公开(公告)号：US08978401B2

公开(公告)日：2015-03-17

申请号：US13588260

申请日：2012-08-17

Applicant: Timothy J. Chainer ,  Hien P. Dang ,  Pritish R. Parida ,  Mark D. Schultz ,  Arun Sharma

Inventor： Timothy J. Chainer ,  Hien P. Dang ,  Pritish R. Parida ,  Mark D. Schultz ,  Arun Sharma

IPC: F25D17/02 ,  H05K7/20

CPC classification number: H05K7/20836 ,  G06F1/206

Abstract: A data center cooling system may include heat transfer equipment to cool a liquid coolant without vapor compression refrigeration, and the liquid coolant is used on a liquid cooled information technology equipment rack housed in the data center. The system may also include a controller-apparatus to regulate the liquid coolant flow to the liquid cooled information technology equipment rack through a range of liquid coolant flow values based upon information technology equipment temperature thresholds.

Abstract translation: 数据中心冷却系统可以包括用于冷却没有蒸气压缩制冷的液体冷却剂的传热设备，并且液体冷却剂被用在容纳在数据中心中的液冷信息技术设备机架上。 该系统还可以包括控制器装置，其通过基于信息技术设备温度阈值的一系列液体冷却剂流量值来调节流向液体冷却的信息技术设备机架的液体冷却剂流。

公开(公告)号：US20130214406A1

公开(公告)日：2013-08-22

申请号：US13398534

申请日：2012-02-16

Applicant: Mark D. Schultz

Inventor： Mark D. Schultz

IPC: H01L23/36

CPC classification number: H01L23/46 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00

Abstract: A multi-chip module (MCM) structure comprises more than one semiconductor chip lying in a horizontal plane, the MCM having individual chip contact patches on the chips and a flexible heat sink having lateral compliance and extending in a plane in the MCM and secured in a heat exchange relation to the chips through the contact patches. The MCM has a mismatch between the coefficient of thermal expansion of the heat sink and the MCM and also has chip tilt and chip height mismatches. The flexible heat sink with lateral compliance minimizes or eliminates shear stress and shear strain developed in the horizontal direction at the interface between the heat sink and the chip contact patches by allowing for horizontal expansion and contraction of the heat sink relative to the MCM without moving the individual chip contact patches in a horizontal direction.

Abstract translation: 多芯片模块（MCM）结构包括位于水平面中的多于一个的半导体芯片，MCM在芯片上具有单独的芯片接触贴片，并且柔性散热器具有侧向顺应性并且在MCM中的平面中延伸并固定在 通过接触片与芯片的热交换关系。 MCM具有散热器的热膨胀系数与MCM之间的不匹配，并且还具有芯片倾斜和芯片高度失配。 具有横向顺从性的柔性散热器通过允许相对于MCM的散热器的水平膨胀和收缩，最小化或消除了在散热器和芯片接触片之间的界面处在水平方向上产生的剪切应力和剪切应变，而不移动 单个芯片接触片在水平方向。

公开(公告)号：US20130199767A1

公开(公告)日：2013-08-08

申请号：US13364907

申请日：2012-02-02

Applicant: John P. Karidis ,  Mark D. Schultz

Inventor： John P. Karidis ,  Mark D. Schultz

IPC: F28F7/00 ,  B23K37/00 ,  B23K31/02

CPC classification number: H01L23/473 ,  B23K1/0014 ,  B23K31/02 ,  B23K2101/14 ,  H01L21/4882 ,  H01L21/4885 ,  H01L23/3677 ,  H01L23/467 ,  H01L24/72 ,  H01L2924/01322 ,  H01L2924/00

Abstract: A heat sink includes a plurality of layers being disposed substantially parallel with a surface of a heat source. The layers include a plurality of pin portions spaced apart from each other in a planar arrangement wherein the pin portions of the layers are stacked and bonded to form pin fins extending in a transverse direction relative to the heat source to sink heat. A compliant layer is disposed between the pin fins and a mechanical load. The compliant layer provides compliance such that the pin fins accommodate dimensional differences when interfacing with the heat source.

Abstract translation: 散热器包括与热源的表面基本平行的多个层。 这些层包括以平面布置彼此间隔开的多个销部分，其中层的销部分被堆叠并结合以形成相对于热源在横向方向上延伸以散热的销散热片。 柔性层设置在销散热片和机械负载之间。 顺应层提供顺应性，使得当与热源接合时，销翅片适应尺寸差异。

公开(公告)号：US20130138252A1

公开(公告)日：2013-05-30

申请号：US13305967

申请日：2011-11-29

Applicant: Timothy J. CHAINER ,  Milnes P. DAVID ,  Madhusudan K. IYENGAR ,  Pritish R. PARIDA ,  Roger R. SCHMIDT ,  Mark D. SCHULTZ

Inventor： Timothy J. CHAINER ,  Milnes P. DAVID ,  Madhusudan K. IYENGAR ,  Pritish R. PARIDA ,  Roger R. SCHMIDT ,  Mark D. SCHULTZ

