公开(公告)号：US20090002271A1

公开(公告)日：2009-01-01

申请号：US11906773

申请日：2007-10-02

Applicant: Clarence Chui

Inventor： Clarence Chui

IPC: G09G3/00 ,  F21V5/00

CPC classification number: G09G3/005 ,  G09F9/33 ,  G09F9/37 ,  G09F19/12 ,  G09G3/32 ,  G09G2300/026

Abstract: A composite display is disclosed. In some embodiments, a composite display comprises a set of one or more paddles, a plurality of pixel elements installed on each paddle, and an optic configured to substantially collimate light attached to a surface of each pixel element. In some embodiments, a diffuser film is mounted in front of the set of paddles, wherein the diffuser film diffuses incident collimated light from the pixel elements.

Abstract translation: 公开了一种复合显示器。 在一些实施例中，复合显示器包括一组一个或多个桨叶，安装在每个桨叶上的多个像素元件和配置成基本准直附着于每个像素元件表面的光的光学元件。 在一些实施例中，漫射膜安装在该组桨叶的前面，其中漫射膜扩散来自像素元件的入射的准直光。

公开(公告)号：US07443563B2

公开(公告)日：2008-10-28

申请号：US11653088

申请日：2007-01-12

Applicant: Lauren Palmateer ,  Brian J. Gally ,  William J. Cummings ,  Manish Kothari ,  Clarence Chui

Inventor： Lauren Palmateer ,  Brian J. Gally ,  William J. Cummings ,  Manish Kothari ,  Clarence Chui

IPC: G02F1/03

CPC classification number: G02B26/001

Abstract: A package is made of a transparent substrate having an interferometric modulator and a back plate. A non-hermetic seal joins the back plate to the substrate to form a package, and a desiccant resides inside the package. A method of packaging an interferometric modulator includes providing a transparent substrate and manufacturing an interferometric modulator array on a backside of the substrate. A back plate is provided and a desiccant is applied to the back plate. The back plate is sealed to the backside of the substrate with a back seal in ambient conditions, thereby forming a package.

Abstract translation: 封装由具有干涉式调制器和背板的透明基板制成。 非气密密封件将背板连接到基板以形成包装，并且干燥剂驻留在包装内。 封装干涉式调制器的方法包括提供透明衬底并在衬底的背面制造干涉式调制器阵列。 设置背板，并将干燥剂施加到背板上。 背板在环境条件下用背密封件密封到基板的背面，由此形成封装。

公开(公告)号：USRE40436E1

公开(公告)日：2008-07-15

申请号：US11176878

申请日：2005-07-07

Applicant: Manish Kothari ,  Clarence Chui

Inventor： Manish Kothari ,  Clarence Chui

IPC: B32B3/10

CPC classification number: B81B7/0041 ,  B81C2203/019 ,  Y10T428/162 ,  Y10T428/166 ,  Y10T428/239 ,  Y10T428/24777 ,  Y10T428/2852

Abstract: An electronic display screen is created by processing a mirror on a substrate glass. A back plate glass is then placed on top of the substrate glass and sealed to the back plate glass. A hermetic seal that includes an adhesive mixed with zeolites is disclosed. The hermetic seal can seal the back plate glass with the substrate glass. The application of the hermetic seal is not limited to the electronic display screen. Rather, the hermetic seal can be used to seal a variety of surfaces including metals, polymers, plastics, alloys, ceramics and the like.

Abstract translation: 通过在基板玻璃上处理反射镜来创建电子显示屏。 然后将背板玻璃放置在基板玻璃的顶部上并密封到背板玻璃上。 公开了一种包含与沸石混合的粘合剂的气密密封。 气密密封可用基板玻璃密封背板玻璃。 气密密封的应用不限于电子显示屏。 相反，气密密封可用于密封包括金属，聚合物，塑料，合金，陶瓷等的各种表面。

公开(公告)号：US07388697B2

公开(公告)日：2008-06-17

申请号：US11586179

申请日：2006-10-25

Applicant: Clarence Chui ,  Mithran C. Mathew ,  Marc Mignard

Inventor： Clarence Chui ,  Mithran C. Mathew ,  Marc Mignard

IPC: G02B26/08 ,  G02B26/00

CPC classification number: G09G3/3466 ,  G02B26/001 ,  G09G3/2011 ,  G09G3/207 ,  G09G3/2074 ,  G09G2300/06

Abstract: A system and method for addressing an array of MEMS display elements, such as interferometric modulators, from a drive control. A display includes groups of display elements that are addressed with a commonly applied drive signal. In one embodiment, the groups of display elements are configured to have different response times and are driven by pulses of varying length indicative of those response times. In another embodiment, the groups of display elements are configured to have different actuation voltages and are driven by pulses of varying voltage indicative of those actuation voltages.

