公开(公告)号：US10825698B2

公开(公告)日：2020-11-03

申请号：US15845236

申请日：2017-12-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yong-Jhin Cho ,  Young-Hoo Kim ,  Jihoon Jeong ,  Yungjun Kim ,  Kuntack Lee

IPC: H01L21/67 ,  B08B3/08 ,  H01L21/02 ,  F26B3/00 ,  F26B5/00

Abstract: Disclosed are a substrate drying apparatus, a facility of manufacturing a semiconductor device, and a method of drying a substrate. The substrate drying apparatus includes a chamber that is configured to dry a substrate at a first temperature, a first reservoir that is configured to store a first supercritical fluid at a second temperature that is less than the first temperature, a second reservoir that is configured to store a second supercritical fluid at a third temperature that is greater than the first temperature, and a supply unit connected between the chamber and the first reservoir and/or second reservoir. The supply unit is configured to supply the chamber with the first supercritical fluid and second supercritical fluid.

公开(公告)号：US20180366348A1

公开(公告)日：2018-12-20

申请号：US15845236

申请日：2017-12-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yong-Jhin Cho ,  Young-Hoo Kim ,  Jihoon Jeong ,  Yungjun Kim ,  Kuntack Lee

IPC: H01L21/67 ,  B08B3/08 ,  F26B3/00

CPC classification number: H01L21/67034 ,  B08B3/08 ,  B08B2203/007 ,  F26B3/00 ,  F26B5/005 ,  H01L21/02057 ,  H01L21/02101 ,  H01L21/6704 ,  H01L21/67051 ,  H01L21/67109 ,  H01L21/67173 ,  H01L21/67219 ,  H01L21/67248

Abstract: Disclosed are a substrate drying apparatus, a facility of manufacturing a semiconductor device, and a method of drying a substrate. The substrate drying apparatus includes a chamber that is configured to dry a substrate at a first temperature, a first reservoir that is configured to store a first supercritical fluid at a second temperature that is less than the first temperature, a second reservoir that is configured to store a second supercritical fluid at a third temperature that is greater than the first temperature, and a supply unit connected between the chamber and the first reservoir and/or second reservoir. The supply unit is configured to supply the chamber with the first supercritical fluid and second supercritical fluid.

公开(公告)号：US09677002B2

公开(公告)日：2017-06-13

申请号：US14879835

申请日：2015-10-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sang Won Bae ,  Yongsun Ko ,  Byoungho Kwon ,  Bo yun Kim ,  Hongjin Kim ,  Sungoh Park ,  Kuntack Lee ,  Hyosan Lee ,  Sol Han

IPC: C09K13/06 ,  C23F1/26 ,  H01L21/768 ,  H01L21/02 ,  H01L21/3213

CPC classification number: C09K13/06 ,  C23F1/26 ,  H01L21/02074 ,  H01L21/32134 ,  H01L21/76865 ,  H01L21/76883

Abstract: An etching composition includes about 1 wt % to about 7 wt % of hydrogen peroxide, about 20 wt % to about 80 wt % of phosphoric acid, about 0.001 wt % to about 1 wt % of an amine or amide polymer, 0 wt % to about 55 wt % of sulfuric acid, and about 10 wt % to about 45 wt % of deionized water.

公开(公告)号：US20140291421A1

公开(公告)日：2014-10-02

申请号：US14187556

申请日：2014-02-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： SeokHoon Kim ,  Yongmyung Jun ,  Yongsun Ko ,  Kyoungseob Kim ,  Jung-Min Oh ,  Kuntack Lee ,  Jihoon Jeong ,  Yong-Jhin Cho

IPC: B05B1/14

CPC classification number: H01L21/6708 ,  H01L21/67017 ,  H01L21/67051

Abstract: Provided is a substrate treating apparatus including a housing; a plurality of opening-and-closing members configured to provide a driving force for opening and closing the housing; a fluid storing member supplying a fluid to the opening-and-closing members; and a fluid distribution unit connected to the fluid storing member via a supply conduit to distribute the fluid supplied from the fluid storing member to the opening-and-closing members. The fluid distribution unit includes a distribution conduit diverging from the supply conduit and connected to a corresponding one of the opening-and-closing members; and a fluid distribution member provided at a junction between the supply conduit and the distribution conduit.

Abstract translation: 提供一种基板处理装置，包括壳体; 多个打开和关闭构件，其构造成提供用于打开和关闭壳体的驱动力; 向开闭部件供给流体的流体存储部件; 以及流体分配单元，其经由供应管道连接到流体存储构件，以将从流体存储构件供应的流体分配到打开和关闭构件。 流体分配单元包括从供应导管分支并连接到相应的一个打开和关闭构件的分配管道; 以及设置在供应管道和分配管道之间的接合处的流体分配构件。