公开(公告)号：US20110088770A1

公开(公告)日：2011-04-21

申请号：US12905664

申请日：2010-10-15

Applicant: Pierre-Marc Allemand ,  Haixia Dai ,  Shuo Na ,  Hash Pakbaz ,  Florian Pschenitzka ,  Xina Quan ,  Jelena Sepa ,  Michael A. Spaid

Inventor： Pierre-Marc Allemand ,  Haixia Dai ,  Shuo Na ,  Hash Pakbaz ,  Florian Pschenitzka ,  Xina Quan ,  Jelena Sepa ,  Michael A. Spaid

IPC: H01L31/0224 ,  H01L33/00 ,  H01B11/06 ,  G02B5/22 ,  G02F1/1368 ,  H01J17/49 ,  H01J1/62 ,  H01L31/18 ,  B05D5/12 ,  B82Y20/00

CPC classification number: H01L31/022425 ,  B82Y10/00 ,  B82Y20/00 ,  B82Y30/00 ,  G02F1/13439 ,  H01B1/02 ,  H01L27/1421 ,  H01L29/0669 ,  H01L29/413 ,  H01L31/022466 ,  H01L31/068 ,  H01L31/0687 ,  H01L31/1884 ,  H01L33/38 ,  H01L33/40 ,  H01L51/0021 ,  H01L51/0048 ,  H01L51/102 ,  H01L51/5206 ,  H01L51/5212 ,  H05K1/095 ,  H05K1/097 ,  H05K3/06 ,  H05K3/245 ,  H05K3/249 ,  H05K9/009 ,  H05K9/0092 ,  H05K2201/0108 ,  H05K2201/0248 ,  H05K2201/0257 ,  H05K2201/026 ,  Y02E10/549 ,  Y02P70/521 ,  Y10S977/95 ,  Y10T29/49155

Abstract: A transparent conductor including a conductive layer coated on a substrate is described. More specifically, the conductive layer comprises a network of nanowires that may be embedded in a matrix. The conductive layer is optically clear, patternable and is suitable as a transparent electrode in visual display devices such as touch screens, liquid crystal displays, plasma display panels and the like.

公开(公告)号：US20100147697A1

公开(公告)日：2010-06-17

申请号：US12703723

申请日：2010-02-10

Applicant: Lex Kosowsky ,  Robert Fleming

Inventor： Lex Kosowsky ,  Robert Fleming

IPC: C25D9/00

CPC classification number: H01C7/1006 ,  B82Y10/00 ,  H01B1/22 ,  H01B1/24 ,  H01C7/105 ,  H01C17/0652 ,  H05K1/0257 ,  H05K1/0259 ,  H05K1/0373 ,  H05K1/167 ,  H05K3/188 ,  H05K2201/0248 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2201/0272 ,  H05K2201/0738 ,  H05K2203/0723 ,  H05K2203/105 ,  Y10S977/742 ,  Y10S977/779 ,  Y10T428/30 ,  Y10T428/31678

Abstract: One or more embodiments provide for a device that utilizes voltage switchable dielectric material having semi-conductive or conductive materials that have a relatively high aspect ratio for purpose of enhancing mechanical and electrical characteristics of the VSD material on the device.

Abstract translation: 一个或多个实施例提供了一种使用具有半导体或导电材料的电压可切换介电材料的器件，该器件具有相对较高的纵横比，以便增强器件上的VSD材料的机械和电学特性。

公开(公告)号：US20100139956A1

公开(公告)日：2010-06-10

申请号：US12703674

申请日：2010-02-10

Applicant: Lex Kosowsky ,  Robert Fleming

Inventor： Lex Kosowsky ,  Robert Fleming

IPC: H05K1/09 ,  H01B1/00 ,  H01B1/04

CPC classification number: H01C7/1006 ,  B82Y10/00 ,  H01B1/22 ,  H01B1/24 ,  H01C7/105 ,  H01C17/0652 ,  H05K1/0257 ,  H05K1/0259 ,  H05K1/0373 ,  H05K1/167 ,  H05K3/188 ,  H05K2201/0248 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2201/0272 ,  H05K2201/0738 ,  H05K2203/0723 ,  H05K2203/105 ,  Y10S977/742 ,  Y10S977/779 ,  Y10T428/30 ,  Y10T428/31678

Abstract: One or more embodiments provide for a device that utilizes voltage switchable dielectric material having semi-conductive or conductive materials that have a relatively high aspect ratio for purpose of enhancing mechanical and electrical characteristics of the VSD material on the device.