Abstract translation: 用于从驱动控制器寻址诸如干涉式调制器的MEMS显示元件阵列的系统和方法。 显示器包括通过常用的驱动信号寻址的显示元件组。 在一个实施例中，显示元件组被配置为具有不同的响应时间并由指示那些响应时间的变化长度的脉冲驱动。 在另一个实施例中，显示元件组被配置为具有不同的致动电压并由指示这些致动电压的变化电压的脉冲驱动。

公开(公告)号：US20080112039A1

公开(公告)日：2008-05-15

申请号：US12014657

申请日：2008-01-15

Applicant: Clarence Chui ,  Jeffrey Sampsell ,  William Cummings ,  Ming-Hau Tung

Inventor： Clarence Chui ,  Jeffrey Sampsell ,  William Cummings ,  Ming-Hau Tung

IPC: G02B26/00

CPC classification number: G02F1/21 ,  G02B26/001 ,  G02F1/1335 ,  G02F2001/13356

Abstract: A spatial light modulator comprises an integrated optical compensation structure, e.g., an optical compensation structure arranged between a substrate and a plurality of individually addressable light-modulating elements, or an optical compensation structure located on the opposite side of the light-modulating elements from the substrate. The individually addressable light-modulating elements are configured to modulate light transmitted through or reflected from the transparent substrate. Methods for making such spatial light modulators involve fabricating an optical compensation structure over a substrate and fabricating a plurality of individually addressable light-modulating elements over the optical compensation structure. The optical compensation structure may be a passive optical compensation structure. The optical compensation structure may include one or more of a supplemental frontlighting source, a diffuser, a black mask, a diffractive optical element, a color filter, an anti-reflective layer, a structure that scatters light, a microlens array, and a holographic film.

公开(公告)号：US07349139B2

公开(公告)日：2008-03-25

申请号：US11417431

申请日：2006-05-03

Applicant: Clarence Chui ,  Ming-Hau Tung

Inventor： Clarence Chui ,  Ming-Hau Tung

IPC: G02F1/03

CPC classification number: G02B26/001 ,  G09G3/3406 ,  G09G3/3466 ,  H04M1/22 ,  H04N5/7458 ,  H04W52/027 ,  Y02D70/1222 ,  Y02D70/142 ,  Y02D70/144 ,  Y02D70/164 ,  Y02D70/26 ,  Y10S359/90

Abstract: An interferometric modulator array device with backlighting is disclosed. The interferometric modulator array device comprises a plurality of interferometric modulator elements, wherein each of the interferometric modulator elements comprises an optical cavity. The interferometric modulator array includes an optical aperture region, and at least one reflecting element is positioned so as to receive light passing through the optical aperture region and reflect at least a portion of the received light to the cavities of the interferometric modulator elements. In some embodiments, the interferometric modulator elements may be separated from each other such that an optical aperture region is formed between adjacent interferometric modulator elements.

公开(公告)号：US07289259B2

公开(公告)日：2007-10-30

申请号：US11057045

申请日：2005-02-11

Applicant: Clarence Chui ,  Jeffrey B. Sampsell

Inventor： Clarence Chui ,  Jeffrey B. Sampsell

IPC: G02B26/00

CPC classification number: G02B26/001 ,  B81B3/0086 ,  G09G3/3466 ,  Y10T29/49117

Abstract: Embodiments of an interferometric modulator are disclosed having various enhancements and features including a conductive bus. In certain embodiments, the interferometric modulator has a first conductive layer suspended over a second electrode layer. In certain embodiments, a second conductive layer is provided over the first conductive layer. One of the first and/or second conductive buses may further connect to the first electrode layer and/or the second electrode layer. Other disclosed features can be incorporated into embodiments of the interferometric modulator to improve response time, power consumption, and image resolution.

