公开(公告)号：US10170196B2

公开(公告)日：2019-01-01

申请号：US15849267

申请日：2017-12-20

Applicant: Micron Technology, Inc.

Inventor： Han Zhao ,  Akira Goda ,  Krishna K. Parat ,  Aurelio Giancarlo Mauri ,  Haitao Liu ,  Toru Tanzawa ,  Shigekazu Yamada ,  Koji Sakui

IPC: G11C16/34 ,  G11C16/06 ,  G11C16/08 ,  G11C16/04 ,  G11C16/16 ,  G11C16/32 ,  G11C16/26 ,  G11C8/08

Abstract: Some embodiments include apparatuses and methods having a memory cell string including memory cells located in different levels of the apparatus and a data line coupled to the memory cell string. The memory cell string includes a pillar body associated with the memory cells. At least one of such apparatus can include a module configured to store information in a memory cell among memory cells and/or to determine a value of information stored in a memory cell among memory cells. The module can also be configured to apply a voltage having a positive value to the data line and/or a source to control a potential of the body. Other embodiments are described.

公开(公告)号：US20180190347A1

公开(公告)日：2018-07-05

申请号：US15907826

申请日：2018-02-28

Applicant: MICRON TECHNOLOGY, INC.

Inventor： Shyam Sunder Raghunathan ,  Pranav Kalavade ,  Krishna K. Parat ,  Charan Srinivasan

IPC: G11C11/56 ,  G11C16/34 ,  G11C16/04 ,  G11C16/12

CPC classification number: G11C11/5628 ,  G11C11/5642 ,  G11C16/0483 ,  G11C16/10 ,  G11C16/12 ,  G11C16/3427

Abstract: Methods of operating a memory include applying a first voltage level to control gates of a plurality of memory cells selected to be programmed while applying a second voltage level to a respective data line for each memory cell of the plurality of memory cells; increasing the voltage level applied to the respective data line for memory cells of a first subset of memory cells to a third voltage level then increasing the voltage level applied to the control gates of the plurality of memory cells to a fourth voltage level; increasing the voltage level applied to the respective data line for each memory cell of a second subset of memory cells of the plurality of memory cells to a fifth voltage level then; and after increasing the voltage level applied to the respective data line for each memory cell of the second subset of memory cells to the fifth voltage level, increasing the voltage level applied to the control gates of the plurality of memory cells to a sixth voltage level.

公开(公告)号：US20180114581A1

公开(公告)日：2018-04-26

申请号：US15849267

申请日：2017-12-20

Applicant: Micron Technology, Inc.

Inventor： Han Zhao ,  Akira Goda ,  Krishna K. Parat ,  Aurelio Giancarlo Mauri ,  Haitao Liu ,  Toru Tanzawa ,  Shigekazu Yamada ,  Koji Sakui

IPC: G11C16/34 ,  G11C16/32 ,  G11C16/04 ,  G11C16/16 ,  G11C16/08 ,  G11C16/26

CPC classification number: G11C16/3459 ,  G11C8/08 ,  G11C16/0483 ,  G11C16/06 ,  G11C16/08 ,  G11C16/16 ,  G11C16/26 ,  G11C16/32 ,  G11C16/3445 ,  G11C2213/71

Abstract: Some embodiments include apparatuses and methods having a memory cell string including memory cells located in different levels of the apparatus and a data line coupled to the memory cell string. The memory cell string includes a pillar body associated with the memory cells. At least one of such apparatus can include a module configured to store information in a memory cell among memory cells and/or to determine a value of information stored in a memory cell among memory cells. The module can also be configured to apply a voltage having a positive value to the data line and/or a source to control a potential of the body. Other embodiments are described.

公开(公告)号：US09929175B2

公开(公告)日：2018-03-27

申请号：US15397919

申请日：2017-01-04

Applicant: Micron Technology, Inc.

