Abstract:
A method for the preparation of graphene is provided, which includes: (a) oxidizing a graphite material to form graphite oxide; (b) dispersing graphite oxide into water to form an aqueous suspension of graphite oxide; (c) adding a dispersing agent to the aqueous suspension of graphite oxide; and (d) adding an acidic reducing agent to the aqueous suspension of graphite oxide, wherein graphite oxide is reduced to graphene by the acidic reducing agent, and graphene is further bonded with the dispersing agent to form a graphene dispersion containing a surface-modified graphene. The present invention provides a method for the preparation of graphene using an acidic reducing agent. The obtained graphene can be homogeneously dispersed in water, an acidic solution, a basic solution, or an organic solution.
Abstract:
A mounting apparatus for a disk drive includes a mounting bracket, a securing element, and an elastic element. The mounting bracket is configured to receive a disk drive. The securing element is slidably mounted to the mounting bracket. The securing element is configured to move between a first position and a second position. Wherein the securing element engages the disk drive in the first position to prevent the disk drive from moving along a first direction. The securing element is disengaged the disk drive in the second position. The elastic element biases the mounting bracket away from the securing element to prevent the securing element from disengaging the disk drive when the securing element is in the first position.
Abstract:
A leadframe enhancing molding compound bondability includes a chip base and a pin holder. The chip bases includes a chip pad and a support, wherein the chip pad includes a side protrusion extending out of the support, and the side protrusion has a lower surface, and the support has a sidewall, and wherein the lower surface and the sidewall interconnect at an intersection line, and the lower surface is formed upwardly with a recess. Further, a pin holder includes a pin stand and a seat, wherein the pin stand has an edge portion extending out of the seat, the edge portion has a lower surface, the seat has a sidewall, and the lower surface and the sidewall interconnect at a crossing line. The lower surface of the pin stand is formed upward with a recess. As such, the bondability between the leadframe and the molding compound can be greatly enhanced.
Abstract:
A handheld electronic device includes a first body, a second body, a flexible electrical connector, and a protection cover. The second body is slidably stacked with the first body. The flexible electrical connector is electrically connected between the first body and the second body. The cover is slidably disposed between the first body and the second body. The cover is at an initial position when the first body and the second body are in a stacked state. The cover shields the flexible electrical connector exposed after the second body moves when the first body and the second body are in a spread state. As a result, the lifetime of the handheld electronic device can be prolonged. Additionally, the available region of the handheld electronic device in the spread state can be increased to provide higher design flexibility.
Abstract:
An expression system for producing a multi-enzyme complex, the system including a nucleic acid molecule containing a promoter operatively linked to a nucleotide sequence including multiple genes encoding multiple enzymes that are components of the multi-enzyme complex.
Abstract:
A multifunctional case includes a base, a cover, and a foldable connecting area connecting the base to the cover, the base defines a receiving space in a front surface for receiving a flat-type electronic device. The cover is substantially the same size as the base and includes a first plate portion, a foldable second plate portion connected to the first plate portion, two foldable third plate portions connected to two sides of the first plate portion, and two foldable fourth plate portions connected to two sides of the second portion. The third plate portions are respectively connected to the fourth plate portions. The cover is foldable relative to the base, the connecting area, and the first through fourth plate portions can cooperatively fold to support the base in a slanted position so that the electronic device is supported in a slanted position.
Abstract:
A heat-dissipating module applied to a circuit board having an electronic element is disclosed. The heat-dissipating module includes a plurality of connecting portions, a contacting portion and a folded portion. The heat-dissipating module is connected to the circuit board by the connecting portions, and a first surface of the contacting portion contacts the electronic element. The folded portion is connected to the contacting portion. The heat-dissipating module is suitable for a thin and light electronic device and has firm structure.