公开(公告)号：US08664718B2

公开(公告)日：2014-03-04

申请号：US13348463

申请日：2012-01-11

Applicant: Chih-Chang Cheng ,  Fu-Yu Chu ,  Ruey-Hsin Liu ,  Hsiao-Chin Tuan

Inventor： Chih-Chang Cheng ,  Fu-Yu Chu ,  Ruey-Hsin Liu ,  Hsiao-Chin Tuan

IPC: H01L29/66

CPC classification number: H01L29/7835 ,  H01L21/26586 ,  H01L29/0634 ,  H01L29/0847 ,  H01L29/1045 ,  H01L29/1083 ,  H01L29/402 ,  H01L29/456 ,  H01L29/66659

Abstract: A power MOSFET includes a semiconductor region extending from a top surface of a semiconductor substrate into the semiconductor substrate, wherein the semiconductor region is of a first conductivity type. A gate dielectric and a gate electrode are disposed over the semiconductor region. A drift region of a second conductivity type opposite the first conductivity type extends from the top surface of the semiconductor substrate into the semiconductor substrate. A dielectric layer has a portion over and in contact with a top surface of the drift region. A conductive field plate is over the dielectric layer. A source region and a drain region are on opposite sides of the gate electrode. The drain region is in contact with the first drift region. A bottom metal layer is over the field plate.

Abstract translation: 功率MOSFET包括从半导体衬底的顶表面延伸到半导体衬底中的半导体区域，其中半导体区域是第一导电类型。 栅极电介质和栅电极设置在半导体区域上。 与第一导电类型相反的第二导电类型的漂移区域从半导体衬底的顶表面延伸到半导体衬底中。 电介质层具有在漂移区的顶表面上方并与其接触的部分。 导电场板在电介质层的上方。 源极区域和漏极区域在栅电极的相对侧上。 漏极区域与第一漂移区域接触。 底部金属层在场板上。

公开(公告)号：US08603643B2

公开(公告)日：2013-12-10

申请号：US11632029

申请日：2005-07-04

Applicant: Cheng-Fu Yu ,  Chia-Chun Chen ,  Pascal Oberndorff ,  Ker-Chang Hsieh

Inventor： Cheng-Fu Yu ,  Chia-Chun Chen ,  Pascal Oberndorff ,  Ker-Chang Hsieh

IPC: B32B15/01

CPC classification number: C25D3/32 ,  H01L2924/0002 ,  H05K3/244 ,  Y10T428/12014 ,  Y10T428/12708 ,  Y10T428/12715 ,  H01L2924/00

Abstract: The invention relates to an electronic component with Sn rich deposit layer on the part for electric connection, wherein the Sn rich deposit layer is a fine grained Sn rich deposit layer composed of grains with smaller size in the direction perpendicular to the deposit surface than in the direction parallel to the deposit surface. It also relates to a process for plating an electronic component, so as to form a Sn rich deposit layer on the part for electric connection, comprising the steps of: adjusting the composition of tin plating solution in which starter additive and brighter additive are included; moving the electronic component through the tin plating solution, so as to form a fine grained Sn rich deposit layer on the part for electric connection. As compared with the prior art, the invention can validly inhibit the whisker growth with low cost and reliable property.

Abstract translation: 本发明涉及一种用于电连接的部分上具有富Sn沉积层的电子部件，其中富Sn沉积层是由垂直于沉积物表面的方向上具有较小尺寸的晶粒构成的细晶粒富Sn沉积层， 方向平行于沉积物表面。 它还涉及一种用于电镀电子元件的方法，以便在用于电连接的部分上形成富Sn沉积层，包括以下步骤：调节包含起始添加剂和更亮添加剂的镀锡溶液的组成; 通过镀锡溶液移动电子部件，以便在电连接部件上形成细粒状的富Sn沉积层。 与现有技术相比，本发明可以有效抑制晶须生长，成本低，性能可靠。

公开(公告)号：US08108955B2

公开(公告)日：2012-02-07

申请号：US12253231

申请日：2008-10-16

Applicant: Li-Fu Yu

Inventor： Li-Fu Yu

IPC: A61H33/00

CPC classification number: A61H33/6063 ,  A61H33/60 ,  A61H2033/022

Abstract: A motor with nozzle for a massage bathtub includes a cover, a silica gel ring, a water separator, at least one vent silica gel, at least one removable nozzle, a butterfly bolt, a propeller, a seat, and a motor. The seat is installed by an air inflow pipe, and air outlets and lamp holes are formed therein. A center axle of the motor is scaled from water and a connecting hole is formed on an end of the center axle. The butterfly bolt is screwed to the connecting hole to fix the propeller. The water separator is installed above the propeller and the vent silica gel and the removable nozzle are installed to the water separator. The cover is covered onto the seat of a motor body through the silica gel ring.