Inventor： Sanh D. Tang ,  Roger W. Lindsay ,  Krishna K. Parat

IPC: H01L27/115 ,  H01L27/11582 ,  H01L27/1157 ,  H01L45/00 ,  H01L27/11524

CPC classification number: H01L27/11582 ,  G11C13/0007 ,  G11C2213/11 ,  G11C2213/31 ,  G11C2213/32 ,  G11C2213/71 ,  G11C2213/75 ,  H01L23/52 ,  H01L23/528 ,  H01L27/10 ,  H01L27/101 ,  H01L27/11524 ,  H01L27/11556 ,  H01L27/1157 ,  H01L27/249 ,  H01L45/141 ,  H01L45/142 ,  H01L45/143 ,  H01L45/144 ,  H01L45/145 ,  H01L45/146 ,  H01L45/147 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method of forming circuitry components includes forming a stack of horizontally extending and vertically overlapping features. The stack has a primary portion and an end portion. At least some of the features extend farther in the horizontal direction in the end portion moving deeper into the stack in the end portion. Operative structures are formed vertically through the features in the primary portion and dummy structures are formed vertically through the features in the end portion. Horizontally elongated openings are formed through the features to form horizontally elongated and vertically overlapping lines from material of the features. The lines individually extend from the primary portion into the end portion, and individually laterally about sides of vertically extending portions of both the operative structures and the dummy structures. Sacrificial material that is elevationally between the lines is at least partially removed in the primary and end portions laterally between the horizontally elongated openings. Other aspects and implementations are disclosed.

公开(公告)号：US09780102B2

公开(公告)日：2017-10-03

申请号：US14536021

申请日：2014-11-07

Applicant: Micron Technology, Inc.

Inventor： Fatma Arzum Simsek-Ege ,  Krishna K. Parat ,  Luan C. Tran ,  Meng-Wei Kuo ,  Yushi Hu

IPC: H01L29/788 ,  H01L27/11524 ,  H01L27/1157 ,  H01L27/11582 ,  H01L27/11556 ,  H01L21/822 ,  H01L27/11578 ,  H01L27/11529 ,  H01L27/1158

CPC classification number: H01L27/11524 ,  H01L21/8221 ,  H01L27/11529 ,  H01L27/11556 ,  H01L27/1157 ,  H01L27/11578 ,  H01L27/1158 ,  H01L27/11582

Abstract: Some embodiments include apparatuses and methods having a source material, a dielectric material over the source material, a select gate material over the dielectric material, a memory cell stack over the select gate material, a conductive plug located in an opening of the dielectric material and contacting a portion of the source material, and a channel material extending through the memory cell stack and the select gate material and contacting the conductive plug.

公开(公告)号：US09754952B2

公开(公告)日：2017-09-05

申请号：US14925589

申请日：2015-10-28

Applicant: Micron Technology, Inc.

Inventor： Charles H. Dennison ,  Akira Goda ,  John Hopkins ,  Fatma Arzum Simsek-Ege ,  Krishna K. Parat

IPC: H01L27/11556 ,  H01L29/66 ,  H01L27/11578 ,  H01L21/28

Abstract: Floating gate memory cells in vertical memory. A control gate is formed between a first tier of dielectric material and a second tier of dielectric material. A floating gate is formed between the first tier of dielectric material and the second tier of dielectric material, wherein the floating gate includes a protrusion extending towards the control gate. A charge blocking structure is formed between the floating gate and the control gate, wherein at least a portion of the charge blocking structure wraps around the protrusion.

公开(公告)号：US09437608B2

公开(公告)日：2016-09-06

申请号：US14581774

申请日：2014-12-23

Applicant: Micron Technology, Inc.

Inventor： Haitao Liu ,  Akira Goda ,  Chandra Mouli ,  Krishna K. Parat

IPC: H01L29/49 ,  H01L27/115 ,  H01L29/788 ,  H01L29/792

CPC classification number: H01L29/408 ,  H01L27/11524 ,  H01L27/11556 ,  H01L27/1157 ,  H01L27/11582 ,  H01L29/7889 ,  H01L29/7926

Abstract: Some embodiments include a memory cell string having a body having a channel extending therein and in contact with a source/drain, a select gate adjacent to the body, a plurality of access lines adjacent to the body, and a dielectric in a portion of the body between the source/drain and a level corresponding to an end of the plurality of access lines most adjacent to the select gate. The dielectric in the portion of the body does not extend along an entire length of the body. Other embodiments are described and claimed.

