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公开(公告)号：US09827740B2
公开(公告)日：2017-11-28
申请号：US14805898
申请日：2015-07-22
Applicant: Brewer Science Inc.
Inventor： Xiao Liu , Dongshun Bai , Tony D. Flaim , Xing-Fu Zhong , Qi Wu
IPC: B32B38/10 , B32B7/06 , B05D3/00 , B32B27/06 , B32B37/14 , C09D179/08 , H01L21/683 , C08G73/10
CPC classification number: B32B7/06 , B05D3/007 , B32B27/06 , B32B37/14 , B32B2255/26 , B32B2307/412 , B32B2405/00 , B32B2457/00 , C08G73/1014 , C08G73/1039 , C08G73/1067 , C09D179/08 , H01L21/6835 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , Y10S156/93 , Y10S156/941 , Y10T156/1158 , Y10T156/1917
Abstract: The invention broadly relates to release layer compositions that enable thin wafer handling during microelectronics manufacturing. Preferred release layers are formed from compositions comprising a polyamic acid or polyimide dissolved or dispersed in a solvent system, followed by curing and/or solvent removal at about 250° C. to about 350° C. for less than about 10 minutes, yielding a thin film. This process forms the release compositions into polyimide release layers that can be used in temporary bonding processes, and laser debonded after the desired processing has been carried out.
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公开(公告)号：US09611346B2
公开(公告)日：2017-04-04
申请号：US14292349
申请日：2014-05-30
Applicant: Brewer Science Inc.
Inventor： Marc Weimer
IPC: C08G12/00 , C08F120/58 , H01G4/32 , H01G4/18
CPC classification number: C08F120/58 , H01G4/18 , H01G4/32 , Y10T428/31855
Abstract: New polymeric dielectric materials are provided for high power capacitors, especially for mobile and weapons applications. These materials utilize aminoplast crosslinking in their polymeric structure. The aminoplast crosslinking ability of these materials allows them to be customized for a number of applications, but also allows the materials to have a higher crosslinking density, leading to higher dielectric constants, higher breakdown voltage, and higher thermal stability. These materials can be incorporated into current capacitor manufacturing schemes with little to no processing changes.
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公开(公告)号：US20160023436A1
公开(公告)日：2016-01-28
申请号：US14805898
申请日：2015-07-22
Applicant: Brewer Science Inc.
Inventor： Xiao Liu , Dongshun Bai , Tony D. Flaim , Xing-Fu Zhong , Qi Wu
CPC classification number: B32B7/06 , B05D3/007 , B32B27/06 , B32B37/14 , B32B2255/26 , B32B2307/412 , B32B2405/00 , B32B2457/00 , C08G73/1014 , C08G73/1039 , C08G73/1067 , C09D179/08 , H01L21/6835 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , Y10S156/93 , Y10S156/941 , Y10T156/1158 , Y10T156/1917
Abstract: The invention broadly relates to release layer compositions that enable thin wafer handling during microelectronics manufacturing. Preferred release layers are formed from compositions comprising a polyamic acid or polyimide dissolved or dispersed in a solvent system, followed by curing and/or solvent removal at about 250° C. to about 350° C. for less than about 10 minutes, yielding a thin film. This process forms the release compositions into polyimide release layers that can be used in temporary bonding processes, and laser debonded after the desired processing has been carried out.
Abstract translation: 本发明广泛地涉及在微电子制造期间能够实现薄晶片处理的释放层组合物。 优选的剥离层由包含溶解或分散在溶剂体系中的聚酰胺酸或聚酰亚胺的组合物形成，随后在约250℃至约350℃下固化和/或除去溶剂少于约10分钟， 薄膜。 该方法将释放组合物形成为可用于临时粘合工艺的聚酰亚胺剥离层，并且在所需的加工已经进行之后激光剥离。
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公开(公告)号：US09224631B2
公开(公告)日：2015-12-29
申请号：US14191544
申请日：2014-02-27
Applicant: Brewer Science Inc.
