公开(公告)号：US20020180035A1

公开(公告)日：2002-12-05

申请号：US09916021

申请日：2001-07-26

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chien-Ping Huang ,  Tzong-Da Ho ,  Cheng-Hsu Hsiao

IPC: H01L023/10

CPC classification number: H01L24/32 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/01028 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/05599

Abstract: A semiconductor package with a heat sink is proposed, in which a chip has its first surface attached to a chip carrier, while a second surface of the chip is attached to a heat sink through an adhesive, allowing heat generated by the chip to be transmitted to the heat sink. Moreover, in a molding process, a molding resin is used to form an encapsulant for encapsulating the chip, while a top surface and side surfaces connected to the top surface of the heat sink are exposed to outside of the encapsulant, that is, the heat sink merely has its bottom surface bonded to the encapsulant. This makes the generated heat directly dissipated to the atmosphere through the heat sink. Furthermore, the top surface of the heat sink is coated with an interface layer, while adhesion between the interface layer and the molding resin is smaller than that between the heat sink and the encapsulant. This allows the molding resin remained on the interface layer to be easily removed after completing the molding process, while delamination can be prevented from occurrence between the heat sink or the chip and the encapsulant, and also the chip can be prevented from cracking due to clamping force generated during molding.

Abstract translation: 提出了具有散热器的半导体封装，其中芯片的第一表面附着到芯片载体上，而芯片的第二表面通过粘合剂附接到散热器，从而允许芯片产生的热量被传输 到散热器 此外，在成型工艺中，使用模塑树脂形成用于封装芯片的密封剂，同时连接到散热器的顶表面的顶表面和侧表面暴露于密封剂的外部，即热量 水槽只有其底表面与密封剂结合。 这使得所产生的热量通过散热器直接耗散到大气中。 此外，散热器的顶表面涂覆有界面层，而界面层和模制树脂之间的粘合力小于散热器和密封剂之间的粘合。 这允许在完成模制过程之后容易地去除界面层上的模塑树脂，同时可以防止散热片或芯片与密封剂之间发生分层，并且还可以防止芯片由于夹紧而开裂 成型时产生的力。

公开(公告)号：US20020135076A1

公开(公告)日：2002-09-26

申请号：US09946999

申请日：2001-09-05

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chien-Ping Huang ,  Chi-Chuan Wu ,  Jui-Yu Chuang ,  Lien-Chi Chan

IPC: H01L023/48

CPC classification number: H01L23/4334 ,  H01L21/565 ,  H01L23/3121 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2924/00012

Abstract: A heat sink with a collapse structure and a semiconductor device with the heat sink are proposed, in which the heat sink is in ladder-like shape due to a height difference formed between an extending portion and an body of the heat sink, and the body has at least one surface exposed to outside of the semiconductor package. The extending portion produces collapse deformation in response to stress from engagement of molds in a molding process, so as to prevent a semiconductor chip from being damaged by the stress. The heat sink directly attached to the chip allows heat generated by the chip to pass through the extending portion to the body of the heat sink, and then the heat can be dissipated through the exposed surface of the body to the outside of the semiconductor package, so as to improve the heat dissipating efficiency.

Abstract translation: 提出了具有塌陷结构的散热器和具有散热器的半导体器件，其中散热器由于散热器的延伸部分和主体之间形成的高度差而呈阶梯状，并且主体 具有暴露于半导体封装外部的至少一个表面。 延伸部分在模制过程中响应于模具接合的应力而产生塌陷变形，以防止半导体芯片被应力损坏。 直接连接到芯片的散热片允许由芯片产生的热量穿过延伸部分到达散热体的主体，然后可以将热量通过主体的暴露表面散发到半导体封装的外部， 从而提高散热效率。

公开(公告)号：US20020130398A1

公开(公告)日：2002-09-19

申请号：US10137834

申请日：2002-05-03

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chien-Ping Huang

IPC: H01L023/495 ,  H01L023/28

CPC classification number: H01L21/6835 ,  H01L23/057 ,  H01L23/3157 ,  H01L23/49575 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: Disclosed is a semiconductor package which has no resinous flash formed on lead frame and its manufacturing method. The method includes the steps of preparing a lead frame having a first surface and a second surface, attaching an adhensive tape capable of being easily removed on the second surface of the lead frame, attaching a first semiconductor chip on the lead frame and electrically connecting the first semiconductor chip with the lead frame, performing a molding process to form a resin molded block on the first surface of the lead frame for covering the first semiconductor chip, removing the adhensive tape, attaching a second semiconductor chip on the second surface and electrically connecting the second semiconductor chip with the lead frame, attaching a frame with a hollow portion on a predetermined positin of the second surface of the lead frame by an adhensive agent and containing the second semiconductor chip in the hollow portion, and bonding a covering member on the frame to seal the hollow portion for isolating the second semiconductor chip from outside.

公开(公告)号：US20020053724A1

公开(公告)日：2002-05-09

申请号：US09908238

申请日：2001-07-18

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Cheng-Yuan Lai ,  Chien-Ping Huang

IPC: H01L023/02

CPC classification number: H01L23/562 ,  H01L23/16 ,  H01L23/3128 ,  H01L23/3738 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16251 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0401 ,  H01L2924/00012

Abstract: A semiconductor package is proposed, in which a lid is attached to a semiconductor chip and appropriately spaced apart from a heat sink having a top surface thereof exposed to the outside an encapsulant, so as to prevent external moisture from condensing on the semiconductor chip and reduce a thermal stress effect on the semiconductor chip. Moreover, a thermal conductive path is reduced in a portion passing through the encapsulant, allowing the heat-dissipating efficiency to be improved. In addition, with no contact between the heat sink and the semiconductor chip, quality of the semiconductor package is assured with no damage to the semiconductor chip.