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    HIGH-FREQUENCY SIGNAL TRANSMISSION LINE
    41.
    发明申请
    HIGH-FREQUENCY SIGNAL TRANSMISSION LINE 有权
    高频信号传输线

    公开(公告)号：US20140077902A1

    公开(公告)日：2014-03-20

    申请号：US14087004

    申请日：2013-11-22

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Noburo KATO

    IPC: H01P3/08

    CPC classification number: H01P3/003 ,  H01P1/20363 ,  H01P3/08 ,  H01P3/085 ,  H03H7/38 ,  H05K1/0221 ,  H05K1/0225 ,  H05K1/0242 ,  H05K1/0253 ,  H05K1/028 ,  H05K2201/09618 ,  H05K2201/0969 ,  H05K2201/09727

    Abstract: A flexible high-frequency signal transmission line includes a dielectric body including laminated flexible dielectric layers. A signal line is provided in the dielectric body. A grounding conductor is arranged in the dielectric body to be opposed to the signal line via one of the dielectric layers. The grounding conductor is of a ladder structure including a plurality of openings and a plurality of bridges arranged alternately along the signal line. A characteristic impedance of the signal line changes between two adjacent ones of the plurality of bridges such that the characteristic impedance of the signal line rises from a minimum value to an intermediate value and to a maximum value and falls from the maximum value to the intermediate value and to the minimum value in this order.

    Abstract translation: 柔性高频信号传输线包括电介质体，其包括层叠的柔性电介质层。 信号线设置在电介质体中。 接地导体布置在电介质体中，以经由一个电介质层与信号线相对。 接地导体是梯形结构，包括沿着信号线交替布置的多个开口和多个桥。 信号线的特征阻抗在多个桥中的两个相邻桥之间变化，使得信号线的特性阻抗从最小值上升到中间值，并从最大值下降到中间值 并以此顺序达到最小值。

    Substrate integrated waveguide
    42.
    发明授权
    Substrate integrated waveguide 失效
    基板集成波导

    公开(公告)号：US08669834B2

    公开(公告)日：2014-03-11

    申请号：US12922588

    申请日：2009-03-17

    Applicant: Shi Cheng ,  Karl Henrik Kratz ,  Hanna Ali Yousef

    Inventor： Shi Cheng ,  Karl Henrik Kratz ,  Hanna Ali Yousef

    IPC: H01P3/16 ,  H01P11/00 ,  H01Q13/22

    CPC classification number: H01P3/121 ,  H01P11/002 ,  H05K1/024 ,  H05K3/002 ,  H05K3/0023 ,  H05K3/4076 ,  H05K3/42 ,  H05K2201/037 ,  H05K2201/09618 ,  H05K2203/092 ,  H05K2203/1572 ,  Y10T29/49016

    Abstract: A substrate integrated waveguide (10) comprises a top conductive layer (14) and a bottom conductive layer (15) provided on either sides a substrate (11). At least one wall (12, 13) of conductive material is provided in the substrate (11) to define, together with the top and bottom layers (14, 15), the waveguide. The at least one wall (12, 13) comprise a multitude of thin conductive wires densely arranged close to each other in the substrate (11) and having respective short ends connected to the top and bottom layers (14, 15). The high number of wires per surface unit in the wall (12, 13) effectively prevent significant amount of power leakage through the wall (12, 13) during operation of the substrate integrated waveguide (10).

    Abstract translation: 衬底集成波导（10）包括设置在衬底（11）的两侧的顶部导电层（14）和底部导电层（15）。 导电材料的至少一个壁（12,13）设置在衬底（11）中以与顶层和底层（14,15）一起限定波导。 所述至少一个壁（12,13）包括在所述基板（11）中彼此靠近彼此密集布置并且具有连接到所述顶层和底层（14,15）的相应短端的多根细导线。 在基板集成波导（10）的操作期间，每个表面单元在壁（12,13）中的大量电线有效地防止了通过壁（12,13）的大量的电力泄漏。

    Method and apparatus for reducing signal noise
    43.
    发明授权
    Method and apparatus for reducing signal noise 有权
    降低信号噪声的方法和装置

    公开(公告)号：US08664537B2

    公开(公告)日：2014-03-04

    申请号：US12643129

    申请日：2009-12-21

    Applicant: Kenneth McIlquham ,  Niyant Patel

    Inventor： Kenneth McIlquham ,  Niyant Patel

    IPC: H05K1/16

    CPC classification number: H05K1/0228 ,  H05K2201/09309 ,  H05K2201/09618 ,  H05K2201/09709

    Abstract: A printed circuit board having at least two spaced apart conductive planes. A plurality of vias extend between the two spaced apart conductive planes with the vias being electrically connected to a selected one of the two conductive planes in an alternating pattern. A differential electrical signal is connectable to the conductive planes so that the vias are alternately energized by the differential electrical signal when the differential electrical signal is connected to the conductive planes.

