公开(公告)号：US11688934B2

公开(公告)日：2023-06-27

申请号：US17462461

申请日：2021-08-31

Applicant: InnoLux Corporation

Inventor： Yi-Hung Lin ,  Tang-Chin Hung ,  Chia-Chi Ho ,  I-Yin Li

IPC: H01Q1/38 ,  H01Q1/36 ,  H01Q9/04 ,  H01Q3/44

CPC classification number: H01Q1/36 ,  H01Q9/0407 ,  G09G2300/0876 ,  H01Q3/44

Abstract: An antenna device is provided. The antenna device includes a first substrate, a first conductive layer, a first insulating structure, a second substrate, a second conductive layer and a liquid-crystal layer. The first conductive layer is disposed on the first substrate. The first insulating structure is disposed on the first conductive layer, and the first insulating structure includes a first region and a second region. The second substrate is disposed opposite to the first substrate. The second conductive layer is disposed on the second substrate. The liquid-crystal layer is disposed between the first conductive layer and the second conductive layer. The thickness of the first region is less than the thickness of the second region, and at least a portion of the first region is disposed in an overlapping region of the first conductive layer and the second conductive layer.

公开(公告)号：US11672081B2

公开(公告)日：2023-06-06

申请号：US16953338

申请日：2020-11-20

Applicant: InnoLux Corporation

Inventor： Hsueh-Hsuan Chou ,  Yi-Hung Lin

IPC: H05K3/02 ,  H05K3/00

CPC classification number: H05K3/027 ,  H05K3/007

Abstract: A manufacturing method of a metal structure is disclosed, which includes the following steps: forming a seed layer on a substrate; forming a patterned metal layer on the seed layer, wherein the patterned metal layer includes a metal member; forming a first patterned photoresist layer on the seed layer, wherein a thickness of the first patterned photoresist layer is less than a thickness of the patterned metal layer; and performing a first patterning process to the seed layer through the first patterned photoresist layer to form a patterned seed layer, wherein after the first patterning process, the metal member includes a first part and a second part, the first part is disposed between the patterned seed layer and the second part, and a width of the first part is greater than a width of the second part.

公开(公告)号：US20230027220A1

公开(公告)日：2023-01-26

申请号：US17960816

申请日：2022-10-05

Applicant: InnoLux Corporation

Inventor： Hsueh-Hsuan Chou ,  Chia-Chieh Fan ,  Kuan-Jen Wang ,  Cheng-Chi Wang ,  Yi-Hung Lin ,  Li-Wei Sung

IPC: H01L23/498 ,  H01L23/31 ,  H01L21/683 ,  H01L21/48 ,  H01L21/56

Abstract: The present disclosure provides a package device and a manufacturing method thereof. The package device includes an electronic device, a conductive pad having a first bottom surface, and a redistribution layer disposed between the conductive pad and the electronic device. The redistribution layer has a second bottom surface, and the conductive pad is electrically connected to the electronic device through the redistribution layer. The first bottom surface is closer to the electronic device than the second bottom in a normal direction of the electronic device.

公开(公告)号：US11488899B2

公开(公告)日：2022-11-01

申请号：US16941516

申请日：2020-07-28

Applicant: InnoLux Corporation

Inventor： Hsueh-Hsuan Chou ,  Chia-Chieh Fan ,  Kuan-Jen Wang ,  Cheng-Chi Wang ,  Yi-Hung Lin ,  Li-Wei Sung

IPC: H01L23/498 ,  H01L23/31 ,  H01L21/683 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L25/00 ,  H01L25/065

Abstract: The present disclosure provides a package device including a conductive pad, a protecting block, and a redistribution layer. The protecting block is disposed on the conductive pad. The redistribution layer is disposed on the protecting block, and the conductive pad is electrically connected to the redistribution layer through the protecting block.

公开(公告)号：US10910285B2

公开(公告)日：2021-02-02

申请号：US15943736

申请日：2018-04-03

Applicant: InnoLux Corporation

Inventor： Yi-Hung Lin ,  Chien-Chang Lu ,  Cheng-I Wu ,  Li-Wei Sung ,  Cheng-Chi Wang ,  Chin-Lung Ting

IPC: H01L23/31 ,  H01L23/00 ,  H01L27/02 ,  H01L25/065 ,  H01L27/12

Abstract: The present disclosure provides a package structure including a redistribution layer and a die. The redistribution layer includes a switch circuit portion and a redistribution portion, the switch circuit portion includes a transistor, and the redistribution portion is adjacent to the switch circuit portion. The die overlaps the redistribution portion, wherein the transistor is electrically connected to the die.

公开(公告)号：US10651549B2

公开(公告)日：2020-05-12

申请号：US16026171

申请日：2018-07-03

Applicant: InnoLux Corporation

Inventor： I-Yin Li ,  Chin-Lung Ting ,  Chia-Chi Ho ,  Yi-Hung Lin

IPC: H01Q1/40 ,  H01Q3/44 ,  H01Q1/36

Abstract: A microwave device includes a first substrate having a first surface, a first metal layer, a second substrate having a second surface corresponding to the first substrate, a second metal layer, a sealing element, a modulation material, and a fill material. The first metal layer is disposed on the first surface, and the first metal layer includes openings. The second metal layer is disposed on the second surface. The second metal layer includes electrodes corresponding to the openings. The sealing element is located between the first substrate and the second substrate. An active zone is formed by a space between the sealing element, the first substrate, and the second substrate. The modulation material is filled within the active area. The fill material is disposed in the active area. The thickness of the fill material is greater than 0.3 μm, and less than the thickness of the sealing element.