IPC: G05D23/19 ,  G06F1/32 ,  G05D7/06

CPC classification number: G05D7/0635 ,  G06F1/20 ,  G06F1/206 ,  G06F1/3206 ,  G11B33/144 ,  H05K7/20281 ,  H05K7/20781 ,  H05K7/2079 ,  H05K7/20836 ,  Y02D10/16

Abstract: Cooling apparatuses and methods are provided which include one or more coolant-cooled structures associated with an electronics rack, a coolant loop coupled in fluid communication with one or more passages of the coolant-cooled structure(s), one or more heat exchange units coupled to facilitate heat transfer from coolant within the coolant loop, and N controllable components associated with the coolant loop or the heat exchange unit(s), wherein N≧1. The N controllable components facilitate circulation of coolant through the coolant loop or transfer of heat from the coolant via the heat exchange unit(s). A controller is coupled to the N controllable components, and dynamically adjusts operation of the N controllable components, based on Z input parameters and one or more specified constraints, to provide a specified cooling to the coolant-cooled structure(s), while limiting energy consumed by the N controllable components, wherein Z≧1.

Abstract translation: 提供了冷却装置和方法，其包括与电子机架相关联的一个或多个冷却剂冷却结构，与冷却剂冷却结构的一个或多个通道流体连通的冷却剂回路，一个或多个热交换单元 以促进从冷却剂回路内的冷却剂的热传递，以及与冷却剂回路或热交换单元相关联的N个可控部件，其中N≥1。 N个可控部件促使冷却剂循环通过冷却剂回路或通过热交换单元从冷却剂传递热量。 控制器耦合到N个可控组件，并且基于Z输入参数和一个或多个指定的约束来动态调整N个可控组件的操作，以向冷却剂冷却的结构提供特定的冷却，同时限制能量 由N个可控组件消耗，其中Z> = 1。

公开(公告)号：US20120193833A1

公开(公告)日：2012-08-02

申请号：US13442322

申请日：2012-04-09

Applicant: Russell A. BUDD ,  John P. KARIDIS ,  Mark D. SCHULTZ

Inventor： Russell A. BUDD ,  John P. KARIDIS ,  Mark D. SCHULTZ

IPC: B29C45/00

CPC classification number: H05K3/3457 ,  B23K1/0016 ,  B23K3/0638 ,  H05K2203/0113 ,  H05K2203/0126 ,  H05K2203/0338

Abstract: A method and apparatus are provided to deposit conductive bonding material into cavities in a mold. A fill head is placed in substantial contact with a mold that includes cavities. The fill head includes a sealing member that substantially encompasses an entire area to be filled with conductive bonding material. The conductive bonding material is forced out of the fill head toward the mold. The conductive bonding material is provided into at least one cavity of the cavities contemporaneous with the at least one cavity being in proximity to the fill head.

Abstract translation: 提供了一种方法和装置，以将导电接合材料沉积在模具中的空腔中。 填充头被放置成与包括空腔的模具基本接触。 填充头包括密封构件，其基本上包围要填充有导电接合材料的整个区域。 导电接合材料被迫从模具顶端朝向模具。 导电接合材料设置在与填充头附近的至少一个空腔同时的空腔的至少一个空腔中。

公开(公告)号：US20110203108A1

公开(公告)日：2011-08-25

申请号：US12708774

申请日：2010-02-19

Applicant: Mark D. Schultz

Inventor： Mark D. Schultz

IPC: G01R31/02 ,  H01R43/00

CPC classification number: G01R1/06716 ,  G01R1/06744 ,  Y10T29/49224

Abstract: A probe apparatus is provided and includes a probe layer formed with a through-hole, a conductor, electrically coupled to test equipment, disposed on and insulated from a through-hole sidewall, a probe disposed within the through-hole to be spaced from the conductor and thereby movable upon application of an external force thereto and a compliant layer connected to the probe and sufficiently compliant to allow the probe to at least temporarily contact the conductor upon the application of the external force thereto.

Abstract translation: 提供了一种探针装置，包括形成有通孔的探针层，电连接到测试设备的导体，设置在通孔侧壁上并与绝缘体侧壁绝缘;探针，设置在通孔内以与通孔隔开 导体，从而在施加外力的同时可移动，以及连接到探针的顺应性层，并且足够柔顺，以允许探针在施加外力时至少临时接触导体。

公开(公告)号：US20090151907A1

公开(公告)日：2009-06-18

申请号：US11956024

申请日：2007-12-13

Applicant: John P. Karidis ,  Mark D. Schultz

Inventor： John P. Karidis ,  Mark D. Schultz

IPC: F28D15/00 ,  B21D53/02

CPC classification number: H01L23/473 ,  H01L21/4882 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

Abstract: A method for producing a compliant thermal interface device for cooling an integrated circuit includes steps of: cutting a plurality of high thermal conductivity sheets according to at least one selected pattern, the sheets made up of a first material; forming spring elements in at least one of the plurality of sheets, such that the sheets include both flat areas and spring elements; coating the sheets with a second material, wherein the second material is different from the first material; stacking the high thermal conductivity sheets; and bonding at least a portion of at least one of the stacked sheets using thermo-compression bonding.