    Abstract translation: 一种具有至少两个间隔开的导电平面的印刷电路板。 多个通孔在两个间隔开的导电平面之间延伸，其中通孔以交替图案电连接到两个导电平面中选定的一个。 差分电信号可连接到导电平面，使得当差分电信号连接到导电平面时，通孔由差分电信号交替地激励。

    COMPACT LOW LOSS TRANSITION WITH AN INTEGRATED COUPLER
    46.
    发明申请
    COMPACT LOW LOSS TRANSITION WITH AN INTEGRATED COUPLER 有权
    紧凑的低损失过渡与一体化耦合器

    公开(公告)号：US20140022742A1

    公开(公告)日：2014-01-23

    申请号：US13944764

    申请日：2013-07-17

    Applicant: ZTE (USA) Inc.

    Inventor： Ying SHEN ,  Peng Gao

    IPC: H05K1/18

    CPC classification number: H05K1/18 ,  H01P5/107 ,  H05K1/0239 ,  H05K1/025 ,  H05K2201/09618 ,  H05K2201/0969 ,  H05K2201/10098

    Abstract: A compact transition structure includes a printed circuit board, wherein there is a rectangular region on one side of the printed circuit board and the rectangular region has a pair of long edges and a pair of short edges; a transition probe on the one side of the printed circuit board, wherein the transition probe extends into the rectangular region through a long edge of the rectangular region and has a terminal near a center of the rectangular region; and a coupler probe on the one side the printed circuit board, wherein the coupler probe extends into the rectangular region through a short edge of the rectangular region and has a terminal before the center of the rectangular region such that the coupler probe is electrically insulated from the transition probe.

    Abstract translation: 紧凑的过渡结构包括印刷电路板，其中在印刷电路板的一侧上具有矩形区域，并且矩形区域具有一对长边缘和一对短边缘; 在所述印刷电路板的一侧上的过渡探针，其中所述过渡探针通过所述矩形区域的长边延伸到所述矩形区域中，并且在所述矩形区域的中心附近具有端子; 以及在印刷电路板的一侧的耦合器探针，其中耦合器探针通过矩形区域的短边缘延伸到矩形区域中，并且在矩形区域的中心之前具有端子，使得耦合器探针与 过渡探针。

    PRINTED CIRCUIT BOARD
    48.
    发明申请
    PRINTED CIRCUIT BOARD 审中-公开
    印刷电路板

    公开(公告)号：US20130284508A1

    公开(公告)日：2013-10-31

    申请号：US13563856

    申请日：2012-08-01

    Applicant: WEI-CHIEH CHOU ,  CHUN-JEN CHEN ,  DUEN-YI HO ,  TSUNG-SHENG HUANG ,  PO-CHUAN HSIEH ,  CHUN-NENG LIAO

    Inventor： WEI-CHIEH CHOU ,  CHUN-JEN CHEN ,  DUEN-YI HO ,  TSUNG-SHENG HUANG ,  PO-CHUAN HSIEH ,  CHUN-NENG LIAO

    IPC: H05K1/11

    CPC classification number: H05K1/0216 ,  H05K2201/09618

    Abstract: A printed circuit board (PCB) includes a power layer and a signal layer. A signal line is arranged on the signal layer. A power via extends through the power layer and the signal layer, and is electrically connected to the power layer and the signal layer. A number of through holes is defined in the PCB, through the power layer and the signal layer, and arranged between the signal line and the power via. The through holes are insulated from the power via. The inside wall of the power via is made of conductive material.

    Abstract translation: 印刷电路板（PCB）包括功率层和信号层。 信号线布置在信号层上。 功率通孔延伸通过功率层和信号层，并且电连接到功率层和信号层。 在PCB中通过功率层和信号层定义了多个通孔，并布置在信号线和电源通孔之间。 通孔与电源通孔绝缘。 电源通孔的内壁由导电材料制成。

    Shielding structures for signal paths in electronic devices
    50.
    发明授权
    Shielding structures for signal paths in electronic devices 有权
    电子设备信号路径屏蔽结构

    公开(公告)号：US08385084B2

    公开(公告)日：2013-02-26

    申请号：US12962893

    申请日：2010-12-08

    Applicant: Jinbang Tang ,  Jong-Kai Lin ,  Ronald V. McBean

    Inventor： Jinbang Tang ,  Jong-Kai Lin ,  Ronald V. McBean

    IPC: H05K9/00

    CPC classification number: H05K1/0222 ,  H01L23/5225 ,  H01L2224/32225 ,  H01L2924/0002 ,  H01S5/02 ,  H01S5/0425 ,  H05K1/115 ,  H05K2201/09618 ,  Y10T29/49002 ,  H01L2924/00

    Abstract: A shielding structure is provided for shielding a signal path extending between a first layer and a second layer in an electronic device at a transition region with a transition that extends in a first direction and a second direction orthogonal to the first direction. The shielding structure includes a shielding structure portion, which includes a first shielding via in proximity to a first area of the signal path at the transition; a second shielding via in proximity to a second area of the signal path at the transition; and an area metallization electrically coupled to the first shielding via.

    Abstract translation: 提供屏蔽结构，用于屏蔽在电子器件中在第一方向和第二层之间延伸的信号路径，该过渡区域具有沿与第一方向正交的第一方向和第二方向延伸的过渡。 屏蔽结构包括屏蔽结构部分，其包括在过渡处的信号路径的第一区域附近的第一屏蔽通孔; 靠近信号路径的第二区域的第二屏蔽通道; 以及电耦合到第一屏蔽通孔的区域金属化。

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