Abstract translation: 具有用于按摩浴缸的喷嘴的电动机包括盖，硅胶环，水分离器，至少一个通气硅胶，至少一个可移除喷嘴，蝶形螺栓，螺旋桨，座椅和马达。 座椅由空气流入管安装，在其中形成有空气出口和灯孔。 马达的中心轴与水相比较，在中心轴的一端形成连接孔。 蝶形螺栓拧入连接孔以固定螺旋桨。 水分离器安装在螺旋桨上方，排气硅胶和可拆卸喷嘴安装在水分离器上。 盖子通过硅胶环覆盖在电机主体的座上。

公开(公告)号：USD624561S1

公开(公告)日：2010-09-28

申请号：US29329983

申请日：2008-12-24

Applicant: Li-Fu Yu

Designer： Li-Fu Yu

公开(公告)号：US20080038574A1

公开(公告)日：2008-02-14

申请号：US11632029

申请日：2005-07-04

Applicant: Cheng-Fu Yu ,  Chia-Chun Chen ,  Pascal Oberndorff ,  Ker-Chang Hsieh

Inventor： Cheng-Fu Yu ,  Chia-Chun Chen ,  Pascal Oberndorff ,  Ker-Chang Hsieh

IPC: B32B15/16 ,  C25D3/30 ,  C25D5/00

CPC classification number: C25D3/32 ,  H01L2924/0002 ,  H05K3/244 ,  Y10T428/12014 ,  Y10T428/12708 ,  Y10T428/12715 ,  H01L2924/00

Abstract: The invention relates to an electronic component with Sn rich deposit layer on the part for electric connection, wherein the Sn rich deposit layer is a fine grained Sn rich deposit layer composed of grains with smaller size in the direction perpendicular to the deposit surface than in the direction parallel to the deposit surface. It also relates to a process for plating an electronic component, so as to form a Sn rich deposit layer on the part for electric connection, comprising the steps of: adjusting the composition of tin plating solution in which starter additive and brighter additive are included; moving the electronic component through the tin plating solution, so as to form a fine grained Sn rich deposit layer on the part for electric connection. As compared with the prior art, the invention can validly inhibit the whisker growth with low cost and reliable property.

Abstract translation: 本发明涉及一种用于电连接的部分上具有富Sn沉积层的电子部件，其中富Sn沉积层是由垂直于沉积物表面的方向上具有较小尺寸的晶粒构成的细晶粒富Sn沉积层， 方向平行于沉积物表面。 它还涉及一种用于电镀电子元件的方法，以便在用于电连接的部分上形成富Sn沉积层，包括以下步骤：调节包含起始添加剂和更亮添加剂的镀锡溶液的组成; 通过镀锡溶液移动电子部件，以便在电连接部件上形成细粒状的富Sn沉积层。 与现有技术相比，本发明可以有效抑制晶须生长，成本低，性能可靠。

公开(公告)号：US07173289B1

公开(公告)日：2007-02-06

申请号：US11223654

申请日：2005-09-08

Applicant: Liang-Wen Wu ,  Ya-Ping Tsai ,  Fen-Ren Chien ,  Fu-Yu Chang ,  Cheng-Tsang Yu ,  Tzu-Chi Wen

Inventor： Liang-Wen Wu ,  Ya-Ping Tsai ,  Fen-Ren Chien ,  Fu-Yu Chang ,  Cheng-Tsang Yu ,  Tzu-Chi Wen

IPC: H01L33/00

CPC classification number: H01L33/20 ,  H01L2933/0083

Abstract: A light emitting diode (LED) structure includes a substrate with a surface and cylindrical photonic crystals, a first type doping semiconductor layer, a first electrode, a light emitting layer, a second type doping semiconductor layer and a second electrode. The first type doping semiconductor layer is formed on the substrate to cover the photonic crystals. The light emitting layer, the second type doping semiconductor layer and the second electrode are sequentially formed on a portion of the first type doping semiconductor layer. The first electrode is formed on the other portion of the first type doping semiconductor layer without being covered by the light emitting layer. Because the substrate with photonic crystals can improve the epitaxial quality of the first type doping semiconductor layer and increase the energy of the light forwardly emitting out of the LED, the light emitting efficiency of the LED is effectively enhanced.

