Abstract:
A composite electrode for a lithium air battery including: i) a polymerization product of a first heteroatom-containing ionic liquid or ii) a mixture of a second heteroatom-containing ionic liquid and a polymer ionic liquid represented by Formula 1:
Abstract:
Various embodiments of the present disclosure relate to an apparatus and method for controlling a differential signal of a wireless power transmitter. For example, an apparatus for controlling a differential signal of a wireless power transmitter may include a converter configured to convert a single signal into differential signals; an amplifier operably coupled to the converter and configured amplify power of the differential signals, thereby providing amplified differential signals; a gauge operably coupled to the amplifier and configured to measure a phase difference and amplitude between the amplified differential signals; and a controller for converting a pulse width of the differential signals by controlling the converter according to measurements by the gauge. Further, various embodiments of the present disclosure also include other embodiments other than the aforementioned embodiments.
Abstract:
A polymer electrolyte including: a polymer matrix including a cross-linked fluorine-containing polymer; and a liquid electrolyte embedded in the polymer matrix.
Abstract:
An electrolyte including a polymer including a repeating unit represented by Formula 1 and a lithium salt. Also a lithium air battery and a method of preparing an electrolyte.
Abstract:
A three-dimensional nonvolatile memory device and a method for fabricating the same include a semiconductor substrate, a plurality of active pillars, a plurality of gate electrodes, and a plurality of supporters. The semiconductor substrate includes a memory cell region and a contact region. The active pillars extend in the memory cell region perpendicularly to the semiconductor substrate. The gate electrodes intersect the active pillars, extend from the memory cell region to the contact region and are stacked on the semiconductor substrate. The supporters extend in the contact region perpendicularly to the semiconductor substrate to penetrate at least one or more of the gate electrodes.
Abstract:
Nonvolatile memory devices utilize vertically-stacked strings of nonvolatile memory cells (e.g., NAND-type strings) that can be selectively coupled to common source lines within a substrate. This selective coupling may be provided by lateral ground select transistors having different threshold voltages that account for different lateral spacings between the vertically-stacked strings of nonvolatile memory cells and the common source lines.
Abstract:
A polymer comprising a first repeating unit represented by Formula 1: wherein R1 to R13 and Ar1 in Formula 1 are defined in the specification.
Abstract:
Provided are three-dimensional nonvolatile memory devices and methods of fabricating the same. The memory devices include semiconductor pillars penetrating interlayer insulating layers and conductive layers alternately stacked on a substrate and electrically connected to the substrate and floating gates selectively interposed between the semiconductor pillars and the conductive layers. The floating gates are formed in recesses in the conductive layers.
Abstract:
Provided are three-dimensional nonvolatile memory devices and methods of fabricating the same. The memory devices include semiconductor pillars penetrating interlayer insulating layers and conductive layers alternately stacked on a substrate and electrically connected to the substrate and floating gates selectively interposed between the semiconductor pillars and the conductive layers. The floating gates are formed in recesses in the conductive layers.
Abstract:
Nonvolatile memory devices according to embodiments of the invention include highly integrated vertical stacks of nonvolatile memory cells. These vertical stacks of memory cells can utilize dummy memory cells to compensate for process artifacts that would otherwise yield relatively poor functioning memory cell strings when relatively large numbers of memory cells are stacked vertically on a semiconductor substrate using a plurality of vertical sub-strings electrically connected in series.