公开(公告)号：US07847021B2

公开(公告)日：2010-12-07

申请号：US10589431

申请日：2005-02-09

Applicant: Hosei Shinoda ,  Takeshi Kashima ,  Masahiro Enna ,  Shinichi Kojoh ,  Hideyuki Kaneko ,  Shingo Matsuo ,  Nobuo Kawahara ,  Tomoaki Matsugi ,  Yuichi Matsuda ,  Takayuki Onogi ,  Fumio Kageyama

Inventor： Hosei Shinoda ,  Takeshi Kashima ,  Masahiro Enna ,  Shinichi Kojoh ,  Hideyuki Kaneko ,  Shingo Matsuo ,  Nobuo Kawahara ,  Tomoaki Matsugi ,  Yuichi Matsuda ,  Takayuki Onogi ,  Fumio Kageyama

IPC: C08G67/00 ,  C08L67/00 ,  C08L67/04 ,  C08L23/10 ,  C08L23/26

CPC classification number: C08L51/06 ,  C08L23/00 ,  C08L23/02 ,  C08L67/02 ,  C08L69/00 ,  Y10T428/31786 ,  Y10T428/31855 ,  Y10T428/31935 ,  Y10T428/31938 ,  C08L2666/24 ,  C08L2666/18 ,  C08L2666/14 ,  C08L2666/02

Abstract: A modified polyolefin resin comprising a copolymer having a structure that a propylene-based polyolefin segment (a) and a segment (b) containing a lactic acid as a constituent are bonded in a block state and/or a graft state through a vinyl monomer having a hydroxyl group, wherein a number average molecular weight of the propylene-based polyolefin segment (a) is from 1,000 to 100,000, a number average molecular weight of the segment (b) containing lactic acid as a constituent is from 1,000 to 200,000, and a weight composition of the propylene-based polyolefin segment (a) and the segment (b) containing lactic acid as a constituent is from 10/90 to 90/10. The modified polyolefin resin can be used in a resin composition containing an aliphatic polyester resin (A), a polyolefin resin (B) and the modified polyolefin resin (C). The composition can exhibit excellent heat resistance and impact resistance and can be used for molding various parts.

Abstract translation: 包含具有丙烯类聚烯烃链段（a）和含有乳酸作为组分的链段（b）的结构的共聚物的改性聚烯烃树脂以嵌段状态和/或接枝状态通过具有 羟基，其中丙烯类聚烯烃链段（a）的数均分子量为1,000〜100,000，以乳酸为成分的链段（b）的数均分子量为1,000〜200,000，以及 丙烯类聚烯烃链段（a）和含有乳酸作为成分的链段（b）的重量组成为10/90〜90/10。 改性聚烯烃树脂可用于含有脂族聚酯树脂（A），聚烯烃树脂（B）和改性聚烯烃树脂（C）的树脂组合物中。 该组合物可以表现出优异的耐热性和抗冲击性，并且可用于各种部件的成型。

公开(公告)号：US06418615B1

公开(公告)日：2002-07-16

申请号：US09523149

申请日：2000-03-10

Applicant: Akio Rokugawa ,  Masayuki Sasaki ,  Yuichi Matsuda

Inventor： Akio Rokugawa ,  Masayuki Sasaki ,  Yuichi Matsuda

IPC: H01K310

CPC classification number: H05K3/4682 ,  H01L21/6835 ,  H01L23/49811 ,  H01L23/49822 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/3025 ,  H05K1/113 ,  H05K3/007 ,  H05K3/045 ,  H05K3/108 ,  H05K3/20 ,  H05K3/205 ,  H05K3/388 ,  H05K2201/09509 ,  H05K2201/09527 ,  H05K2201/09563 ,  H05K2203/0152 ,  H05K2203/0376 ,  H05K2203/0384 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49345

Abstract: A substrate of multilayered structure having a plurality of sets of an insulation layer and a wiring line layer, and having one face for mounting a semiconductor element thereon and the other face on which external connection terminals are to be provided, the face for mounting a semiconductor element being provided with pads to be bonded to an electrode terminal of the semiconductor element, the other face being provided with pads to be bonded to an external connection terminal, such as a terminal formed of a solder ball, and the wiring line layers on both sides of an insulation layer being connected with each other by vias piercing the insulation layer, wherein the surfaces of the pads to be bonded to an electrode terminal of a semiconductor element are flat and are in the same plane. A method of manufacturing such a multilayered substrate is also disclosed.

Abstract translation: 一种多层结构的基板，具有多组绝缘层和布线层，并且具有用于安装半导体元件的一个面和将要设置外部连接端子的另一个面，用于安装半导体的面 元件设置有要接合到半导体元件的电极端子的焊盘，另一个面设置有焊接到外部连接端子，例如由焊球形成的端子，并且两个布线层 绝缘层的侧面通过穿过绝缘层的通孔相互连接，其中要结合到半导体元件的电极端子的焊盘的表面是平坦的并且在同一平面中。 还公开了制造这种多层基板的方法。