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    METHOD FOR DISCRIMINATING WAFER REGION AND WAFER REGION DISCRIMINATION APPARATUS FOR PERFORMING THE SAME
    51.
    发明申请
    METHOD FOR DISCRIMINATING WAFER REGION AND WAFER REGION DISCRIMINATION APPARATUS FOR PERFORMING THE SAME 有权

    公开(公告)号：US20240375242A1

    公开(公告)日：2024-11-14

    申请号：US18469542

    申请日：2023-09-18

    Applicant: KCTECH CO., LTD.

    Inventor： Ho Kyun LIM

    IPC: B24B49/12 ,  B24B49/06 ,  H01L21/66

    Abstract: A method of discrimination a wafer region and a wafer region discrimination apparatus performing the same are disclosed. A wafer region discrimination apparatus includes a probe including an optical sensor and configured to obtain optical spectrum signals of which signal values vary based on a thickness characteristic of a wafer at a plurality of positions on the wafer and a processor configured to identify whether a current optical spectrum signal is obtained from a die region on the wafer in which a chip is disposed using a region discrimination model based on a neural network that uses the current optical spectrum signal obtained by the probe as an input.

    POLISHING SLURRY COMPOSITION
    54.
    发明申请
    POLISHING SLURRY COMPOSITION 有权

    公开(公告)号：US20230136640A1

    公开(公告)日：2023-05-04

    申请号：US17977702

    申请日：2022-10-31

    Applicant: KCTECH CO., LTD.

    Inventor： Chang Gil KWON ,  Sung Pyo LEE

    IPC: C09G1/02 ,  H01L21/306

    Abstract: Provided is a polishing slurry composition including abrasive particles, a dispersant, a pH buffering agent, and a dishing inhibitor including at least one selected from a group consisting of a saccharides compound, an amino acid, and a mixture thereof.

    Substrate processing apparatus
    55.
    发明授权
    Substrate processing apparatus 有权

    公开(公告)号：US11612981B2

    公开(公告)日：2023-03-28

    申请号：US16575176

    申请日：2019-09-18

    Applicant: KCTECH CO., LTD.

    Inventor： Huiseong Che

    IPC: B24B49/10 ,  B24B37/005 ,  B24B53/017 ,  H01L21/67 ,  B24B37/26

    Abstract: Provided is a substrate processing apparatus. The substrate processing apparatus comprises a polishing table; a polishing pad disposed on an upper surface of the polishing table; a conditioner including a conditioner head, a disk holder movably coupled to the conditioner head in a vertical direction, and a conditioning disk mounted to the disk holder and in contact with the polishing pad; and a thickness measuring unit of obtaining the thickness of the polishing pad from the relative moving distance of the disk holder with respect to the conditioner head, wherein the information of the relative moving distance is received from sensing unit.

    SUBSTRATE TRANSFERRING SYSTEM
    57.
    发明申请
    SUBSTRATE TRANSFERRING SYSTEM 有权

    公开(公告)号：US20220274264A1

    公开(公告)日：2022-09-01

    申请号：US17583624

    申请日：2022-01-25

    Applicant: KCTECH CO., LTD.

    Inventor： Moon Gi Cho ,  Hee Sung Chae ,  Seung Eun Lee ,  Geun Sik Yun

    IPC: B25J15/00 ,  B65G49/06

    Abstract: A substrate transferring system may include a first transfer unit to transfer a substrate along a circular first orbit while rotating on a first axis perpendicular to a ground, and a second transfer unit to transfer a substrate along a circular second orbit while rotating on a second axis perpendicular to the ground, wherein the first orbit and the second orbit may overlap with each other at a first point, and at the first point, a substrate may be transferred from the first transfer unit to the second transfer unit or from the second transfer unit to the first transfer unit.

    CLEANING SOLUTION DETECTION DEVICE
    60.
    发明申请
    CLEANING SOLUTION DETECTION DEVICE 有权

    公开(公告)号：US20220126328A1

    公开(公告)日：2022-04-28

    申请号：US17505185

    申请日：2021-10-19

    Applicant: KCTECH CO., LTD.

    Inventor： Hyung Chul KIM ,  You Sun JUNG

    IPC: B08B3/02 ,  B08B5/04

    Abstract: A cleaning solution detection device includes a transfer part configured to unload and transfer a substrate having a surface to which a cleaning solution is applied when a cleaning process is completed, a detector configured to detect the cleaning solution that falls from the surface of the substrate in a process in which the substrate is unloaded and transferred by the transfer part, and a controller configured to determine whether a dangerous situation occurs due to a fall of the cleaning solution based on information detected by the detector.

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