Abstract translation: 用于制造用于冷却集成电路的柔性热接口装置的方法包括以下步骤：根据至少一个选定图案切割多个高导热性片材，所述片材由第一材料制成; 在所述多个片材中的至少一个片材中形成弹簧元件，使得所述片材包括平坦区域和弹簧元件; 用第二材料涂覆片材，其中第二材料不同于第一材料; 堆叠高导热片材; 以及使用热压接合将所述堆叠片材中的至少一个的至少一部分结合。

公开(公告)号：US20080247165A1

公开(公告)日：2008-10-09

申请号：US11696265

申请日：2007-04-04

Applicant: Mark D. Schultz

Inventor： Mark D. Schultz

IPC: G01J3/46 ,  G02B27/30 ,  F21V23/04

CPC classification number: G01J3/50 ,  G02B27/20

Abstract: A method and apparatus for increasing the visibility in the visible spectrum of a laser pointer on a target. The laser pointer provides a laser source or sources of at least two distinct visible colors. The visibility of at least one of the laser source colors on the target is determined. The laser source color is selected from the given colors based on the determined visibility. The selected laser source color is directed to the target.

Abstract translation: 一种用于增加激光指示器在目标上的可见光谱中的可视性的方法和装置。 激光指示器提供至少两种不同可见颜色的激光源或源。 确定目标上的至少一种激光源颜色的可视性。 基于所确定的可视性，从给定的颜色中选择激光源颜色。 所选择的激光源颜色指向目标。

公开(公告)号：US07362582B2

公开(公告)日：2008-04-22

申请号：US11151905

申请日：2005-06-14

Applicant: John P. Karidis ,  Mark D. Schultz ,  Bucknell C. Webb

Inventor： John P. Karidis ,  Mark D. Schultz ,  Bucknell C. Webb

IPC: H05K7/20

CPC classification number: H01L23/433 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A structure for cooling an electronic device is disclosed. The structure includes a compressible top layer disposed over the electronic device. The structure further includes a plurality of rigid elements disposed between the top layer and the electronic device for providing a heat path from the electronic device and wherein the plurality of rigid elements provide mechanical compliance. In another alternative, the structure further includes a conformable heat-conducting layer disposed over the electronic device, wherein a bottom end of the plurality of rigid elements is coupled to the conformable heat-conducting layer.

Abstract translation: 公开了一种用于冷却电子设备的结构。 该结构包括设置在电子设备上的可压缩顶层。 该结构还包括设置在顶层和电子设备之间的多个刚性元件，用于提供来自电子设备的热路径，并且其中多个刚性元件提供机械顺应性。 在另一替代方案中，结构还包括设置在电子设备上的适形导热层，其中多个刚性元件的底端联接到适形导热层。

公开(公告)号：US07268963B2

公开(公告)日：2007-09-11

申请号：US10903153

申请日：2004-07-30

Applicant: Timothy J. Chainer ,  Mark D. Schultz ,  Bucknell C. Webb

Inventor： Timothy J. Chainer ,  Mark D. Schultz ,  Bucknell C. Webb

IPC: G11B5/09 ,  G11B21/02 ,  G11B5/596

CPC classification number: G11B5/59633 ,  G11B5/59605

Abstract: Self-servo-writing of multi-slot timing patterns is described. Individual timing marks are replaced with groups of timing mark slots. At each timing mark location, a time measurement is made by detecting a timing mark in one of the slots. Also, extensions to the existing timing marks are written in other slots. The combination of timing measurements at every timing mark and extensions to those timing marks written at every opportunity improves the overall precision of the timing propagation. The improved accuracy of timing mark placement produces a commensurate improvement in the placement of the concomitantly written servo-data. In addition, the alignment accuracy of the written pattern is less sensitive to variations in rotation speed and variations in the shape of written transitions. Moreover, only a single disk revolution is required at each servo radius to write servo data and propagate the timing marks to maintain timing alignment.

Abstract translation: 描述了多时隙定时模式的自伺服写入。 单个定时标记被定时标记位置组替换。 在每个定时标记位置，通过检测其中一个时隙中的定时标记来进行时间测量。 此外，现有时序标记的扩展也写在其他插槽中。 每个定时标记的定时测量和在每个机会上写入的定时标记的扩展的组合可以提高定时传播的总体精度。 定时标记放置的改进精度在同时写入的伺服数据的位置上产生相应的改进。 此外，写入的图案的对准精度对旋转速度的变化和写入的转变的形状的变化较不敏感。 此外，在每个伺服半径处仅需要一次盘旋转以写入伺服数据并传播定时标记以保持定时对准。