Abstract translation: 公开了具有包括导电总线的各种增强和特征的干涉式调制器的实施例。 在某些实施例中，干涉式调制器具有悬挂在第二电极层上的第一导电层。 在某些实施例中，在第一导电层上提供第二导电层。 第一和/或第二导电总线之一可以进一步连接到第一电极层和/或第二电极层。 其他公开的特征可并入干涉式调制器的实施例中以改善响应时间，功耗和图像分辨率。

公开(公告)号：US07256922B2

公开(公告)日：2007-08-14

申请号：US10883902

申请日：2004-07-02

Applicant: Clarence Chui ,  Stephen Zee

Inventor： Clarence Chui ,  Stephen Zee

IPC: G02F1/03

CPC classification number: G02B26/001 ,  G02B26/0841

Abstract: A modulator has a transparent substrate with a first surface. At least one interferometric modulator element resides on the first surface. At least one thin film circuit component electrically connected to the element resides on the surface. When more than one interferometric element resides on the first surface, there is at least one thin film circuit component corresponding to each element residing on the first surface.

Abstract translation: 调制器具有带有第一表面的透明衬底。 至少一个干涉式调制器元件驻留在第一表面上。 电连接到元件的至少一个薄膜电路部件驻留在表面上。 当多于一个干涉测量元件位于第一表面上时，存在至少一个对应于驻留在第一表面上的每个元件的薄膜电路部件。

公开(公告)号：US07221495B2

公开(公告)日：2007-05-22

申请号：US10606001

申请日：2003-06-24

Applicant: Mark W. Miles ,  Brian J. Gally ,  Clarence Chui

Inventor： Mark W. Miles ,  Brian J. Gally ,  Clarence Chui

IPC: G02B26/00 ,  C23F1/00

CPC classification number: B81C1/00182 ,  B81B2201/047 ,  B81C1/0038

Abstract: This invention provides a precursor film stack for use in the production of MEMS devices. The precursor film stack comprises a carrier substrate, a first layer formed on the carrier substrate, a second layer of an insulator material formed on the first layer, and a third layer of a sacrificial material formed on the second layer.

Abstract translation: 本发明提供了用于制造MEMS器件的前体膜叠层。 前体膜叠层包括载体衬底，形成在载体衬底上的第一层，形成在第一层上的绝缘体材料的第二层和形成在第二层上的牺牲材料的第三层。

公开(公告)号：US20070047900A1

公开(公告)日：2007-03-01

申请号：US11491490

申请日：2006-07-21

Applicant: Jeffrey Sampsell ,  Clarence Chui ,  Manish Kothari ,  Mark Miles ,  Teruo Sasagawa ,  Wonsuk Chung ,  Ming-Hau Tung

Inventor： Jeffrey Sampsell ,  Clarence Chui ,  Manish Kothari ,  Mark Miles ,  Teruo Sasagawa ,  Wonsuk Chung ,  Ming-Hau Tung

IPC: G02B6/00

CPC classification number: G02B26/001 ,  B81B3/007 ,  B81B2201/047 ,  B81B2203/0307 ,  B81B2203/053

Abstract: Embodiments of MEMS devices comprise a conductive movable layer spaced apart from a conductive fixed layer by a gap, and supported by rigid support structures, or rivets, overlying depressions in the conductive movable layer, or by posts underlying depressions in the conductive movable layer. In certain embodiments, both rivets and posts may be used. In certain embodiments, these support structures are formed from rigid inorganic materials, such as metals or oxides. In certain embodiments, etch barriers may also be deposited to facilitate the use of materials in the formation of support structures which are not selectively etchable with respect to other components within the MEMS device.

Abstract translation: MEMS器件的实施例包括通过间隙与导电固定层间隔开的导电可移动层，并且由导电可移动层中的上凹部的刚性支撑结构或铆钉支撑，或由导电可移动层中的凹陷下方的柱支撑。 在某些实施例中，可以使用铆钉和柱。 在某些实施方案中，这些支撑结构由诸如金属或氧化物的刚性无机材料形成。 在某些实施例中，还可以沉积蚀刻阻挡层以促进材料在形成相对于MEMS器件内的其它部件不能选择性蚀刻的支撑结构的形成中的使用。