Wafer structure
    43.
    发明授权

    公开(公告)号:US11724499B2

    公开(公告)日:2023-08-15

    申请号:US17528524

    申请日:2021-11-17

    CPC classification number: B41J2/1433 B41J2/155 B41J2002/14346

    Abstract: A wafer structure is disclosed and includes a chip substrate and a plurality of inkjet chips. The chip substrate is a silicon substrate fabricated by a semiconductor process on a wafer of at least 12 inches. The inkjet chips include at least one first inkjet chip and at least one second inkjet chip directly formed on the chip substrate by the semiconductor process, respectively, and the plurality of inkjet chips are diced into the at least one first inkjet chip and the at least one second inkjet chip for inkjet printing. Each of the first inkjet chip and the second inkjet chip includes a plurality of ink-drop generators produced by a semiconductor process and formed on the chip substrate. Each of the ink-drop generators includes a thermal-barrier layer, a resistance heating layer, a conductive layer, a protective layer, a barrier layer, an ink-supply chamber and a nozzle.

    Monitor and gas detection information notification system

    公开(公告)号:US11719674B2

    公开(公告)日:2023-08-08

    申请号:US16998021

    申请日:2020-08-20

    CPC classification number: G01N33/0034 G01N33/0008 G01N33/0062

    Abstract: A monitoring and gas detection information notification system includes monitoring devices and a cloud data processing device. The monitoring devices are respectively disposed at corresponding fixed positions, each of the monitoring devices includes a monitoring module and an actuator-sensor module. The monitoring module captures an image and converts the image into an image data. The actuator-sensor module is disposed in the monitoring module and includes one or more actuators for guiding a gas into the monitoring module and includes one or more sensors for generating a gas detecting data. The cloud data processing device stores and intelligently analyzes the image data and the gas detecting data to generate a processed data, and the cloud data processing device transmits the processed data to a notification processing system so as to conduct a notification of monitoring information and gas detecting information.

    Thin gas transportation device
    45.
    发明授权

    公开(公告)号:US11668294B2

    公开(公告)日:2023-06-06

    申请号:US17168340

    申请日:2021-02-05

    CPC classification number: F04B43/046 F16K17/0493 F16K99/0015 H10N30/2047

    Abstract: A thin gas transportation device includes an inlet plate, a resonance sheet, an actuating element, a first insulation frame attached to the actuating element, a conductive frame, and a second insulation frame attached to the conductive frame. The conductive frame has a conductive outer frame attached to the first insulation frame, an elastic conductive pin, and a conductive piece connected to an outer edge portion of the conductive outer frame. One end of the elastic conductive pin is connected to an inner edge portion of the conductive outer frame, and the other end of the elastic conductive pin extends obliquely toward the actuating element and forms a bent portion. The bent portion presses against the actuating element and is electrically connected to the actuating element, and the bent portion is strip-shaped.

    THIN GAS TRANSPORTATION DEVICE
    49.
    发明申请

    公开(公告)号:US20220243715A1

    公开(公告)日:2022-08-04

    申请号:US17585794

    申请日:2022-01-27

    Abstract: A thin gas transportation device is provided and includes a shell, a check valve and a gas pump. The shell includes a shell surface, an accommodation slot and an outlet slot. The accommodation slot is recessed from the shell surface and includes an accommodation bottom surface. The outlet slot is recessed from the accommodation bottom surface. The check valve is disposed within the accommodation slot and includes a barrier plate and a valve plate. The barrier plate is disposed on the accommodation bottom surface and covers the outlet slot. The barrier plate includes a first surface, a second surface, a protruding part and a plurality of perforations. The protruding part is protruding from the second surface and located at the outlet slot. The valve plate is coupled to the second surface, and the protruding part abuts against the valve part and seals the valve hole.

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