Abstract:
Docked devices communicate wirelessly and in close proximity using multiple transmitters of Extremely High-Frequency (EHF) signals of 30-300 GHz. The devices may not be precisely aligned when docked. Tolerance of misalignment is improved by adding barriers such as solid metal blocks or rows of metal-filled vias that have a spacing of less than one-quarter the EHF wavelength. The barriers reflect EHF radiation and prevent EHF radiation from penetrating the barrier. Barriers placed between adjacent transmitters and receivers block stray electromagnetic radiation from causing cross-talk. The barriers can be placed closer to the transmitters than to the receivers to allow for a wider area for reception, permitting a wider misalignment. EHF reflecting features such as ground planes spaced a quarter-wavelength apart may be added to an end of a substrate near a connecting edge to act as a barrier and reflect electromagnetic radiation back toward an intended receiver.
Abstract:
A contactless, electromagnetic (EM) replacement for cabled Standards-based interfaces (such as USB, I2S) which handles data transfer requirements associated with the Standard, and capable of measuring and replicating relevant physical conditions on data lines so as to function compatibly and transparently with the Standard. A contactless link between devices having transceivers. A non-conducting housing enclosing the devices. A dielectric coupler facilitating communication between communications chips. Conductive paths or an inductive link providing power between devices. An audio adapter communicates over a contactless link with a source device, and via a physical link with a destination device such as a conventional headset. Power may be provided to the adapter from the source device, and by the adapter to the destination device.
Abstract:
A first connector may include a housing defining a first connector face to be positioned in a first position or a second position proximate to a second connector face of a second connector. A first extremely high frequency (EHF) communication unit may be disposed in the housing for communicating with a second EHF communication unit of the second connector when the first connector face is positioned in first or second position relative to the second connector face. A first magnet may be disposed in the housing. The first magnet may align with and repel a second magnet disposed relative to the second connector face when the first connector face is positioned in the second position. The first magnet may be configured not to align with and not to repel the second magnet when first connector face is positioned in the first position relative to the second connector face.
Abstract:
An EHF receiver that determines an initial slicing voltage level and dynamically adjusts the slicing voltage level and/or amplifier gain levels to account for characteristics of the received EHF electromagnetic data signal. The architecture includes an amplifier, detector, adaptive signal slicer, and controller. The detector includes a main detector and replica detector that convert the received EHF electromagnetic data signal into a baseband signal and a reference signal. The controller uses the baseband signal and reference signal to determine an initial slicing voltage level, and dynamically adjust the slicing voltage level and the gain settings of the amplifier to compensate for changing signal conditions.
Abstract:
EHF communication systems described herein can selectively implement any one of the USB standards by mapping appropriate USB signal conditions over an EHF contactless communication link. The EHF contactless communication link may serve as an alternative to conventional board-to-board and device-to-device connectors, and as such enables wired connection USB signaling protocols to be used in a non-wired environment provided by the EHF contactless communications link. Use of a USB protocol over the EHF communications link can be accomplished by establishing the EHF link between counterpart EHF communication units, and then by establishing the appropriate USB protocol over the link.
Abstract:
A Physical Layer (PHY) of a host system of an electronic device may be implemented as a contactless PHY (cPHY) for extremely high frequency (EHF) contactless communication and the operation of EHF transmitters (TX), receivers (RX) and transceivers (EHF-XCVR) in an extremely high frequency integrated circuit (EHF IC) of the electronic device. The Host-cPHY translates logical communications requests from the Link Layer (LINK) into hardware-specific operations to affect transmission or reception of signals over an EHF contactless link. The Link Layer (LINK) may also be optimized as a contactless Link Layer (cLINK) for EHF contactless communication. A virtualized contactless Physical Layer (VcPHY) may comprise a contactless Physical Layer (Host-cPHY), and a contactless Link Layer (cLINK) for coupling a conventional Link Layer (LINK) with the contactless Physical Layer (Host-cPHY). Multiple data streams may be transported over the EHF contactless link over a range of frequencies.
Abstract:
Embodiments discussed herein refer to systems, methods, and circuits for establishing EHF contactless communications links. The EHF contactless communication link may serve as an alternative to conventional board-to-board and device-to-device connectors. The link may be a low-latency protocol-transparent communication link capable of supporting a range of data rates. The link may be established through a close proximity coupling between devices, each including at least one EHF communication unit. Each EHF unit involved in establishing an EHF communication link may progress through a series of steps before data can be transferred between the devices. These steps may be controlled by one or more state machines that are being implemented in each EHF communication unit.
Abstract:
Communication devices for communicating using EHF electromagnetic radiation that include a dielectric lens configured to refract incident EHF electromagnetic radiation. The communication device may include an integrated circuit (IC) package that in turn includes a transducer configured to transmit and/or receive an EHF electromagnetic signal and convert between electrical signals and electromagnetic signals. The integrated circuit package also includes an integrated circuit including at least one of a transmitter circuit and a received circuit that is operatively coupled to the transducer. The dielectric lens is generally disposed so as to enhance transmission or reception of the EHF electromagnetic signal by the transducer.
Abstract:
Tightly-coupled near-field transmitter/receiver pairs are deployed such that the transmitter is disposed at a terminal portion of a first conduction path, the receiver is disposed at a terminal portion of a second conduction path, the transmitter and receiver are disposed in close proximity to each other, and the first conduction path and the second conduction path are discontiguous with respect to each other. In some embodiments of the present invention, close proximity refers to the transmitter antenna and the receiver antenna being spaced apart by a distance such that, at wavelengths of the transmitter carrier frequency, near-field coupling is obtained. In some embodiments, the transmitter and receiver are disposed on separate substrates that are moveable relative to each other. In alternative embodiments, the transmitter and receiver are disposed on the same substrate.
Abstract:
A contactless, electromagnetic (EM) replacement (substitute, alternative) for cabled (electric) Standards-based interfaces (such as, but not limited to USB) which effectively handles the data transfer requirements (such as bandwidth, speed, latency) associated with the Standard, and which is also capable of measuring and replicating relevant physical conditions (such as voltage levels) on data lines so as to function compatibly and transparently with the Standard. A contactless link may be provided between devices having transceivers. A non-conducting housing may enclose the devices. Some applications for the contactless (EM) interface are disclosed. A dielectric coupler facilitating communication between communications chips which are several meters apart. Conductive paths may provide power and ground for bus-powered devices.