Abstract translation: 一个或多个实施例提供了一种使用具有半导体或导电材料的电压可切换介电材料的器件，该器件具有相对较高的纵横比，以便增强器件上的VSD材料的机械和电学特性。

公开(公告)号：US07592045B2

公开(公告)日：2009-09-22

申请号：US11397000

申请日：2006-04-03

Applicant: James D. B. Smith ,  Gary Stevens ,  John W. Wood

Inventor： James D. B. Smith ,  Gary Stevens ,  John W. Wood

IPC: B05D5/00

CPC classification number: H05K1/0373 ,  C08K3/00 ,  C08K9/00 ,  H01F27/2871 ,  H01F41/127 ,  H01L21/316 ,  H02K3/40 ,  H02K9/22 ,  H05K2201/0209 ,  H05K2201/0248

Abstract: In one embodiment the present invention provides for a method of forming HTC dendritic fillers 40 within a host resin matrix that comprises adding HTC seeds 42 to the host resin matrix. The HTC seeds have been surface functionalized to not substantially react with one another. The seeds then accumulate HTC building blocks 42, and the HTC building blocks have also been surface functionalized to not substantially react with one another. Then assembling the HTC building blocks with the HTC seeds to produce HTC dendritic fillers 40 within the host resin matrix.

Abstract translation: 在一个实施方案中，本发明提供了在主体树脂基质内形成HTC树枝状填料40的方法，其包括将HTC种子42加入到主体树脂基质中。 HTC种子已经被表面官能化以基本上不相互反应。 然后，种子积聚HTC构件块42，并且HTC构建块也被表面功能化以基本上不相互反应。 然后将HTC构建块与HTC种子组装，以在主体树脂基质内产生HTC树枝状填料40。

公开(公告)号：US20070158824A1

公开(公告)日：2007-07-12

申请号：US11647341

申请日：2006-12-29

Applicant: Chia-Liang Hsu

Inventor： Chia-Liang Hsu

IPC: H01L23/053

CPC classification number: H01L23/142 ,  B22F2998/00 ,  H01L23/367 ,  H01L23/3733 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/053 ,  H05K1/056 ,  H05K1/182 ,  H05K2201/0209 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/0251 ,  B22F1/004 ,  B22F1/0007 ,  B22F1/0055 ,  H01L2924/00

Abstract: This invention relates to a hybrid composite material substrate. The substrate includes a conductive layer, an insulating layer, and a dispersion material extending from the conductive layer into the insulating layer.

Abstract translation: 本发明涉及混合复合材料基板。 衬底包括导电层，绝缘层和从导电层延伸到绝缘层中的分散材料。

公开(公告)号：US20070114704A1

公开(公告)日：2007-05-24

申请号：US11656727

申请日：2007-01-23

Applicant: Gary Stevens ,  James Smith ,  John Wood

Inventor： Gary Stevens ,  James Smith ,  John Wood

IPC: C04B33/32 ,  B32B3/26 ,  B28B1/00 ,  C04B35/64 ,  C04B33/36 ,  B28B3/00 ,  B28B5/00

CPC classification number: D21H25/005 ,  D21H13/44 ,  D21H17/13 ,  D21H17/20 ,  D21H27/00 ,  H01F27/2871 ,  H01F41/127 ,  H01L21/316 ,  H02K3/40 ,  H02K9/22 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0248 ,  Y10T428/249953

Abstract: A method for the treatment of micro pores (24) within a mica paper (20) that includes obtaining a silane with a molecular weight of between approximately 15 and 300, and adding the silane to the mica paper (20). Then reacting the silane with the inner surface of the micro pores within the mica paper. After this, a resin is impregnated into the mica paper, and the resin binds to the inner surfaces of the micro pores (24) with the mica paper through the silane.

Abstract translation: 一种用于处理云母纸（20）内的微孔（24）的方法，其包括获得分子量为约15至300的硅烷，并将硅烷加入到云母纸（20）中。 然后使硅烷与云母纸内微孔的内表面反应。 此后，将树脂浸渍到云母纸中，并且树脂通过硅烷与云母纸结合到微孔（24）的内表面。

公开(公告)号：US07157800B2

公开(公告)日：2007-01-02

申请号：US10936503

申请日：2004-09-09

Applicant: Takeshi Sano ,  Yoshihiro Yoshida ,  Hideaki Ohkura ,  Hirofumi Kobayashi

Inventor： Takeshi Sano ,  Yoshihiro Yoshida ,  Hideaki Ohkura ,  Hirofumi Kobayashi

IPC: H01L23/48

CPC classification number: H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/1329 ,  H01L2224/13339 ,  H01L2224/13344 ,  H01L2224/13347 ,  H01L2224/13355 ,  H01L2224/13369 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2224/81855 ,  H01L2224/81885 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/351 ,  H05K3/321 ,  H05K2201/0248 ,  H05K2201/0272 ,  H05K2201/0379 ,  H05K2203/0425 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/29344 ,  H01L2224/29339 ,  H01L2224/29369 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/2929 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: A disclosed bonded structure includes a first electric structure having a first electrode, a second electric structure having a second electrode, and a middle section for electrically and mechanically bonding the first electrode and the second electrode. The middle section consists of conductive adhesives, wherein fusion bonding of metal particles is provided to at least one of the first electrode and the second electrode. The metal particles are capable of fusion bonding at a temperature lower than a thermal hardening temperature of the conductive adhesives. The conductive adhesives contain conductive filler pieces that have a particle size at which fusion bonding does not take place at a temperature lower than the thermal hardening temperature of the conductive adhesives.

