SYSTEMS AND METHODS FOR ENCAPSULATING AN ELECTRONIC COMPONENT

    公开(公告)号:US20220181511A1

    公开(公告)日:2022-06-09

    申请号:US17593073

    申请日:2020-03-06

    Abstract: A method of encapsulating an electronic component. The method includes applying a first layer of an encapsulating composition onto an electronic component from an applicator roll, the electronic component being disposed on a substrate. The applicator roll comprises an outer surface and is spaced apart from the electronic component such that a gap exists between the applicator roll and the electronic component. The gap controls the thickness of the first layer of encapsulating composition. The first layer of encapsulating composition encapsulates the electronic component on the substrate. An interface between the surface of the electronic component and the encapsulating composition being substantially free of voids.

    HOT MELT ADHESIVE COMPOSITIONS INCLUDING MULTIPLE PROPYLENE POLYMERS, AND ARTICLES INCLUDING THE SAME

    公开(公告)号:US20190382630A1

    公开(公告)日:2019-12-19

    申请号:US16438930

    申请日:2019-06-12

    Abstract: A hot melt adhesive composition that includes at least 5% by weight of a first amorphous alpha-olefin copolymer derived from propylene and at least one olefin comonomer other than propylene, the first amorphous alpha-olefin copolymer having a viscosity of less than 50,000 cP at 190° C., from 1% by weight to 20% by weight of a second polyolefin derived from propylene and optionally an alpha-olefin comonomer, the second polyolefin exhibiting a heat of fusion from 15 Joules per gram (J/g) to no greater than 90 J/g, a third polyolefin derived from propylene and optionally an alpha-olefin comonomer other than propylene, the third polyolefin being different from the first amorphous alpha-olefin copolymer and the second polyolefin and exhibiting a melt flow rate of no greater than 100 grams/10 minute and a density of no greater than 0.880 g/cm3, tackifying agent, and liquid plasticizer.

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