公开(公告)号：US20220085132A1

公开(公告)日：2022-03-17

申请号：US17361921

申请日：2021-06-29

Applicant: Samsung Display Co., Ltd.

Inventor： CHEAEUN KIM ,  JUCHAN PARK ,  SUNHO KIM

IPC: H01L27/32

Abstract: A display panel includes pixels overlapping a scan driving circuit and pixels spaced apart from the scan driving circuit. The display panel further includes a conductive pattern including a plurality of through holes, and the through holes are spaced apart in a plan view from a first electrodes of the pixels overlapping the scan driving circuit.

公开(公告)号：US20180322826A1

公开(公告)日：2018-11-08

申请号：US15870568

申请日：2018-01-12

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： SUNHEE LEE ,  SUNHO KIM ,  JUCHAN PARK ,  YOUNGGUG SEOL ,  JONGHYUN CHOI

IPC: G09G3/3225 ,  H01L51/00 ,  H01L27/32 ,  G06F1/16 ,  G06F3/041

CPC classification number: G09G3/3225 ,  G06F1/1643 ,  G06F1/1652 ,  G06F3/0412 ,  H01L27/323 ,  H01L27/3262 ,  H01L27/3267 ,  H01L27/3276 ,  H01L27/3288 ,  H01L51/0097

Abstract: A display apparatus includes: a center region that displays an image; a first edge region and a second edge region, each folded with respect to the center region; and a first corner region connected to the first edge region and the second edge region and that includes at least one folding line and a first surface and a second surface that face each other by being folded along the at least one folding line.

公开(公告)号：US20170219868A1

公开(公告)日：2017-08-03

申请号：US15485667

申请日：2017-04-12

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： HYUNWOO KOO ,  TAEWOONG KIM ,  SUNHO KIM ,  DANBI CHOI

IPC: G02F1/1333 ,  B29C70/88

CPC classification number: G02F1/133305 ,  B29C70/88 ,  B29K2079/08 ,  B29K2083/00 ,  B29L2009/00 ,  B29L2031/3475 ,  G02F1/1339 ,  G02F1/1341 ,  G02F1/134309 ,  G02F1/13439 ,  G02F1/136286 ,  G02F1/1368 ,  G02F2001/13415 ,  G02F2201/121 ,  G02F2201/123 ,  G02F2202/023 ,  G02F2202/28 ,  Y10T428/1064

Abstract: A device substrate manufacturing method includes forming a debonding layer on a carrier substrate. An inorganic adhesive layer is formed on at least a portion of the debonding layer. A process substrate is formed on the carrier substrate. A device is formed on the process substrate, and the process substrate is separated from the carrier substrate.