公开(公告)号：US20250069919A1

公开(公告)日：2025-02-27

申请号：US18941170

申请日：2024-11-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joonyong PARK ,  Dongho KIM ,  Hyunjoon KIM ,  Seogwoo HONG ,  Kyungwook HWANG ,  Junsik HWANG

IPC: H01L21/67 ,  H01L21/673 ,  H01L33/00

Abstract: Provided is a dispenser for a solution including a reservoir configured to hold a suspension of micro light-emitting diodes (LEDs) suspended in a solvent; a stirrer configured to stir the suspension in the reservoir; a discharge path including a first valve configured to control outflow of the suspension from the reservoir; a filling path including a second valve configured to control inflow of the suspension into the reservoir; a hydraulic path including a third valve configured to control a pressure inside the reservoir; and a washing path connected to the first valve and configured to input a washing fluid for washing the discharge path into the discharge path, wherein the first valve includes a multi-way valve configured to selectively connect the discharge path to one of the reservoir and the washing path.

公开(公告)号：US20240241799A1

公开(公告)日：2024-07-18

申请号：US18618711

申请日：2024-03-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Haewook LEE ,  Hyunjoon KIM ,  Kwanhee JEONG ,  Hyojong KIM

IPC: G06F11/14

CPC classification number: G06F11/1469

Abstract: An electronic device may comprise memory for storing a file obtained by compressing a file including at least one module as a package, and a processor, wherein the processor: generates an uncompressed file by decompressing the compressed file; stores the generated uncompressed file in the memory; during booting of the electronic device, identifies whether deformation has occurred in the uncompressed file; and in response to the occurrence of deformation in the uncompressed file, performs a recovery operation for the uncompressed file. A method comprises: generating an uncompressed file by decompressing a file obtained by compressing a file including at least one module as a package; storing the generated uncompressed file in a memory; during booting of the electronic device, identifying whether deformation has occurred in the uncompressed file; and in response to the occurrence of deformation in the uncompressed file, performing a recovery operation for the uncompressed file.

公开(公告)号：US20240079395A1

公开(公告)日：2024-03-07

申请号：US18114039

申请日：2023-02-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joonyong Park ,  Dongho KIM ,  Hyunjoon KIM ,  Seogwoo HONG ,  Hyungwook HWANG ,  Junsik HWANG

IPC: H01L25/13 ,  H01L21/673

CPC classification number: H01L25/13 ,  H01L21/67333

Abstract: A method of mass-transferring a plurality of micro semiconductor chips, including mass-transferring a plurality of first micro semiconductor chips onto a first substrate such that they are disposed in a plurality of first grooves of the first substrate; determining whether an empty first groove is present; and positioning a second micro semiconductor chip in the empty first groove, wherein the positioning may include transferring a plurality of second micro semiconductor chips onto a second substrate separate from the first substrate; and adsorbing the second micro semiconductor chip from the second substrate, and positioning the adsorbed second micro semiconductor chip in the empty first groove, using an electrostatic force or an electromagnetic force.

公开(公告)号：US20240006199A1

公开(公告)日：2024-01-04

申请号：US18086992

申请日：2022-12-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyunjoon KIM ,  Kyungwook HWANG ,  Dongkyun KIM ,  Dongho KIM ,  Joonyong PARK ,  Minchul YU ,  Seogwoo HONG ,  Junsik HWANG

IPC: H01L21/67 ,  H01L21/673 ,  H01L21/68

CPC classification number: H01L21/67132 ,  H01L21/68 ,  H01L21/67333

Abstract: A chip wet transfer apparatus includes a first chip supply module configured to supply a large amount of micro-semiconductor chips to a transfer substrate, a first chip alignment module configured to align the large amount of micro-semiconductor chips in a plurality of grooves, a second chip supply module configured to supply a small amount of micro-semiconductor chips, and a second chip alignment module configured to align the small amount of micro-semiconductor chips.

公开(公告)号：US20230342209A1

公开(公告)日：2023-10-26

申请号：US18343066

申请日：2023-06-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyungseok LEE ,  Jihan YUN ,  Hyunjoon KIM ,  Hyojong KIM

IPC: G06F9/50

CPC classification number: G06F9/5027

Abstract: An electronic device including a memory including an application and a plurality of services, and a processor is provided. The processor is configured to register, in a first service among the plurality of services, a service other than the first service among the plurality of services, the service being registered in an inactive state preparing for execution by the application, wherein the first service includes a list in which the service in the inactive state is registered, execute a first application using a second service among the plurality of services, confirm whether the second service is registered in the list in response to a request for the second service of the first application, and switch the second service from the inactive state to an active state, in which the second service can be executed by the application, when it is confirmed that the second service is registered in the list.