Abstract translation: 一些实施例包括具有主体的存储单元串，该主体具有在其中延伸并与源极/漏极接触的通道，与主体相邻的选择栅极，与主体相邻的多个访问线，以及在该部分中的电介质 源极/漏极与对应于与选择栅极最相邻的多条访问线路的端部相对应的电平。 身体部分中的电介质不会沿着身体的整个长度延伸。 描述和要求保护其他实施例。

公开(公告)号：US09378839B2

公开(公告)日：2016-06-28

申请号：US14451145

申请日：2014-08-04

Applicant: Micron Technology, Inc.

Inventor： Akira Goda ,  Shafqat Ahmed ,  Khaled Hasnat ,  Krishna K. Parat

IPC: G11C16/04 ,  G11C16/34 ,  H01L27/115 ,  G11C16/26 ,  G11C16/12 ,  G11C16/14 ,  G11C16/10

CPC classification number: G11C16/0483 ,  G11C16/0408 ,  G11C16/06 ,  G11C16/10 ,  G11C16/12 ,  G11C16/14 ,  G11C16/26 ,  G11C16/3418 ,  G11C16/3427 ,  H01L27/11519 ,  H01L27/11556 ,  H01L27/11565 ,  H01L27/11582

Abstract: Apparatus and methods are disclosed, such as an apparatus that includes a string of charge storage devices associated with a pillar (e.g., of semiconductor material), a source gate device, and a source select device coupled between the source gate device and the string. Additional apparatus and methods are described.

Abstract translation: 公开了装置和方法，例如包括与柱（例如半导体材料）相关联的一串电荷存储装置的装置，源极栅极装置和耦合在源栅极装置和串之间的源选择装置。 描述附加的装置和方法。

公开(公告)号：US20150108560A1

公开(公告)日：2015-04-23

申请号：US14581774

申请日：2014-12-23

Applicant: Micron Technology, Inc.

Inventor： Haitao Liu ,  Akira Goda ,  Chandra Mouli ,  Krishna K. Parat

IPC: H01L27/115

CPC classification number: H01L29/408 ,  H01L27/11524 ,  H01L27/11556 ,  H01L27/1157 ,  H01L27/11582 ,  H01L29/7889 ,  H01L29/7926

Abstract: Some embodiments include a memory cell string having a body having a channel extending therein and in contact with a source/drain, a select gate adjacent to the body, a plurality of access lines adjacent to the body, and a dielectric in a portion of the body between the source/drain and a level corresponding to an end of the plurality of access lines most adjacent to the select gate. The dielectric in the portion of the body does not extend along an entire length of the body. Other embodiments are described and claimed.

Abstract translation: 一些实施例包括具有主体的存储单元串，该主体具有在其中延伸并与源极/漏极接触的通道，与主体相邻的选择栅极，与主体相邻的多个访问线，以及在该部分中的电介质 源极/漏极与对应于与选择栅极最相邻的多条访问线路的端部相对应的电平。 身体部分中的电介质不会沿着身体的整个长度延伸。 描述和要求保护其他实施例。

公开(公告)号：US20140340963A1

公开(公告)日：2014-11-20

申请号：US14451145

申请日：2014-08-04

Applicant: Micron Technology, Inc.

Inventor： Akira Goda ,  Shafqat Ahmed ,  Khaled Hasnat ,  Krishna K. Parat

IPC: G11C16/34 ,  G11C16/14 ,  G11C16/26 ,  G11C16/12

CPC classification number: G11C16/0483 ,  G11C16/0408 ,  G11C16/06 ,  G11C16/10 ,  G11C16/12 ,  G11C16/14 ,  G11C16/26 ,  G11C16/3418 ,  G11C16/3427 ,  H01L27/11519 ,  H01L27/11556 ,  H01L27/11565 ,  H01L27/11582

Abstract: Apparatus and methods are disclosed, such as an apparatus that includes a string of charge storage devices associated with a pillar (e.g., of semiconductor material), a source gate device, and a source select device coupled between the source gate device and the string. Additional apparatus and methods are described.

Abstract translation: 公开了装置和方法，例如包括与柱（例如半导体材料）相关联的一串电荷存储装置的装置，源极栅极装置和耦合在源栅极装置和串之间的源选择装置。 描述附加的装置和方法。