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    THERMALLY CONTROLLED REAGENT RELEASE
    52.
    发明公开
    THERMALLY CONTROLLED REAGENT RELEASE 审中-公开

    公开(公告)号：US20230166264A1

    公开(公告)日：2023-06-01

    申请号：US18101513

    申请日：2023-01-25

    Applicant: Hewlett-Packard Development Company, L.P.

    Inventor： Viktor Shkolnikov ,  Chien-Hua Chen

    IPC: B01L7/00 ,  B01L3/00 ,  G01N33/543

    CPC classification number: B01L7/52 ,  B01L3/502761 ,  G01N33/54386 ,  B01L2300/12 ,  B01L2300/165 ,  B01L2300/1827 ,  B01L2400/0424 ,  B01L2400/086

    Abstract: An example system includes an array of retaining features in a microfluidic cavity, an array of thermally controlled releasing features, and a controller coupled to each releasing feature in the array of releasing feature. Each retaining feature in the array of retaining features is to position capsules at a predetermined location, the capsules having a thermally degradable shell enclosing a biological reagent therein. Each releasing feature in the array of releasing features corresponds to a retaining feature and is to selectively cause degradation of the shell of a capsule. Each releasing feature is to generate thermal energy to facilitate degradation of the shell. The controller is to selectively activate at least one releasing feature in the array of thermally controlled releasing features to release the biological reagent in the capsules positioned at the retaining feature corresponding to the activated releasing feature.

    Microfluidic devices
    53.
    发明授权
    Microfluidic devices 有权

    公开(公告)号：US11583861B2

    公开(公告)日：2023-02-21

    申请号：US16605675

    申请日：2017-10-30

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： Viktor Shkolnikov ,  Michael W Cumbie ,  Chien-Hua Chen

    IPC: B81B3/00 ,  G01N35/10 ,  B01L3/00

    Abstract: In an example implementation, a reagent storage system for a microfluidic device includes a microfluidic chamber formed in a microfluidic device. A blister pack to store a reagent includes an electrically conductive membrane barrier adjacent to the chamber. A thinned region is formed in the membrane barrier, and a conductive trace is to supply electric current to heat and melt the thinned region. Melting the thinned region is to cause the membrane barrier to open and release the reagent into the chamber.

    Fluidic die with nozzle layer electrode for fluid control
    56.
    发明授权
    Fluidic die with nozzle layer electrode for fluid control 有权

    公开(公告)号：US11541658B2

    公开(公告)日：2023-01-03

    申请号：US17251982

    申请日：2019-01-31

    Applicant: Hewlett-Packard Development Company, L.P.

    Inventor： Daryl E. Anderson ,  Eric Martin ,  James R. Przybyla ,  Chien-Hua Chen

    IPC: B41J2/14 ,  B41J2/085 ,  B41J2/09

    Abstract: One example provides a fluidic die including a semiconductor substrate, and a nozzle layer disposed on the substrate, the nozzle layer having a top surface opposite the substrate and including a nozzle formed therein, the nozzle including a fluid chamber disposed below the top surface and a nozzle orifice extending through the nozzle layer from the top surface to the fluid chamber, the fluid chamber to hold fluid, and the nozzle to eject fluid drops from the fluid chamber via the nozzle orifice. An electrode is disposed in contact with the nozzle layer about a perimeter of the nozzle orifice, the electrode to carry an electrical charge to adjust movement of electrically charged components of the fluid.

    Coplanar fluidic interconnect
    57.
    发明授权
    Coplanar fluidic interconnect 有权

    公开(公告)号：US11364496B2

    公开(公告)日：2022-06-21

    申请号：US16494160

    申请日：2017-04-21

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： Chien-Hua Chen ,  Michael W. Cumbie ,  Viktor Shkolnikov

    IPC: B01L3/00

    Abstract: An apparatus includes a polymer base layer having a surface. A die has a surface that is substantially coplanar with the surface of the polymer base layer. The die includes a fluidic actuator to control fluid flow across the surface of the die. A fluidic channel is coupled to the polymer base layer to provide a fluidic interconnect between the die and a fluidic input/output port.

    Fluid property sensor
    59.
    发明授权
    Fluid property sensor 有权

    公开(公告)号：US11318750B2

    公开(公告)日：2022-05-03

    申请号：US16605088

    申请日：2017-10-18

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： Chien-Hua Chen ,  Michael W Cumbie ,  Anthony D. Studer

    IPC: B41J2/175

    Abstract: In one example, a fluid property sensor includes an electrical circuit assembly (ECA), an elongated circuit (EC), and an external interface. The EC is attached to the ECA and includes multiple point sensors distributed along a length of the EC. The external interface is electrically coupled to a proximal end of the EC. The EC and the external interface are packaged together with an encasement on both sides of the ECA to form the fluid property sensor.

    MOLDED STRUCTURES WITH CHANNELS
    60.
    发明申请
    MOLDED STRUCTURES WITH CHANNELS 有权

    公开(公告)号：US20220111647A1

    公开(公告)日：2022-04-14

    申请号：US17312360

    申请日：2019-06-25

    Applicant: Hewlett-Packard Development Company, L.P.

    Inventor： Chien-Hua Chen ,  Michael W Cumbie ,  Michael G Groh

    IPC: B41J2/16 ,  B41J2/18 ,  B41J2/14

    Abstract: At times, devices, such as semiconductor devices, may be attached to molded structures. The molded structure may have through holes or channels through which fluids and gasses (among other things) may travel, A number of processes exist for creating molded structures with through holes or channels. For instance, build up processes, such as lithography on dry film, may be used to create molded structures with through holes or channels. Substrate bonding and/or welding may also be used to yield molded structures with through holes or channels.

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