Y10T428/249921 ,  Y10T428/249924 ,  Y10T428/2913 ,  Y10T428/2964 ,  Y10T442/3065 ,  Y10T442/3707 ,  Y10T442/3854 ,  Y10T442/3886

    Abstract: Disclosed are composite laminates that can exhibit high strength and/or low dielectric loss and can also be lightweight. The laminates include layers formed of high modulus polyolefin fiber. The fibers can be woven or knit to form a fabric or can be included in a nonwoven fabric that can be one or more layers of the composite structures. The layers including the high modulus polyolefin fibers can include other fibers, such as fiberglass. The composites can also include layers of other materials, for instance layers formed of polyaramids, fiberglass, or carbon fiber wovens or nonwovens. The composites can advantageously be utilized in low loss dielectric applications, such as in forming circuit board substrates, or in applications beneficially combining strength with low weight, such as automobile and boat materials.

    Abstract translation: 公开了可以表现出高强度和/或低介电损耗并且也可以是轻质的复合层压板。 层压体包括由高模量聚烯烃纤维形成的层。 纤维可以被编织或编织以形成织物，或者可以包括在可以是一层或多层复合结构的非织造织物中。 包括高模量聚烯烃纤维的层可以包括其它纤维，例如玻璃纤维。 复合材料还可以包括其它材料层，例如由聚芳酰胺，玻璃纤维或碳纤维织物或无纺布形成的层。 复合材料可以有利地用于低损耗介电应用中，例如在形成电路板基板或有利地结合低重量的强度的应用中，例如汽车和船用材料。

    PREPREG AND CONDUCTIVE LAYER-LAMINATED SUBSTRATE FOR PRINTED WIRING BOARD
    39.
    发明申请
    PREPREG AND CONDUCTIVE LAYER-LAMINATED SUBSTRATE FOR PRINTED WIRING BOARD 有权
    印刷电路板的导电层和导电层叠基板

    公开(公告)号：US20070281566A1

    公开(公告)日：2007-12-06

    申请号：US11755374

    申请日：2007-05-30

    Applicant: Toshihiro Ohta ,  Tomiho Yamada ,  Shigeru Asami

    Inventor： Toshihiro Ohta ,  Tomiho Yamada ,  Shigeru Asami

    IPC: B32B17/02 ,  B22F7/02

    CPC classification number: C08J5/24 ,  B32B15/08 ,  B32B27/04 ,  B32B27/12 ,  C08J2351/04 ,  C08L51/006 ,  H05K1/0326 ,  H05K1/036 ,  H05K1/0366 ,  H05K2201/0158 ,  Y10S428/901 ,  Y10T428/12028 ,  Y10T428/24917 ,  Y10T428/24994 ,  Y10T442/2992 ,  C08L2666/02

    Abstract: A prepreg having low dielectric constant, low dielectric loss, and high heat cycle resistance. The prepreg includes a sheet-like preform and a resin-impregnated, sheet-like, fiber-reinforced material thermal pressure adhered to the sheet-like preform. The sheet-like preform includes a graft copolymer (a) in which 15 to 40 parts by mass of an aromatic vinyl monomer are grafted to 60 to 85 parts by mass of a random or block copolymer comprising monomer units selected from nonpolar α-olefin monomers and nonpolar conjugated diene monomers. The resin-impregnated, sheet-like, fiber-reinforced material includes a sheet-like, fiber-reinforced material (b1) and a thermoplastic resin (b2) into which the sheet-like, fiber-reinforced material (b1) is impregnated. The thermoplastic resin (b2) is a random or block copolymer composed of 60 to 90 mass % of a monomer unit, which is selected from nonpolar α-olefin monomers and nonpolar conjugated diene monomers, and 10 to 40 mass % of an aromatic vinyl monomer unit.

    Abstract translation: 具有低介电常数，低介电损耗和高耐热循环电阻的预浸料。 预浸料包括片状预成型体和粘附到片状预成型体上的树脂浸渍的片状纤维增强材料的热压力。 片状预成型体包括接枝共聚物（a），其中将15〜40质量份芳族乙烯基单体接枝到60〜85质量份的包含选自非极性α-烯烃单体的单体单元的无规或嵌段共聚物 和非极性共轭二烯单体。 树脂浸渍的片状纤维增强材料包括片状纤维增强材料（b 1）和热塑性树脂（b 2），片状纤维增强材料（b 1） 被浸渍。 热塑性树脂（b 2）是由60〜90质量％的选自非极性α-烯烃单体和非极性共轭二烯单体的单体单元和10〜40质量％的芳香族乙烯基组成的无规嵌段共聚物 单体单元。

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