公开(公告)号：US20210036196A1

公开(公告)日：2021-02-04

申请号：US16920401

申请日：2020-07-02

Applicant: BOE Technology Group Co., Ltd.

Inventor： Zhiwei LIANG ,  Wenqian LUO ,  Yingwei LIU ,  Ke WANG ,  Shengguang BAN ,  Zhanfeng CAO

IPC: H01L33/62 ,  H01L23/00

Abstract: A preparation method of a backplane includes: forming an insulating structure layer having a groove on a base substrate by a mask exposure process, the groove being used for accommodating a metal trace; and repeating a metal sub-layer forming step including an ashing process and a wet etching process multiple times to form the metal trace positioned in the groove.

公开(公告)号：US20190109180A1

公开(公告)日：2019-04-11

申请号：US16150374

申请日：2018-10-03

Applicant: BOE Technology Group Co., Ltd.

Inventor： Zhiwei LIANG ,  Yingwei LIU

IPC: H01L27/32 ,  H01L51/56

Abstract: A display apparatus is provided, which includes a rigid substrate; a first carrier plate provided on a first surface of the rigid substrate; a first substrate provided on the first carrier plate, the first substrate including a thin film transistor with a drain; a light emitting assembly provided on a second surface of the rigid substrate distal to the first surface, the light emitting assembly including an anode and a light emitting layer provided successively along a direction distal to the rigid substrate; and a via hole provided penetrating the rigid substrate and the first carrier plate, the anode electrically coupled to the drain through the via hole. In the display apparatus of the present disclosure the light emitting assembly is separated from the array substrate such that when the light emitting assembly or the first substrate suffers from failure, it can be replaced easily.

公开(公告)号：US20190087624A1

公开(公告)日：2019-03-21

申请号：US15767704

申请日：2017-09-30

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Qingrong REN ,  Wei YANG ,  Jianming SUN ,  Yingwei LIU ,  Liangjian LI ,  Haisheng WANG ,  Yingming LIU

IPC: G06K9/00

CPC classification number: G06K9/0004 ,  G06K9/00087

Abstract: A fingerprint identification sensor, a fingerprint identification method and an electronic device are disclosed. The fingerprint identification sensor includes a substrate; a fingerprint sensing element disposed on the substrate and including a thin film transistor, an off-state leakage current of the thin film transistor varying with the intensity of light irradiating onto an active area thereof; and a fingerprint identification light source arranged to emit light that irradiates onto a finger and is reflected thereby, the reflected light irradiating onto the active area of the thin film transistor. Thus, the fingerprint identification can be realized conveniently, and the fingerprint identification sensor has at least one of the advantages like high sensitivity and simple structure.

公开(公告)号：US20190067332A1

公开(公告)日：2019-02-28

申请号：US16041020

申请日：2018-07-20

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Yingwei LIU ,  Qi YAO ,  Zhiwei LIANG

IPC: H01L27/12

Abstract: The present disclosure provides an array substrate, a method for manufacturing the array substrate and a display device. The array substrate includes a base substrate and a signal line provided in a display region at a first side of the base substrate, an electrode is provided at a second side of the base substrate, the second side of the base substrate is opposite to the first side of the base substrate, a via-hole penetrating through the base substrate is provided at a position of the base substrate at which the electrode is provided, a connecting electrode is provided in the via-hole, and the signal line is electrically connected to the electrode provided at the second side of the base substrate through the connecting electrode.