Abstract:
Disclosed is a pre-heater for vehicles comprising: A PTC element module including a positive terminal composed of two sheets, an upper sheet of which has a fastening hole and upward bended ribs formed at opposite edges of the fastening hole; a ring-shaped insert insulator inserted between the ribs; a PTC element inserted into an inside of the insert insulator, a bottom surface of which is in contact with a lower sheet of the positive terminal; one heat fin assembly closely fastened to one surface of the PTC element; another heat fin assembly fastened to the other surface of the PTC element through the medium of a positive terminal and an entire surface insulator; and a fastening insulator for binding together the two heat fin assemblies, the PTC element, the positive terminal and the entire surface insulator, and a heat fin assembly disposed parallel to the PTC element module; a negative terminal disposed parallel to the heat fin assembly; frames and respectively fastened to both ends of a combined body including the PTC element module; the heat fin assembly, and the negative terminal; and housing and respectively fastened to both longitudinal ends of a combined body including the PTC element module, the heat fin assembly, the negative terminal, and the frames and. In accordance with the present invention, the pre-heater has advantages capable of more facilitating assembly and maintenance and remarkably improving productivity, since the PTC element module and so on may be modulized.
Abstract:
An SOI substrate is fabricated by providing a substrate having a sacrificial layer thereon, an active semiconductor layer on the sacrificial layer remote from the substrate and a supporting layer that extends along at least two sides of the active semiconductor layer and the sacrificial layer and onto the substrate, and that exposes at least one side of the sacrificial layer. At least some of the sacrificial layer is etched through the at least one side thereof that is exposed by the supporting layer to form a void space between the substrate and the active semiconductor layer, such that the active semiconductor layer is supported in spaced-apart relation from the substrate by the supporting layer. The void space may be at least partially filled with an insulator lining.
Abstract:
In a semiconductor device having a multi-bridge-channel, and a method for fabricating the same, the device includes first and second semiconductor posts protruding from a surface of a semiconductor substrate and having a source and a drain region, respectively, in upper side portions thereof, channel semiconductor layers connecting upper side portions of the first and second semiconductor posts, a gate insulation layer on the channel semiconductor layers and the semiconductor substrate, the gate insulation layer surrounding at least a portion of the channel semiconductor layers, a gate electrode layer on the gate insulation layer to enclose at least a portion of a region between the channel semiconductor layers, and junction auxiliary layers formed between the channel semiconductor layers, the junction auxiliary layers contacting the gate electrode layer and upper side portions of the first and second semiconductor posts, and having a same width as the channel semiconductor layers.
Abstract:
Disclosed is a pre-heater for vehicles comprising: A PTC element module including a positive terminal composed of two sheets, an upper sheet of which has a fastening hole and upward bended ribs formed at opposite edges of the fastening hole; a ring-shaped insert insulator inserted between the ribs; a PTC element inserted into an inside of the insert insulator, a bottom surface of which is in contact with a lower sheet of the positive terminal; one heat fin assembly closely fastened to one surface of the PTC element; another heat fin assembly fastened to the other surface of the PTC element through the medium of a positive terminal and an entire surface insulator; and a fastening insulator for binding together the two heat fin assemblies, the PTC element, the positive terminal and the entire surface insulator, and a heat fin assembly disposed parallel to the PTC element module; a negative terminal disposed parallel to the heat fin assembly; frames and respectively fastened to both ends of a combined body including the PTC element module; the heat fin assembly, and the negative terminal; and housing and respectively fastened to both longitudinal ends of a combined body including the PTC element module, the heat fin assembly, the negative terminal, and the frames and. In accordance with the present invention, the pre-heater has advantages capable of more facilitating assembly and maintenance and remarkably improving productivity, since the PTC element module and so on may be modulized.
Abstract:
Some embodiments of the present invention provide methods and apparatus for operating a transistor including at least one fully depleted channel region in and/or on a substrate. The methods include applying a reverse body bias to the substrate when turning on the transistor. The substrate may be a bulk wafer substrate. The reverse body bias may allow the transistor to turn on while preventing turn on of a parasitic transistor in the substrate.