Abstract translation: 所公开的接合结构包括具有第一电极的第一电结构，具有第二电极的第二电结构和用于电和机械地结合第一电极和第二电极的中间部分。 中间部分由导电粘合剂组成，其中金属颗粒的熔融粘合提供给第一电极和第二电极中的至少一个。 金属颗粒能够在低于导电粘合剂的热硬化温度的温度下熔合。 导电性粘合剂含有导电性填料片，其导电性填充片具有在比导电性粘合剂的热硬化温度低的温度下不发生熔融粘结的粒径。

公开(公告)号：US20050074589A1

公开(公告)日：2005-04-07

申请号：US10665335

申请日：2003-09-18

Applicant: Alfred Pan ,  Yoocharn Jeon ,  Scott Haubrich

Inventor： Alfred Pan ,  Yoocharn Jeon ,  Scott Haubrich

IPC: B41M1/06 ,  B41M1/10 ,  B41M1/12 ,  B41M3/00 ,  C09D11/00 ,  H05K1/09 ,  B32B3/00

CPC classification number: H05K1/097 ,  B41M1/06 ,  B41M1/10 ,  B41M1/12 ,  B41M3/006 ,  B82Y30/00 ,  C09D11/30 ,  H01L29/7869 ,  H05K2201/0248 ,  Y10S977/786 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T428/24893

Abstract: Compositions and methods for production of conductive paths can include a printable composition including a liquid carrier and a plurality of nanostructures. The plurality of nanostructures can have an aspect ratio of at least about 5:1 within the liquid carrier. Examples of nanostructures include nanobelts, nanoplates, nanodiscs, nanowires, nanorods, and mixtures of these materials. These printable compositions can be used to form a conductive path on a substrate. The printable composition can be applied to a substrate using any number of conventional printing techniques. Following application of the printable composition, at least a portion of the liquid carrier can be removed such that the nanostructures can be in sufficient contact to provide a conductive path. The nanostructures arranged in a conductive path can be sintered or used as a conductive material without sintering.

Abstract translation: 用于制备导电路径的组合物和方法可以包括可印刷组合物，其包括液体载体和多个纳米结构。 多个纳米结构可以在液体载体内具有至少约5:1的纵横比。 纳米结构的实例包括纳米带，纳米板，纳米棒，纳米线，纳米棒以及这些材料的混合物。 这些可印刷组合物可用于在基材上形成导电路径。 可印刷组合物可以使用任何数量的常规印刷技术施加到基材上。 在施加可印刷组合物之后，可以除去液体载体的至少一部分，使得纳米结构可以充分接触以提供导电路径。 布置在导电路径中的纳米结构可以烧结或用作导电材料而不进行烧结。

公开(公告)号：US06875367B2

公开(公告)日：2005-04-05

申请号：US10696075

申请日：2003-10-28

Applicant: George Hsieh ,  Terrance J. Dishongh ,  Norman J. Armendariz ,  David V. Spaulding

Inventor： George Hsieh ,  Terrance J. Dishongh ,  Norman J. Armendariz ,  David V. Spaulding

IPC: C03C10/02 ,  H05K3/32 ,  H01B1/20 ,  H01L29/43 ,  H01L35/24 ,  C23C38/00

CPC classification number: H05K3/321 ,  H05K2201/0248 ,  H05K2201/083 ,  H05K2201/10636 ,  H05K2203/104 ,  Y02P70/611 ,  Y10T428/2852 ,  Y10T428/2896 ,  Y10T428/32

Abstract: Coupling components to an underlying substrate using a composition of a polymer and magnetic material particles. Upon applying the composition between the component and the printed circuit board, the composition may be subjected to a magnetic field to align the magnetic material particles into a conductive path between the component and the underlying substrate. At the same time the polymer-based material may be cured or otherwise solidified to affix the conductive path formed by the magnetic material particles.

公开(公告)号：US20040163245A1

公开(公告)日：2004-08-26

申请号：US10703122

申请日：2003-11-06

Inventor： James J. deBlanc ,  David Dickey ,  Andrew Michael Cherniski

IPC: H01P003/08 ,  H05K003/02

CPC classification number: H01P3/085 ,  H05K1/024 ,  H05K2201/0248 ,  H05K2201/0278 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49135 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: A circuit board or microelectronic device in which conductive signal lines are suspended or supported by filaments in air, rather than surrounded by a solid dielectric material. Dry air has a low relative permittivity and extremely low loss tangent compared with common dielectric substrates in which signal lines are currently embedded within circuit boards and microelectronic devices. The signal intensity attenuation for filament-suspended or filament-supported signal lines is much lower than signal lines embedded in solid dielectric materials, allowing for transmission of significantly higher frequency signals within filament-suspended and filament-supported signal lines.

Abstract translation: 电路板或微电子器件，其中导电信号线由细丝悬挂或支撑在空气中，而不是被固体电介质材料包围。 与其中信号线当前嵌入电路板和微电子器件的普通介质基板相比，干燥空气具有低的相对介电常数和极低的损耗角正切。 长丝悬挂或灯丝支撑的信号线的信号强度衰减比嵌入固体电介质材料的信号线要低得多，允许在灯丝悬挂和灯丝支持的信号线中传输明显更高的频率信号。