Abstract translation: 发光二极管（LED）结构包括具有表面和圆柱形光子晶体的衬底，第一类型掺杂半导体层，第一电极，发光层，第二类型掺杂半导体层和第二电极。 第一类掺杂半导体层形成在衬底上以覆盖光子晶体。 发光层，第二类型掺杂半导体层和第二电极依次形成在第一类型掺杂半导体层的一部分上。 第一电极形成在第一型掺杂半导体层的另一部分上，而不被发光层覆盖。 由于具有光子晶体的衬底可以改善第一类型掺杂半导体层的外延质量并增加向前发射出LED的光的能量，因此有效地增强了LED的发光效率。

公开(公告)号：US06567270B2

公开(公告)日：2003-05-20

申请号：US09988094

申请日：2001-11-19

Applicant: Wen-Lo Shieh ,  Ning Huang ,  Hui-Pin Chen ,  Hua-Wen Chiang ,  Chung-Ming Chang ,  Feng-Chang Tu ,  Fu-Yu Huang ,  Hsuan-Jui Chang ,  Chia-Chieh Hu ,  Wen-Long Leu

Inventor： Wen-Lo Shieh ,  Ning Huang ,  Hui-Pin Chen ,  Hua-Wen Chiang ,  Chung-Ming Chang ,  Feng-Chang Tu ,  Fu-Yu Huang ,  Hsuan-Jui Chang ,  Chia-Chieh Hu ,  Wen-Long Leu

IPC: H05K720

CPC classification number: H01L23/055 ,  H01L23/4093 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/73253 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16315 ,  H01L2924/00

Abstract: A semiconductor chip package with cooling arrangement includes a heat sink adapted for covering at least a semiconductor chip, characterized in that said heat sink has an inverted U-shaped cross section thereby forming a recess at an inner bottom thereof adapted for covering at least a semiconductor chip and a plurality of pins extending downwardly from a circumferential lower edge of said heat sink, each of said pins being formed with a neck, an enlarged head, and an open slot separating said neck and said enlarged head into two portions, whereby the package can rapidly remove heat from the semiconductor chip, filter noise and reduce inductance.

Abstract translation: 具有冷却装置的半导体芯片封装包括适于覆盖至少半导体芯片的散热器，其特征在于，所述散热器具有倒置的U形横截面，从而在其内底部形成适于覆盖至少半导体 芯片和从所述散热器的周向下边缘向下延伸的多个销，每个所述销形成有颈部，扩大的头部和将所述颈部和所述扩大的头部分离成两部分的开口狭槽，由此包装 可以快速地从半导体芯片中去除热量，滤除噪声并降低电感。

公开(公告)号：US06368006B1

公开(公告)日：2002-04-09

申请号：US09524099

申请日：2000-03-13

Applicant: Cheng-Fan Yang ,  Yung-Fu Yu

Inventor： Cheng-Fan Yang ,  Yung-Fu Yu

IPC: B62B708

CPC classification number: B62B9/26 ,  B62B9/203 ,  Y10T403/32262 ,  Y10T403/32336 ,  Y10T403/32426

Abstract: A baby stroller having a switchable handle, a tray accessory, and an attachment device for attaching the tray accessory to the handle. The attachment device, which allows the handle to be switchable between a first forward position and a second backward position of the handle The attachment device, which allows the handle to be switchable between a first forward position and a second backward position of the handle while maintaining the tray accessory at the same horizontal level, includes: (a) a cylindrical member sleeved on the handle, the cylindrical member including a circumferential flange protruded from a side face of the cylindrical member and a first channel and a second channel formed inside the circumferential flange, the first and second channels being formed corresponding to the first forward and the second backward positions, respectively, of the handle; (b) an attachment member protruded from each side of the tray accessory, the attachment member being pivotably received by the circumferential flange of the cylindrical member; and (c) a positioning member slidably movable in the attachment member, the positioning member being structured so that it can be received in either the first or the second channel so as secure the tray accessory to the cylindrical member while allowing the handle to switch between the first forward position and the second backward position of the handle and maintaining the tray accessory at a constant horizontal level between the first and the second positions.

Abstract translation: 具有可切换手柄的婴儿车，托盘附件和用于将托盘附件附接到手柄的附接装置。 该附接装置允许把手能够在手柄的第一前进位置和第二后退位置之间切换。该附接装置允许手柄在手柄的第一向前位置和第二后退位置之间切换，同时保持 在同一水平位置的托盘附件包括：（a）套在手柄上的圆柱形构件，该圆柱形构件包括从圆柱形构件的侧面突出的圆周凸缘和形成在圆周内的第一通道和第二通道 所述第一和第二通道分别对应于手柄的第一前进位置和第二后退位置形成; （b）从所述托盘附件的每一侧突出的附接构件，所述附接构件由所述圆柱形构件的圆周凸缘可枢转地容纳; 以及（c）定位构件，其可在所述附接构件中可滑动地移动，所述定位构件被构造成使得所述定位构件能够容纳在所述第一通道或所述第二通道中，从而将所述托盘附件固定到所述圆柱形构件，同时允许所述手柄在 手柄的第一前进位置和第二后退位置，并且将托盘附件保持在第一和第二位置之间恒定的水平位置。