公开(公告)号：US20230154769A1

公开(公告)日：2023-05-18

申请号：US17736352

申请日：2022-05-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dongkyun KIM ,  Hyunjoon KIM ,  Joonyong PARK ,  Seogwoo HONG ,  Kyungwook HWANG

IPC: H01L21/67 ,  H01L21/673 ,  B65G51/02

CPC classification number: H01L21/67121 ,  H01L21/67333 ,  B65G51/02

Abstract: A chip transfer apparatus includes: a chip storage module in which a plurality of micro-semiconductor chips and a suspension including impurities are stored; a chip filtration module separating a first suspension including the plurality of micro-semiconductor chips and a second suspension including the impurities in the suspension; and a chip supply module configured to supply the first suspension onto the transfer substrate such that the first suspension is introduced from the chip filtration module and the plurality of micro-semiconductor chips are flowable on the transfer substrate.

公开(公告)号：US20220344542A1

公开(公告)日：2022-10-27

申请号：US17591772

申请日：2022-02-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyunjoon KIM ,  Seogwoo Hong ,  Kyungwook Hwang ,  Dongho Kim ,  Joonyong Park ,  Junsik Hwang

IPC: H01L33/38 ,  H01L33/10 ,  H01L33/62 ,  H01L33/20 ,  H01L25/075

Abstract: A light-emitting device may include a light-emitting cell emitting first-color light and second-color light, an insulating layer having a flat upper surface while covering the light-emitting cell, a first trench exposing a first semiconductor layer, a second trench exposing a second semiconductor layer, a first electrode in contact with the first semiconductor layer, a second electrode in contact with the second semiconductor layer, and a third electrode in contact with a third semiconductor layer.

公开(公告)号：US20220262667A1

公开(公告)日：2022-08-18

申请号：US17736676

申请日：2022-05-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyunjoon KIM ,  Kyungwook HWANG

IPC: H01L21/683 ,  H01L25/075 ,  H01L33/20 ,  H01L33/62

Abstract: A method of aligning micro light emitting elements includes supplying the plurality of micro light emitting elements on a substrate including a plurality of grooves having different shapes, the plurality of micro light emitting elements being configured to be inserted exclusively and respectively into the plurality of grooves; respectively inserting the plurality of micro light emitting elements into the plurality of grooves; and aligning the plurality of micro light emitting elements, wherein at least one groove of the plurality of grooves has a shape that is different from a shape of a respective micro light emitting element inserted into the at least one groove.

公开(公告)号：US20220246675A1

公开(公告)日：2022-08-04

申请号：US17591934

申请日：2022-02-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyungwook HWANG ,  Seogwoo HONG ,  Junsik Hwang ,  Dongho Kim ,  Hyunjoon KIM ,  Joonyong PARK

IPC: H01L27/15 ,  H01L33/38 ,  H01L33/42

Abstract: Provided is a light-emitting device including a plurality of light-emitting cells, each of the plurality of light-emitting cells being configured to independently emit light, a common semiconductor layer provided on the plurality of light-emitting cells, a first electrode provided on the common semiconductor layer, and a plurality of second electrodes provided spaced apart from the first electrode and respectively provided on the plurality of light-emitting cells.

公开(公告)号：US20210132956A1

公开(公告)日：2021-05-06

申请号：US16635794

申请日：2018-08-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Atikant SINGH ,  Anuradha KANUKOTLA ,  Hyunjoon KIM ,  Kyungseok LEE ,  Ramalingam RAMAMOORTHY

IPC: G06F9/4401 ,  G06F9/48

Abstract: Accordingly the embodiments herein provide a method for managing scheduling of services during a boot-up process in an electronic device including a multi-core processor. The method includes determining a plurality of services initiated during the boot-up process of the electronic device. Further, the method includes registering system parameters associated with the electronic device for each one of the determined services. Further, the method includes determining whether the service is critical or non-critical for the boot-up process. Further, the method includes tagging a label data to each one of the determined services, wherein the label data represents whether the service is critical or non-critical. Further, the method includes clustering each of the services into one of an accelerating cluster and a decelerating cluster based on the registered system parameters associated with the electronic device and the tagged label data.