PACKAGING METHOD FOR ELECTRONIC DEVICE AND PACKAGING SYSTEM
    42.
    发明申请
    PACKAGING METHOD FOR ELECTRONIC DEVICE AND PACKAGING SYSTEM 有权
    电子设备和包装系统的包装方法

    公开(公告)号:US20170047538A1

    公开(公告)日:2017-02-16

    申请号:US14913090

    申请日:2015-07-16

    Abstract: The present invention provides a packaging method for an electronic device, which includes a step of forming a packaging substrate, the step of the forming a packaging substrate includes: forming, on a base substrate, a defining pattern which comprises a groove for defining position of frit; providing colloidal frit in the groove; presintering the colloidal frit to obtain preliminarily cured frit; polishing upper surfaces of the defining pattern and the preliminarily cured frit; and removing the defining pattern, and completely curing the preliminarily cured frit, so as to form solid frit on the base substrate. The present invention also provides a packaging system. By using the packaging method provided by the present invention, a better packaging effect can be achieved.

    Abstract translation: 本发明提供了一种电子设备的封装方法,其包括形成封装基板的步骤,形成封装基板的步骤包括:在基底基板上形成限定图案,所述限定图案包括用于限定位置的位置的凹槽 玻璃料 在凹槽中提供胶体玻璃料; 预先烧结胶体玻璃料以获得预先固化的玻璃料; 抛光定义图案的上表面和预先固化的玻璃料; 并去除定义图案,并完全固化预先固化的玻璃料,从而在基底基材上形成固体玻璃料。 本发明还提供一种包装系统。 通过使用本发明提供的包装方法,可以实现更好的包装效果。

    DISPLAY APPARATUSES, DISPLAY PANELS, AND METHODS OF MANUFACTURING DISPLAY PANELS

    公开(公告)号:US20230145862A1

    公开(公告)日:2023-05-11

    申请号:US17915298

    申请日:2021-10-26

    CPC classification number: H10K59/1213 H10K59/122 H10K59/1201

    Abstract: The present disclosure provides a display apparatus, a display panel, and a method of manufacturing a display panel. The display panel includes a base substrate, a conductive layer, an organic insulating structure, a first organic convex ring, and a cathode material layer. A first isolation trench for exposing the conductive layer is provided between the organic insulating structure and the first organic convex ring, and a ratio of a width of the first isolation trench to a maximum allowable fluctuation for a distance between an edge position of the cathode material layer and an edge of the organic insulating structure ranges from 0.025 to 0.218. According to embodiments of the present disclosure, when a distance between an edge of a cathode and an outer edge of a frame area is fixed, the maximum allowable fluctuation for the distance between the edge position of the cathode material layer and the edge of the organic insulating structure may be increased by reducing the width of the first isolation trench. As a result, the cathode material layer may not fall into the first isolation trench in the evaporation process, so as to avoid short circuit due to overlap of the cathode with the conductive layer, thereby improving the yield of the display panel.

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