公开(公告)号：US06346883B1

公开(公告)日：2002-02-12

申请号：US09373134

申请日：1999-08-12

Applicant: Chih-Fu Huang ,  Hsin-Fu Yu ,  Chin-Chen Chen

Inventor： Chih-Fu Huang ,  Hsin-Fu Yu ,  Chin-Chen Chen

IPC: G08B108

CPC classification number: H04W4/90 ,  H04W76/50

Abstract: A mobile security system, which includes a warning signal transmitter unit installed in the place or equipment to be protected, an auto dialing unit having a signal receiver, and a cellular phone coupled to the auto dialing unit, wherein when the warning signal transmitter unit detects an abnormal condition, it immediately sends a warning signal to the signal receiver by radio, and the signal receiver immediately drives the auto dialing unit to dial a particular telephone number upon receipt of the warning signal, so as to inform a particular person or security center to take the necessary step. The auto dialing unit can be a mechanical design, or an electronic design as desired.

Abstract translation: 一种移动安全系统，其包括安装在要保护的场所或设备中的警告信号发射器单元，具有信号接收器的自动拨号单元和耦合到所述自动拨号单元的蜂窝电话，其中当所述警告信号发送单元检测到 异常情况下，通过无线电立即向信号接收器发送警告信号，信号接收器立即驱动自动拨号单元在接收到警告信号时拨打特定电话号码，以通知特定人员或安全中心 采取必要的步骤。 自动拨号单元可以是机械设计，或者根据需要进行电子设计。

公开(公告)号：US06274491B1

公开(公告)日：2001-08-14

申请号：US09636315

申请日：2000-08-11

Applicant: Wan Le Xie ,  Fu Yu Huang ,  Yung-Cheng Chuang ,  Ning Huang ,  Chung Ming Chang ,  Hui-Pin Chen ,  Chia-Chieh Hu ,  Feng Chang Tu ,  Hsuan Jui Chang ,  Hua Wen Chiang

Inventor： Wan Le Xie ,  Fu Yu Huang ,  Yung-Cheng Chuang ,  Ning Huang ,  Chung Ming Chang ,  Hui-Pin Chen ,  Chia-Chieh Hu ,  Feng Chang Tu ,  Hsuan Jui Chang ,  Hua Wen Chiang

IPC: H01L2144

CPC classification number: H05K3/4092 ,  H01L21/4846 ,  H01L23/49816 ,  H01L2924/0002 ,  H05K3/002 ,  H05K3/062 ,  H05K3/108 ,  H05K3/3473 ,  H05K2201/0154 ,  H05K2201/0166 ,  H05K2201/0394 ,  H01L2924/00

Abstract: A process of manufacturing thin ball array substrates includes the steps of: using a layer of polyimide film as a carrier, electroplating a thin copper layer on the polyimide film, electroplating a thick copper layer on the thin copper layer, applying photosensitive coating layers on both sides of the carrier, mounting two masks with optically transmissible circuit tracks on two sides of the carrier and then processing the carrier with exposure treatment, processing the carrier with development treatment so as to remove the photosensitive coating layers aligned with the circuit track thereby forming recessed circuit tracks on the photosensitive coating layers, electroplating a copper layer on a top of the carrier thereby forming an additional copper layer on the thick copper layer, etching a bottom of the carrier to remove the upper recessed circuit track thereon, coating the copper layer on the upper recessed circuit track with soldering metallic material so as to make a top of the soldering metallic material, washing away the photosensitive coating layers with chemical agent, and removing surplus copper layer to remain in circuit lines and the soldering metallic material, whereby a thin ball grid array substrate with thicker circuit lines without remaining electroplating lines can be obtained.

Abstract translation: 制造薄球阵列基板的方法包括以下步骤：使用聚酰亚胺膜作为载体，在聚酰亚胺膜上电镀薄铜层，在薄铜层上电镀厚铜层，在两层上施加感光涂层 在载体的两侧安装具有光学传输电路轨道的两个掩模，然后用曝光处理处理载体，通过显影处理处理载体，以除去与电路轨迹对准的感光涂层，从而形成凹陷 在光敏涂层上的电路轨迹，在载体的顶部上电镀铜层，从而在厚铜层上形成附加的铜层，蚀刻载体的底部以除去其上的凹陷电路轨道，将铜层涂覆在 具有焊接金属材料的上凹形电路轨道，以便形成顶部 用化学试剂洗涤光敏涂层，除去多余的铜层，保留在电路线和焊接金属材料中，从而可以获得具有较厚电路线而不残留电镀线的薄球栅阵列基板。