公开(公告)号：US09275916B2

公开(公告)日：2016-03-01

申请号：US13886283

申请日：2013-05-03

Applicant: Infineon Technologies AG

Inventor： Edward Fuergut ,  Irmgard Escher-Poeppel ,  Manfred Engelhardt ,  Hans-Joerg Timme ,  Hannes Eder

IPC: H01L21/66 ,  H01L21/67 ,  H01L21/784 ,  H01L23/00 ,  H01L21/683 ,  H01L21/56

CPC classification number: H01L22/24 ,  H01L21/568 ,  H01L21/67069 ,  H01L21/67253 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/784 ,  H01L22/12 ,  H01L22/26 ,  H01L22/30 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/94 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2224/82 ,  H01L2924/00

Abstract: A method of processing a plurality of packaged electronic chips being connected to one another in a common substrate is provided, wherein the method comprises etching the electronic chips, detecting information indicative of an at least partial removal of an indicator structure following an exposure of the indicator structure embedded within at least a part of the electronic chips and being exposed after the etching has removed chip material above the indicator structure, and adjusting the processing upon detecting the information indicative of the at least partial removal of the indicator structure.

Abstract translation: 提供一种处理在公共基板中彼此连接的多个封装电子芯片的方法，其中所述方法包括蚀刻所述电子芯片，检测指示在所述指示符的曝光之后至少部分移除指示符结构的信息 嵌入在电子芯片的至少一部分内并且在蚀刻之后暴露出指示器结构之上的芯片材料的结构，以及在检测到指示结构的至少部分移除的信息时调整处理。

公开(公告)号：US08993422B2

公开(公告)日：2015-03-31

申请号：US13670402

申请日：2012-11-06

Applicant: Infineon Technologies AG

Inventor： Manfred Engelhardt

IPC: H01L21/67 ,  H01L21/3065 ,  H01J37/32

CPC classification number: H01J37/32642 ,  C23C16/513 ,  H01J37/32009 ,  H01J37/32532 ,  H01J37/32651 ,  H01J37/32715 ,  H01J2237/3322 ,  H01J2237/3343 ,  H01L21/3065

Abstract: In accordance with an embodiment of the present invention, a process tool includes a chuck configured to hold a substrate. The chuck is disposed in a chamber. The process tool further includes a shielding unit with a central opening. The shielding unit is disposed in the chamber over the chuck.

Abstract translation: 根据本发明的实施例，处理工具包括配置成保持基板的卡盘。 卡盘设置在腔室中。 处理工具还包括具有中心开口的屏蔽单元。 屏蔽单元设置在卡盘上的腔室中。

公开(公告)号：US20140167192A1

公开(公告)日：2014-06-19

申请号：US14188112

申请日：2014-02-24

Applicant: Infineon Technologies AG

Inventor： Carsten von Koblinski ,  Volker Strutz ,  Manfred Engelhardt

IPC: H01L43/04 ,  H01L43/14

CPC classification number: H01L43/14 ,  H01L21/78 ,  H01L21/84 ,  H01L23/3121 ,  H01L23/3171 ,  H01L23/3178 ,  H01L23/3185 ,  H01L24/06 ,  H01L27/12 ,  H01L27/22 ,  H01L43/04 ,  H01L43/065 ,  H01L43/12 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/48091 ,  H01L2224/48463 ,  H01L2224/73265 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: In one embodiment, a semiconductor device includes a glass substrate, a semiconductor substrate disposed on the glass substrate, and a magnetic sensor disposed within and/or over the semiconductor substrate.

Abstract translation: 在一个实施例中，半导体器件包括玻璃衬底，设置在玻璃衬底上的半导体衬底和设置在半导体衬底内和/或之上的磁传感器。

公开(公告)号：US20140134829A1

公开(公告)日：2014-05-15

申请号：US13670402

申请日：2012-11-09

Applicant: INFINEON TECHNOLOGIES AG

Inventor： Manfred Engelhardt

IPC: H01L21/67 ,  H01L21/3065 ,  H01L21/02

CPC classification number: H01J37/32642 ,  C23C16/513 ,  H01J37/32009 ,  H01J37/32532 ,  H01J37/32651 ,  H01J37/32715 ,  H01J2237/3322 ,  H01J2237/3343 ,  H01L21/3065

Abstract: In accordance with an embodiment of the present invention, a process tool includes a chuck configured to hold a substrate. The chuck is disposed in a chamber. The process tool further includes a shielding unit with a central opening. The shielding unit is disposed in the chamber over the chuck.

Abstract translation: 根据本发明的实施例，处理工具包括配置成保持基板的卡盘。 卡盘设置在腔室中。 处理工具还包括具有中心开口的屏蔽单元。 屏蔽单元设置在卡盘上的腔室中。