Abstract:
A unit cell of a metal oxide semiconductor (MOS) transistor is provided including an integrated circuit substrate and a MOS transistor on the integrated circuit substrate. The MOS transistor has a source region, a drain region and a gate. The gate is between the source region and the drain region. First and second spaced apart buffer regions are provided beneath the source region and the drain region and between respective ones of the source region and integrated circuit substrate and the drain region and the integrated circuit substrate.
Abstract:
Provided are a multi-channel semiconductor device and a method for manufacturing the semiconductor device through a simplified process. A sacrificial layer and a channel layer are alternately stacked on a semiconductor substrate. Thereafter, the sacrificial layer and the channel layer are etched to form a separated active pattern, and a device isolation layer is formed to cover sidewalls of the active pattern. Dopant ions are implanted into the entire semiconductor substrate, thereby forming a channel separation region under the active pattern. A portion of the active pattern is etched to separate the active pattern from a pair of facing sidewalls of the device separation layer, thereby forming a channel pattern having a pair of first exposed sidewalls. Source/drain semiconductor layers are formed on the first sidewalls of the channel pattern, and a part of the device isolation layer is removed to expose a pair of second sidewalls of the channel pattern contacting with the device separation layer. Thereafter, the sacrificial layer included in the channel pattern is remove, and a conductive layer for a gate electrode is formed to cover the channel layer exposed by the removing of the sacrificial layer.
Abstract:
An integrated circuit device structure can be formed by forming an implant mask having a window therein on a structure including upper and lower Si layers and an intermediate SiGex layer therebetween. Ions are implanted through the upper Si layer and into a portion of the intermediate SiGex layer exposed through the window in the implant mask and blocking implantation of ions into portions of the intermediate SiGex layer outside the window. The portions of the intermediate SiGex layer outside the window are etched and the portion of the intermediate SiGex layer exposed through the window having ions implanted therein is not substantially etched to form a patterned intermediate SiGex layer.
Abstract translation:集成电路器件结构可以通过在其上形成具有窗口的植入掩模形成在包括上和下Si层的结构和其间的中间SiGe x层之间形成。 离子通过上部Si层进入植入掩模中通过窗口暴露的中间SiGe层的一部分,并将离子注入到中间SiGe x x的部分中, SUB>层外面的窗口。 蚀刻窗口外部的中间SiGe x X层的部分,并且通过其中注入离子的窗口露出的中间SiGe层的部分基本上不被蚀刻以形成 图案化的中间SiGe x层。
Abstract:
A multi-bridge-channel MOSFET (MBCFET) may be formed by forming a stacked structure on a substrate that includes channel layers and interchannel layers interposed between the channel layers. Trenches are formed by selectively etching the stacked structure. The trenches run across the stacked structure parallel to each other and separate a first stacked portion including channel patterns and interchannel patterns from second stacked portions including channel and interchannel layers remaining on both sides of the first stacked portion. First source and drain regions are grown using selective epitaxial growth. The first source and drain regions fill the trenches and connect to second source and drain regions defined by the second stacked portions. Marginal sections of the interchannel patterns of the first stacked portion are selectively exposed. Through tunnels are formed by selectively removing the interchannel patterns of the first stacked portion beginning with the exposed marginal sections. The through tunnels are surrounded by the first source and drain regions and the channel patterns. A gate is formed along with a gate dielectric layer, the gate filling the through tunnels and extending onto the first stacked portion.
Abstract:
A fin field-effect transistor (FinFET) device includes a fin-shaped active region having first and second source/drain regions therein and a channel region therebetween vertically protruding from a semiconductor substrate. A gate electrode is formed on an upper surface and sidewalls of the channel region. First and second source/drain contacts are formed on respective upper surfaces and sidewalls of the first and second source/drain regions of the fin-shaped active region at opposite sides of the gate electrode. The channel region may be narrower than the first and second source/drain regions of the fin-shaped active region.