公开(公告)号：US3066406A

公开(公告)日：1962-12-04

申请号：US68519157

申请日：1957-09-20

Applicant: BELL TELEPHONE LABOR INC

Inventor： WHITE PHILIP R

IPC: B23K1/20 ,  B23K35/28

CPC classification number: B23K35/282 ,  B23K1/20 ,  B23K2201/04 ,  B23K2201/36

公开(公告)号：US2507825A

公开(公告)日：1950-05-16

申请号：US67855946

申请日：1946-06-22

Applicant: STANLEY SMITH ELMORE

Inventor： STANLEY SMITH ELMORE

IPC: B23K11/06

CPC classification number: B23K11/061 ,  B23K2201/36

公开(公告)号：US6085968A

公开(公告)日：2000-07-11

申请号：US235579

申请日：1999-01-22

Applicant: Susan J. Swindlehurst ,  Hubert A. Vander Plas ,  Jacques Leibovitz

Inventor： Susan J. Swindlehurst ,  Hubert A. Vander Plas ,  Jacques Leibovitz

IPC: B23K3/06 ,  B23K35/14 ,  H01L21/60 ,  B23K31/02 ,  H01L21/441

CPC classification number: B23K3/0623 ,  H01L24/11 ,  B23K2201/36 ,  H01L2224/1131 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01076 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14

Abstract: A method of forming solder bumps on a wafer. The wafer includes at least one substrate, a plurality of solder-wettable pads and a solder wettable retention ring about the periphery of the wafer. The method of forming solder bumps includes forming a non-solder-wettable mask on the wafer which includes a plurality of apertures which align with the solder-wettable pads, and the solder wettable retention ring surrounds the mask. The mask and wafer are positioned within an aperture of a stencil so that the solder wettable retention ring aligns with a gap between the periphery edge of the mask and an inside edge of the aperture of the stencil. Solder paste is applied to the mask so that the solder paste fills the apertures of the mask and the gap. The solder paste is reflowed forming solder bumps on the pads and a solder ring on the solder wettable retention ring. The mask is removed after formation of the solder bumps.

Abstract translation: 在晶片上形成焊料凸块的方法。 该晶片包括至少一个衬底，多个焊料可润湿焊盘和围绕晶片周边的焊料润湿保持环。 形成焊料凸块的方法包括在晶片上形成不可焊接的可湿性掩模，该掩模包括与焊料可湿性焊盘对准的多个孔，并且焊料可润湿保持环围绕掩模。 掩模和晶片定位在模板的孔内，使得焊料可湿润保持环与掩模的周边边缘和模板的孔的内边缘之间的间隙对准。 将焊膏施加到掩模上，使得焊膏填充掩模的孔和间隙。 焊膏被回流焊接在焊盘上形成焊料凸块和焊料润湿保持环上的焊接环。 在形成焊料凸块之后，去除掩模。

公开(公告)号：US6046432A

公开(公告)日：2000-04-04

申请号：US971533

申请日：1997-11-17

Applicant: Steven W. Addison ,  Jasper J. Brown, Jr.

Inventor： Steven W. Addison ,  Jasper J. Brown, Jr.

IPC: B23K9/032 ,  H02K15/02 ,  B23K9/12 ,  H02K15/00 ,  H01R43/06

CPC classification number: H02K15/02 ,  B23K9/032 ,  B23K2201/36 ,  Y10T29/49009 ,  Y10T29/49011 ,  Y10T29/49012

Abstract: An apparatus for producing magnetically-permeable cores for use in electromechanical machines, such as electric motors. The apparatus includes a plurality of welding arbors adapted to support a stack of core laminations. A storage structure defines a plurality of arbor storage locations at which respective welding arbors are maintained. A transporter device is operative to individually move the welding arbors to and from a respective arbor storage location. A welding device is operative to weld the stack of core laminations together. A conveyor assembly is also provided for moving the welding arbors between the welding device and the transporter device.

