公开(公告)号：US10556386B2

公开(公告)日：2020-02-11

申请号：US15567551

申请日：2015-07-30

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Yan Zhao ,  Jun Zeng ,  Wei Huang ,  Lihua Zhao ,  Eric G. Hanson

IPC: B33Y30/00 ,  B33Y50/02 ,  B33Y10/00 ,  B29C64/165 ,  B29C64/153 ,  B29C64/295 ,  B29C64/393 ,  B29C65/14

Abstract: In one example, a method for printing a three-dimensional (3D) object is described. The method may include a processor depositing a layer of a sinterable material on a support member, and preheating the layer of the sinterable material using a moveable radiation source. The method may further include the processor depositing a fusing agent on an imaged area of the layer of the sinterable material and fusing the imaged area of the layer of the sinterable material using the moveable radiation source.

公开(公告)号：US20190143605A1

公开(公告)日：2019-05-16

申请号：US16098106

申请日：2016-07-21

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Wei Huang ,  Lihua Zhao ,  Gary J. Dispoto

IPC: B29C64/393 ,  B29C64/153 ,  B33Y30/00 ,  B33Y70/00 ,  B33Y50/02

Abstract: A 3D object is additively formed via arranging non-conductive material relative to a receiving surface. During additive formation of the 3D object, a conductive channel is formed as part of the 3D object. In some instances, non-destructive fracture sensing is performed via measurement of an electrical parameter of the conductive channel.

公开(公告)号：US20180133975A1

公开(公告)日：2018-05-17

申请号：US15567551

申请日：2015-07-30

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Yan Zhao ,  Jun Zeng ,  Wei Huang ,  Lihua Zhao ,  Eric G. Hanson

IPC: B29C65/14 ,  B29C64/295 ,  B29C64/165 ,  B29C64/393

Abstract: In one example, a method for printing a three-dimensional (3D) object is described. The method may include a processor depositing a layer of a sinterable material on a support member, and preheating the layer of the sinterable material using a moveable radiation source. The method may further include the processor depositing a fusing agent on an imaged area of the layer of the sinterable material and fusing the imaged area of the layer of the sinterable material using the moveable radiation source.

公开(公告)号：US12115733B2

公开(公告)日：2024-10-15

申请号：US18139460

申请日：2023-04-26

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Wei Huang ,  Gary J. Dispoto

IPC: B29C64/40 ,  B29C64/165 ,  B29C64/393 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02

CPC classification number: B29C64/40 ,  B29C64/165 ,  B29C64/393 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02

Abstract: According to examples, a three-dimensional (3D) fabrication system may include a controller that may control an agent delivery system to deposit a fusing agent onto a fusing area of a layer of particles of build material. The controller may also control the agent delivery system to deposit an energy absorbing agent onto an unfused thermal support area of the layer of particles, the unfused thermal support area being located adjacent to the fusing area. The controller may further control an energy supply system to supply energy, in which supply of the energy is to cause the particles on which the fusing agent has been deposited to melt and a temperature of the particles in the unfused thermal support area to be raised to a level that is below a melting point temperature of the particles.

公开(公告)号：US20230356474A1

公开(公告)日：2023-11-09

申请号：US18139460

申请日：2023-04-26

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Wei Huang ,  Gary J. Dispoto

IPC: B29C64/165 ,  B29C64/40 ,  B29C64/393

CPC classification number: B29C64/40 ,  B29C64/165 ,  B29C64/393 ,  B33Y10/00

Abstract: According to examples, a three-dimensional (3D) fabrication system may include a controller that may control an agent delivery system to deposit a fusing agent onto a fusing area of a layer of particles of build material. The controller may also control the agent delivery system to deposit an energy absorbing agent onto an unfused thermal support area of the layer of particles, the unfused thermal support area being located adjacent to the fusing area. The controller may further control an energy supply system to supply energy, in which supply of the energy is to cause the particles on which the fusing agent has been deposited to melt and a temperature of the particles in the unfused thermal support area to be raised to a level that is below a melting point temperature of the particles.

公开(公告)号：US11660823B2

公开(公告)日：2023-05-30

申请号：US16607379

申请日：2017-10-25

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Wei Huang ,  Gary J. Dispoto

IPC: B29C64/40 ,  B29C64/165 ,  B29C64/393 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02

CPC classification number: B29C64/40 ,  B29C64/165 ,  B29C64/393 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02

Abstract: According to examples, a three-dimensional (3D) fabrication system may include a controller that may control an agent delivery system to deposit a fusing agent onto a fusing area of a layer of particles of build material. The controller may also control the agent delivery system to deposit an energy absorbing agent onto an unfused thermal support area of the layer of particles, the unfused thermal support area being located adjacent to the fusing area. The controller may further control an energy supply system to supply energy, in which supply of the energy is to cause the particles on which the fusing agent has been deposited to melt and a temperature of the particles in the unfused thermal support area to be raised to a level that is below a melting point temperature of the particles.

公开(公告)号：US20230102343A1

公开(公告)日：2023-03-30

申请号：US17911382

申请日：2020-03-26

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Wei Huang ,  Gary J. Dispoto

IPC: G05B19/4099

Abstract: In some examples, a method comprises obtaining, by an additive manufacturing device, a file compatible with the additive manufacturing device, the file comprising representations of objects and a support structure for the objects, the representation of the support structure having an identifier for identifying the support structure; and the additive manufacturing device using an additive manufacturing process and the file to manufacture the objects, the support structure, and the identifier for identifying the support structure.

公开(公告)号：US20220072770A1

公开(公告)日：2022-03-10

申请号：US17415334

申请日：2020-05-13

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Wei Huang ,  Patrick De Marcillac ,  Gary J. Dispoto

IPC: B29C64/165 ,  B29C64/171 ,  B29C64/393 ,  B29C64/40

Abstract: A hybrid connection for connecting a first portion of a three-dimensional (3D) print design to a second portion of the 3D print design may include a cross-sectional pattern of fully-fused connections and under-fused connections that connect between the first portion of the 3D print design and the second portion of the 3D print design. Systems and methods are also described herein that facilitate designing 3D parts with hybrid connections and/or automatically replacing fully-fused connections with hybrid connections.

公开(公告)号：US20220032508A1

公开(公告)日：2022-02-03

申请号：US17299651

申请日：2018-12-17

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Wei Huang ,  Gary J Dispoto

IPC: B29C33/44 ,  B29C64/165 ,  B29C64/393 ,  B22F10/10 ,  B22F3/11 ,  B22F5/00

Abstract: Breakable three dimensional (3D) printed molds are disclosed. An example method for forming a mold having a cavity by creating a plurality of layers using an additive manufacturing process includes providing a build material; and controlling a fusion level of the build material separately for different layers of the plurality of layers to separately form the layers with a porosity corresponding to a target porosity.

公开(公告)号：US20210323237A1

公开(公告)日：2021-10-21

申请号：US16605200

申请日：2018-04-30

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Wei Huang ,  Gary J. Dispoto

IPC: B29C64/393 ,  B33Y30/00 ,  B33Y50/02 ,  G05B19/4099

Abstract: According to examples, an apparatus may include a fabricating system, a processor, and on memory on which are stored machine readable instructions. The instructions, when executed by the processor, may cause the processor to control the fabricating system to spread a first layer of build material as part of an object fabrication process, the build material comprising particles or a paste. The instructions may also cause the processor to control the fabricating system to selectively solidify a first area of the layer to a higher degree of solidification than a predefined second area encompassed by the first area, in which the predefined second area has a lower fracture toughness than the first area to propagate a crack in the object more readily than the first area.