公开(公告)号：US20190074206A1

公开(公告)日：2019-03-07

申请号：US16121945

申请日：2018-09-05

Applicant: ULTRA DISPLAY TECHNOLOGY CORP.

Inventor： Hsien-Te CHEN

IPC: H01L21/683 ,  H01L25/075 ,  H01L33/62 ,  B65G47/90

Abstract: A target substrate with micro semiconductor structures is manufactured by following steps of: attaching a pre-adhesive layer on a target substrate; patterning the adhesive layer to form a plurality of micro contact protrusions; and using the target substrate to perform a selective batch pickup procedure to pick up a plurality of micro semiconductor structures so as to form the target substrate with micro semiconductor structures.

公开(公告)号：US10211195B2

公开(公告)日：2019-02-19

申请号：US15696541

申请日：2017-09-06

Applicant: ULTRA DISPLAY TECHNOLOGY CORP.

Inventor： Yoshitaka Kajiyama

IPC: H01L25/00 ,  H01L21/683 ,  H01L25/13

Abstract: An optoelectronic semiconductor device and a manufacturing method are disclosed. The manufacturing method includes steps of: a step of providing a microsized optoelectronic semiconductor element, a step of providing a matrix substrate, a step of electrode alignment and lamination, a step of electrode coupling, a step of illumination and lift-off and a step of removal. The step of electrode coupling is to provide a first light to concentratedly illuminate at least some of the junctions between the first electrodes and the third electrodes or concentratedly illuminate at least some of the junctions between the second electrodes and the fourth electrodes. The step of illumination and lift-off is to provide a second light to concentratedly illuminate at least some of the interfaces between the microsized optoelectronic semiconductor elements and the epitaxial substrate to peel off the microsized optoelectronic semiconductor elements from the epitaxial substrate.

公开(公告)号：US20180294248A1

公开(公告)日：2018-10-11

申请号：US15947178

申请日：2018-04-06

Applicant: ULTRA DISPLAY TECHNOLOGY CORP.

Inventor： Hsien-Te CHEN

IPC: H01L23/00 ,  H01L21/683 ,  H01L33/00 ,  H01L25/00

Abstract: A method of batch transferring micro semiconductor structures is provided for effectively and efficiently picking up a batch of or a large amount of micro structures and transferring them to a target substrate, so it can be widely applied in transferring a lot of various micro semiconductor structures. The method includes steps of: attaching an adhesive material to a plurality of array-type micro semiconductor structures; and providing a roll-to-attach mechanism for alternately processing linear contacts between the array-type micro semiconductor structures and a target substrate. The array-type micro semiconductor structures are optionally picked up in batch from the adhesive material and transferred in batch to the target substrate as the linear contacts are alternately processed.

公开(公告)号：US09831228B2

公开(公告)日：2017-11-28

申请号：US15379962

申请日：2016-12-15

Applicant: ULTRA DISPLAY TECHNOLOGY CORP.

Inventor： Yung-Yu Yen

IPC: H01L33/00 ,  H01L25/00 ,  H01L23/00 ,  H01L25/16 ,  H01L27/12 ,  H01L33/62

CPC classification number: H01L25/50 ,  H01L24/83 ,  H01L24/97 ,  H01L25/167 ,  H01L27/1248 ,  H01L27/1262 ,  H01L33/62 ,  H01L2224/83139 ,  H01L2224/83851 ,  H01L2224/83951 ,  H01L2224/95001 ,  H01L2224/95136 ,  H01L2924/0781 ,  H01L2924/12041 ,  H01L2924/1426 ,  H01L2924/1515 ,  H01L2933/0066

Abstract: An opto-electronic apparatus and a manufacturing method thereof are disclosed. The manufacturing method of the opto-electronic apparatus includes the following steps of: disposing a matrix circuit on a substrate, wherein the matrix circuit has a matrix circuit thickness between the highest point of the matrix circuit and the surface of the substrate; disposing a plurality of first protrusions above the substrate, wherein at least one of the first protrusions has a first protrusion thickness between the highest point of the first protrusion and the surface of the substrate, and the first protrusion thickness is greater than the matrix circuit thickness; and performing a transfer step for transferring a plurality of first opto-electronic units from a first carrier to the first protrusions and bonding the first protrusions to at least two of the first opto-electronic units with an adhesive material.