Inventor： Rama Puligadda , Xing-Fu Zhong , Tony D. Flaim , Jeremy McCutcheon
CPC classification number: H01L21/6835 , B32B38/0008 , B32B38/10 , B32B43/006 , H01L21/2007 , H01L21/6836 , H01L24/83 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/1461 , H01L2924/351 , Y10T156/10 , Y10T156/11 , Y10T156/1126 , Y10T428/24942 , Y10T428/26 , Y10T428/31511 , Y10T428/31551 , Y10T428/31663 , Y10T428/31721 , Y10T428/31725 , Y10T428/31935 , Y10T428/31938 , H01L2924/00
Abstract: Multiple bonding layer schemes that temporarily join semiconductor substrates are provided. In the inventive bonding scheme, at least one of the layers is directly in contact with the semiconductor substrate and at least two layers within the scheme are in direct contact with one another. The present invention provides several processing options as the different layers within the multilayer structure perform specific functions. More importantly, it will improve performance of the thin-wafer handling solution by providing higher thermal stability, greater compatibility with harsh backside processing steps, protection of bumps on the front side of the wafer by encapsulation, lower stress in the debonding step, and fewer defects on the front side.
Abstract translation: 提供临时连接半导体衬底的多个结合层方案。 在本发明的接合方案中，至少一个层直接与半导体衬底接触，且该方案中的至少两个层彼此直接接触。 本发明提供了多个处理选择，因为多层结构内的不同层执行特定的功能。 更重要的是，它将通过提供更高的热稳定性，与苛刻的背面处理步骤的更大兼容性，通过封装保护晶片正面的凸块，在脱粘步骤中降低应力和减少剥离步骤来提高薄晶片处理解决方案的性能 正面的缺陷。
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公开(公告)号：US20140356593A1
公开(公告)日：2014-12-04
申请号：US14461109
申请日：2014-08-15
Applicant: Brewer Science Inc.
Inventor： Vandana Krishnamurthy , Daniel M. Sullivan , Yubao Wang , Qin Lin , Sean Simmons
CPC classification number: B32B33/00 , B32B9/04 , B32B2255/26 , B32B2307/70 , B32B2379/08 , C08G73/00 , C08G73/1067 , C08G73/1075 , C08G73/1078 , C09D179/08 , G03F7/094 , H01L21/0332 , H01L21/3081 , Y10T428/24802 , Y10T428/24851 , Y10T428/30 , Y10T428/31623 , Y10T428/31667 , Y10T428/31681 , Y10T428/31721
Abstract: The invention described herein is directed towards spin-on carbon materials comprising polyamic acid compositions and a crosslinker in a solvent system. The materials are useful in trilayer photolithography processes. Films made with the inventive compositions are not soluble in solvents commonly used in lithographic materials, such as, but not limited to PGME, PGMEA, and cyclohexanone. However, the films can be dissolved in developers commonly used in photolithography. In one embodiment, the films can be heated at high temperatures to improve the thermal stability for high temperature processing. Regardless of the embodiment, the material can be applied to a flat/planar or patterned surface. Advantageously, the material exhibits a wiggling resistance during pattern transfer to silicon substrate using fluorocarbon etch.
Abstract translation: 本文描述的本发明涉及在溶剂体系中包含聚酰胺酸组合物和交联剂的旋涂碳材料。 这些材料在三层光刻工艺中是有用的。 用本发明组合物制成的薄膜不溶于通常用于平版印刷材料的溶剂中，例如但不限于PGME，PGMEA和环己酮。 然而，这些膜可以溶解在通常用于光刻中的显影剂中。 在一个实施方案中，可以在高温下加热膜以改善用于高温处理的热稳定性。 不管实施例如何，材料可以应用于平面/平面或图案化表面。 有利地，该材料在使用碳氟化合物蚀刻的图案转移到硅衬底期间表现出摆动阻力。
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Patent Agency Ranking
公开(公告)号：US08895230B2
公开(公告)日：2014-11-25
申请号：US13648890
申请日：2012-10-10
Applicant: Brewer Science Inc.
