Abstract:
An illumination system (12) of a microlithographic exposure apparatus (10) comprises a condenser (601; 602; 603; 604; 605; 606) for transforming a pupil plane (54) into a field plane (62). The condenser has a lens group (L14, L15, L16, L17; L24, L25, L26, L27, L28; L34, L35, L36, L37; L44, L45, L46; L53, L54, L55) that contains a plurality of consecutive lenses. These lenses are arranged such that a light bundle (70) focused by the condenser (601; 602; 603; 604; 605) on an on-axis field point (72) converges within each lens of the lens group. At least one lens (L15, L16, L17; L25, L26; L34, L44, L45; L54) of the lens group has a concave surface. The illumination system may further comprise a field stop objective (66; 666, 666′) that at least partly corrects a residual pupil aberration of the condenser (601; 602; 603; 604; 605; 606).
Abstract translation:微光刻曝光设备(10)的照明系统(12)包括用于将光瞳平面(54)变换成场平面(62)的冷凝器(601; 602; 603; 604; 605; 606)。 冷凝器具有透镜组(L 14,L 15,L 16,L 17; L 24,L 25,L 26,L 27,L 28; L 34,L 35,L 36,L 37; L 44,L 45,L 46; L 53,L 54,L 55)。 这些透镜被布置为使得在轴上场点(72)上由聚光器(601; 602; 603; 604; 605)聚焦的光束(70)会聚在透镜组的每个透镜内。 透镜组的至少一个透镜(L 15,L 16,L 17; L 25,L 26; L 34,L 44,L 45; L 54)具有凹面。 照明系统还可以包括至少部分校正冷凝器(601; 602; 603; 604; 605; 606)的残余光瞳像差的场停止物镜(66; 666,666')。
Abstract:
A projection exposure apparatus for the exposure of a radiation-sensitive substrate arranged in the region of an image surface of a projection objective with at least one image of a pattern of a mask that is arranged in the region of an object surface of the projection objective has a light source for emitting ultraviolet light from a wavelength band having a bandwidth Δλ>10 pm around a central operating wavelength λ>200 nm; an illumination system for receiving the light from the light source and for directing illumination radiation onto the pattern of the mask; and a projection objective for the imaging of the structure of the mask onto a light-sensitive substrate. The projection objective is a catadioptric projection objective having at least one concave mirror arranged in a region of a pupil surface of the projection objective, and a negative group having at least one negative lens arranged in direct proximity to the concave mirror in a region near the pupil surface, where a marginal ray height (MRH) of the imaging is greater than a chief ray height (CRH).
Abstract:
The disclosure relates to a method of manufacturing a projection objective, and a projection objective, such as a projection objective configured to be used in a microlithographic process. The method can include defining an initial design for the projection objective and optimizing the design using a merit function. The method can be used in the manufacturing of projection objectives which may be used in a microlithographic process of manufacturing miniaturized devices.
Abstract:
The disclosure relates to a microlithographic projection exposure apparatus and a microlithographic projection exposure apparatus, as well as related components, methods and articles made by the methods. The microlithographic projection exposure apparatus includes an illumination system and a projection objective. The illumination system can illuminate a mask arranged in an object plane of the projection objective. The mask can have structures which are to be imaged. The method can include illuminating a pupil plane of the illumination system with light. The method can also include modifying, in a plane of the projection objective, the phase, amplitude and/or polarization of the light passing through that plane. The modification can be effected for at least two diffraction orders in mutually different ways. A mask-induced loss in image contrast obtained in the imaging of the structures can be reduced compared to a method without the modification.
Abstract:
A magnifying imaging optical system is disclosed that has precisely three mirrors, which image an object field in an object plane into an image field in an image plane. A ratio between a transverse dimension of the image field and a transverse dimension measured in the same direction of a useful face of the last mirror before the image field is greater than 3. In a further aspect, the magnifying imaging optical system is disclosed that has at least three mirrors, which image an object field in an object plane in an image field in an image plane. A first mirror in the beam path after the object field is concave, a second mirror is also concave and a third mirror is convex. An angle of incidence of imaging beams on the last mirror before the image field is less than 15°.
Abstract:
The present invention relates to an optical imaging device, in particular for microscopy, with a first optical element group and a second optical element group, wherein the first optical element group and the second optical element group, on an image plane, form an image of an object point of an object plane via at least one imaging ray having an imaging ray path. The first optical element group comprises a first optical element with a reflective first optical surface in the imaging ray path and a second optical element with a reflective second optical surface in the imaging ray path, wherein the first optical surface is concave. The second optical element group comprises a third optical element with a concave reflective third optical surface in the imaging ray path and a fourth optical element with a convex reflective fourth optical surface in the imaging ray path without light passage aperture.
Abstract:
The invention relates to a method for analyzing a defect of a photolithographic mask for an extreme ultraviolet (EUV) wavelength range (EUV mask) comprising the steps of: (a) generating at least one focus stack relating to the defect using an EUV mask inspection tool, (b) determining a surface configuration of the EUV mask at a position of the defect, (c) providing model structures having the determined surface configuration which have different phase errors and generating the respective focus stacks, and (d) determining a three dimensional error structure of the EUV mask defect by comparing the at least one generated focus stack of the defect and the generated focus stacks of the model structures.
Abstract:
The invention relates to a method for mask inspection and to a mask inspection installation. A method according to the invention involves a lighting system lighting a mask with a lighting beam pencil, and said mask being observed with an observation beam pencil which is directed onto a sensor arrangement, wherein the light hitting the sensor arrangement is evaluated in order to check the mapping effect of the mask. The lighting system produces a spot of light with limited refraction on the mask, and during the evaluation of the light hitting the sensor arrangement a finite component of the light setting out from the mask to produce the observation beam pencil is disregarded.
Abstract:
A projection objective of a microlithographic projection exposure apparatus has a high index refractive optical element with an index of refraction greater than 1.6. This element has a volume and a material related optical property which varies over the volume. Variations of this optical property cause an aberration of the objective. In one embodiment at least 4 optical surfaces are provided that are arranged in at least one volume which is optically conjugate with the volume of the refractive optical element. Each optical surface comprises at least one correction means, for example a surface deformation or a birefringent layer with locally varying properties, which at least partially corrects the aberration caused by the variation of the optical property.
Abstract:
The disclosure relates to a method of manufacturing a projection objective, and a projection objective, such as a projection objective configured to be used in a microlithographic process. The method can include defining an initial design for the projection objective and optimizing the design using a merit function. The method can be used in the manufacturing of projection objectives which may be used in a microlithographic process of manufacturing miniaturized devices.