公开(公告)号：US20060267208A1

公开(公告)日：2006-11-30

申请号：US11405283

申请日：2006-04-17

Applicant: Matthew Colburn ,  Timothy Dalton ,  Elbert Huang ,  Simon Karecki ,  Satya Nitta ,  Sampath Purushothaman ,  Katherine Saenger ,  Maheswaran Surendra

Inventor： Matthew Colburn ,  Timothy Dalton ,  Elbert Huang ,  Simon Karecki ,  Satya Nitta ,  Sampath Purushothaman ,  Katherine Saenger ,  Maheswaran Surendra

IPC: H01L23/48 ,  H01L21/4763

CPC classification number: H01L21/76807 ,  H01L21/7682 ,  H01L23/5222 ,  H01L23/53238 ,  H01L23/5329 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method to form a closed air gap interconnect structure is described. A starting structure made of regions of a permanent support dielectric under the interconnect lines and surrounding interconnect vias with one or more sacrificial dielectrics present in the remaining portions of the interconnect structure, is capped with a dielectric barrier which is perforated using a stencil with a regular array of holes. The sacrificial dielectrics are then extracted through the holes in the dielectric barrier layer such that the interconnect lines are substantially surrounded by air except for the regions of the support dielectric under the lines. The holes in the cap layer are closed off by depositing a second barrier dielectric so that a closed air gap is formed. Several embodiments of this method and the resulting structures are described.

Abstract translation: 描述了形成闭合气隙互连结构的方法。 在互连线下方由永久支撑电介质的区域构成的起始结构和在互连结构的其余部分中存在的具有一个或多个牺牲电介质的周围的互连通孔被封装有电介质阻挡层，其使用具有规则的模板 孔阵列 然后通过电介质阻挡层中的孔提取牺牲电介质，使得互连线基本上被除了线下方的支撑电介质的区域之外的空气包围。 通过沉积第二阻挡电介质来封闭盖层中的孔，从而形成封闭的气隙。 描述该方法的几个实施例和所得到的结构。

公开(公告)号：US20060147820A1

公开(公告)日：2006-07-06

申请号：US11028799

申请日：2005-01-04

Applicant: Matthew Colburn ,  Yves Martin ,  Theodore van Kessel ,  Hematha Wickramasinghe

Inventor： Matthew Colburn ,  Yves Martin ,  Theodore van Kessel ,  Hematha Wickramasinghe

IPC: G03F9/00 ,  B29C59/02 ,  B29C35/08

CPC classification number: G03F9/00 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  G03F9/7049 ,  G03F9/7065 ,  G03F9/7088 ,  G03F9/7092

Abstract: An apparatus (and method) for forming a pattern on a workpiece, includes an optical phase contrast image sensor, and an imprint lithography system coupled to the optical phase contrast image sensor for laterally aligning an imprint template feature relative to the workpiece.

Abstract translation: 用于在工件上形成图案的装置（和方法）包括光学相差图像传感器和耦合到光学相差图像传感器的压印光刻系统，用于相对于工件横向对准压印模板特征。

公开(公告)号：US07060324B2

公开(公告)日：2006-06-13

申请号：US10755918

申请日：2004-01-13

Applicant: Todd Bailey ,  Byung J. Choi ,  Matthew Colburn ,  Sidlgata V. Sreenivasan ,  C. Grant Willson ,  John Ekerdt

Inventor： Todd Bailey ,  Byung J. Choi ,  Matthew Colburn ,  Sidlgata V. Sreenivasan ,  C. Grant Willson ,  John Ekerdt

IPC: B05D1/32

CPC classification number: G11B5/855 ,  B29C35/0888 ,  B29C37/0053 ,  B29C43/003 ,  B29C2035/0827 ,  B29C2043/025 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  G03F9/00 ,  Y10S977/887

Abstract: The present invention includes a method of moving a liquid between a substrate extending in a first plane and a template extending in a second plane. More specifically, the method may include forming an oblique angle between the first plane and the second plane, reducing a distance between the substrate and the template such that the template is in contact with a portion of the liquid at a desired location, and creating a dispersion of the liquid away from the desired location.

Abstract translation: 本发明包括一种在第一平面中延伸的基板和在第二平面中延伸的模板之间移动液体的方法。 更具体地，该方法可以包括在第一平面和第二平面之间形成倾斜角度，减小基板和模板之间的距离，使得模板在期望位置与液体的一部分接触，并且产生 液体离开所需位置分散。

公开(公告)号：US20060105571A1

公开(公告)日：2006-05-18

申请号：US10989078

申请日：2004-11-16

Applicant: Matthew Colburn ,  Yves Martin ,  Theodore van Kessel ,  Hematha Wickramasinghe

Inventor： Matthew Colburn ,  Yves Martin ,  Theodore van Kessel ,  Hematha Wickramasinghe

IPC: B29C59/02 ,  B29C33/58 ,  B29C71/04 ,  H01L21/302 ,  H01L21/461

CPC classification number: B29C43/021 ,  B29C43/003 ,  B29C43/3642 ,  B29C2043/025 ,  B29C2043/3647 ,  B29C2043/3649 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  H01L21/0273

Abstract: A method (and apparatus) for nano lithography, includes applying a pneumatic pressure to at least one of a surface of a semi-rigid mask or template and a portion of a surface of a resist-coated workpiece, and, by the applying of the pneumatic pressure, transferring a pattern from the mask to the workpiece.

Abstract translation: 一种用于纳米光刻的方法（和装置），包括向半刚性掩模或模板的表面和抗蚀剂涂覆的工件的表面的一部分中的至少一个施加气动压力，并且通过施加 气动压力，将图案从面罩转移到工件。

公开(公告)号：US20060006546A1

公开(公告)日：2006-01-12

申请号：US10887086

申请日：2004-07-09

Applicant: Matthew Colburn

Inventor： Matthew Colburn

IPC: H01L23/48

CPC classification number: H01L21/76835 ,  H01L21/76807 ,  H01L21/7681 ,  H01L21/76829

Abstract: Interconnect dual damascene structure are fabricated by depositing on a layer of at least one dielectric, a mask forming layer for providing the via-level mask layer of the dual damascene structures; creating an elongated via pattern in the via-level mask layer; depositing a layer of line-level dielectric and creating a line pattern through the layer of line-level dielectric, and transferring the line pattern through the projected intersection of the elongated via-level pattern and of the line-level pattern thereby generating an aligned dual damascene structure. A conductive liner layer is deposited in the dual damascene structure followed by filling the dual damascene structure with a conductive fill metal to form a set of metal lines. The metal and liner layers are planarized.