Inventor： Vandana Krishnamurthy , Daniel M. Sullivan , Yubao Wang , Qin Lin , Sean Simmons
IPC: G03F7/26 , C08G73/10 , G03F7/09 , H01L21/308 , H01L21/033 , C09D179/08 , C08G73/00
CPC classification number: B32B33/00 , B32B9/04 , B32B2255/26 , B32B2307/70 , B32B2379/08 , C08G73/00 , C08G73/1067 , C08G73/1075 , C08G73/1078 , C09D179/08 , G03F7/094 , H01L21/0332 , H01L21/3081 , Y10T428/24802 , Y10T428/24851 , Y10T428/30 , Y10T428/31623 , Y10T428/31667 , Y10T428/31681 , Y10T428/31721
Abstract: The invention described herein is directed towards spin-on carbon materials comprising polyamic acid compositions and a crosslinker in a solvent system. The materials are useful in trilayer photolithography processes. Films made with the inventive compositions are not soluble in solvents commonly used in lithographic materials, such as, but not limited to PGME, PGMEA, and cyclohexanone. However, the films can be dissolved in developers commonly used in photolithography. In one embodiment, the films can be heated at high temperatures to improve the thermal stability for high temperature processing. Regardless of the embodiment, the material can be applied to a flat/planar or patterned surface. Advantageously, the material exhibits a wiggling resistance during pattern transfer to silicon substrate using fluorocarbon etch.
Abstract translation: 本文描述的本发明涉及在溶剂体系中包含聚酰胺酸组合物和交联剂的旋涂碳材料。 这些材料在三层光刻工艺中是有用的。 用本发明组合物制成的薄膜不溶于通常用于平版印刷材料的溶剂中，例如但不限于PGME，PGMEA和环己酮。 然而，这些膜可以溶解在通常用于光刻中的显影剂中。 在一个实施方案中，可以在高温下加热膜以改善用于高温处理的热稳定性。 不管实施例如何，材料可以应用于平面/平面或图案化表面。 有利地，该材料在使用碳氟化合物蚀刻的图案转移到硅衬底期间表现出摆动阻力。
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公开(公告)号：US08865599B2
公开(公告)日：2014-10-21
申请号：US13672527
申请日：2012-11-08
Applicant: Brewer Science Inc.
Inventor： Dongshun Bai , Xie Shao , Michelle Fowler , Tingji Tang
IPC: H01L21/31 , H01L21/3105 , H01L21/02 , H01L21/027 , C09D127/18 , H01L29/02 , B81C1/00 , C08L33/16 , C08L33/14
CPC classification number: H01L21/31058 , B81C1/00611 , B81C2201/0119 , C08L33/14 , C08L33/16 , C09D127/18 , H01L21/02118 , H01L21/0212 , H01L21/0271 , H01L29/02 , Y10S438/958
Abstract: Planarization methods and microelectronic structures formed therefrom are disclosed. The methods and structures use planarization materials comprising fluorinated compounds or acetoacetylated compounds. The materials are self-leveling and achieve planarization over topography without the use of etching, contact planarization, chemical mechanical polishing, or other conventional planarization techniques.
Abstract translation: 公开了由此形成的平面化方法和微电子结构。 方法和结构使用包含氟化化合物或乙酰乙酰化化合物的平面化材料。 材料是自流平的，并且在不使用蚀刻，接触平面化，化学机械抛光或其它常规平面化技术的情况下实现平面化。
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58.发明申请公开(公告)号：US20130280656A1
公开(公告)日：2013-10-24
申请号：US13867815
申请日：2013-04-22
Applicant: BREWER SCIENCE INC.
Inventor： Joyce Lowes , Jinhua Dai , Alice Guerrero
IPC: G03F7/09
Abstract: Photosensitive, developer-soluble bottom anti-reflective coatings are described. Compositions and methods of forming the same are also disclosed along with resulting microelectronic structures. The anti-reflective compositions comprise a multi-functional epoxy compound having multiple epoxy moieties pendant therefrom and one or more crosslinkable chromophores bonded thereto. The compounds are dispersed or dissolved in a solvent system with a vinyl ether crosslinker and can be used to create crosslinkable and de-crosslinkable coatings for microelectronics fabrication.
Abstract translation: 描述了感光，显影剂可溶的底部抗反射涂层。 还公开了组合物及其形成方法以及所得的微电子结构。 抗反射组合物包含具有多个环氧基部分的多官能环氧化合物，和与其结合的一个或多个可交联的发色团。 化合物分散或溶解在具有乙烯基醚交联剂的溶剂体系中，并且可以用于产生用于微电子制造的可交联和去交联的涂层。
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59.发明申请FLUORINATED SILANE COATING COMPOSITIONS FOR THIN WAFER BONDING AND HANDLING 审中-公开氟化硅烷涂料组合物，用于薄膜粘结和处理公开(公告)号：US20130201635A1
公开(公告)日：2013-08-08
申请号：US13763251
申请日：2013-02-08
Applicant: BREWER SCIENCE INC.
Inventor： Gu Xu
CPC classification number: B32B7/06 , B32B7/12 , B32B2255/26 , B32B2457/00 , C09J5/00 , C09J2203/326 , H05K1/18 , Y10T428/24174 , Y10T428/24612 , Y10T428/3154 , Y10T428/31544
Abstract: This invention is related to compositions that prepare substrate surfaces to enable temporary wafer bonding during microelectronics manufacturing, especially using a zonal bonding process. This invention, which comprises compositions made from fluorinated silanes blended in a polar solvent, can be used to form surface coatings or treatments having a high contact angle with water (>85°). The resulting silane solutions are stable at room temperature for longer than one month.
Abstract translation: 本发明涉及制备衬底表面以在微电子制造期间实现临时晶片接合的组合物，特别是使用带状粘合工艺。 包含由在极性溶剂中共混的氟化硅烷制成的组合物的本发明可用于形成与水（> 85°）高接触角的表面涂层或处理。 得到的硅烷溶液在室温下稳定超过一个月。
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公开(公告)号：US20130189524A1
公开(公告)日：2013-07-25
申请号：US13747011
申请日：2013-01-22
Applicant: Brewer Science Inc.
Inventor： Molly Hladik , Michael Stroder
IPC: C09D1/00
CPC classification number: C09D1/00 , C08K3/04 , C08K3/041 , C08K7/06 , C09D5/24 , C09D7/70 , C09D171/02 , Y10T428/31507 , Y10T428/31678 , Y10T428/31993
Abstract: Novel compositions comprising polymer solutions at various viscosities are provided. The polymer solutions are preferably fugitive, so as to avoid interfering with the properties of the nanomaterials after post-processing of the CNT-containing formulations. Additives, including acid generators, are added to the polymer solutions in order to allow the polymer carrier solutions to be degraded or decomposed at temperatures low enough to allow processing of commonly-used polymer film substrates. The invention further allows the carbon nanotube solutions to be screen printed or printed via inkjet.
Abstract translation: 提供了包含各种粘度的聚合物溶液的新型组合物。 聚合物溶液优选是非挥发性的，以避免在对含CNT制剂进行后处理之后干扰纳米材料的性质。 将添加剂，包括酸发生剂加入到聚合物溶液中，以使得聚合物载体溶液在足够低的温度下降解或分解，以允许加工通常使用的聚合物膜基材。 本发明还允许通过喷墨将丝网印刷或印刷碳纳米管溶液。
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