Abstract translation: 一种制造用于诸如电动机的机电机械的导磁芯的装置。 该装置包括多个焊接臂，其适于支撑堆叠的芯层叠。 存储结构限定了保持相应焊接臂的多个心轴存储位置。 输送器装置可操作以将焊接臂单独地移动到相应的乔木储存位置并从其移出。 焊接装置可操作以将堆叠的芯片层叠在一起。 还提供了一种输送机组件，用于使焊接装置和输送装置之间的焊接臂移动。

公开(公告)号：US6035066A

公开(公告)日：2000-03-07

申请号：US458908

申请日：1995-06-02

Applicant: David J. Michael

Inventor： David J. Michael

IPC: B23K20/00 ,  G06T3/00 ,  G06K9/62

CPC classification number: H01L24/85 ,  B23K20/004 ,  G06T7/0083 ,  H01L24/48 ,  H01L24/78 ,  B23K2201/36 ,  G06T2207/20068 ,  G06T2207/30152 ,  H01L2224/05599 ,  H01L2224/48 ,  H01L2224/49171 ,  H01L2224/78301 ,  H01L2224/85399 ,  H01L2224/859 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14

Abstract: A system to find wirebonded leads by obtaining an image of the crescent formed on a lead after wire bonding, or a difference image (taken from an image of the lead before bonding and the crescent and wire formed after bonding) to create an intermediate image having the desired rotation and registration characteristics. Using a caliper or other wire-finding tool, the invention locates the wire and generates a threshold value for a boundary tracker that will make the located wire the expected width. An alternative preferred embodiment uses the gray value of an edge of the wire as the threshold. An optional artificial boundary is created as a limit for a boundary tracker. The invention then applies a boundary tracker to the intermediate image using the threshold value generated and any artificial boundary created. It then applies a corner finder that restricts starting corner orientations and analyzes the boundary and its features to find crescent tips and extrema to obtain measurements for inspection.

Abstract translation: 一种通过在引线接合之后获得在引线上形成的新月形图像或差分图像（取自接合前的引线和粘合后形成的新月形和导线）的图像来找到引线键合的系统，以产生具有 所需的旋转和配准特性。 本发明使用卡钳或其他寻线工具来定位导线，并为边界跟踪器生成一个阈值，该边界跟踪器将使定位的导线成为预期的宽度。 替代的优选实施例使用线的边缘的灰度值作为阈值。 创建可选的人造边界作为边界跟踪器的限制。 然后，本发明使用产生的阈值和创建的任何人造边界将边界跟踪器应用于中间图像。 然后，它应用一个角点查找器，限制起始角度方向，并分析边界及其特征，以找到新月形尖端和极值，以获得测量值。

公开(公告)号：US6027006A

公开(公告)日：2000-02-22

申请号：US103864

申请日：1998-06-24

Applicant: Mark Vincent Pierson

Inventor： Mark Vincent Pierson

IPC: B23K3/06 ,  H05K1/00 ,  H05K3/00 ,  H05K3/12 ,  H05K3/34 ,  B23K3/00

CPC classification number: H05K3/3484 ,  B23K3/0623 ,  B23K3/0638 ,  H05K3/1225 ,  H05K3/3478 ,  B23K2201/36 ,  B23K2201/42 ,  H05K1/0393 ,  H05K2203/0126 ,  H05K2203/041 ,  H05K2203/043 ,  H05K2203/0557 ,  H05K2203/1545 ,  H05K3/0097 ,  H05K3/1216

Abstract: A method and apparatus is disclosed for applying solder to a substrate which has a predetermined pattern of receiving pads thereon and forming solder balls from the applied solder. A conveyor is provided having a support member and a continuous metering member. The metering member has openings thereon arranged in the same preselected pattern as the solder receiving pads on the substrate. The substrate is moved into contact with the support member and the metering member, the openings in the metering member being in alignment with the solder receiving pads of the substrate. A container of solder is provided which supplies solder to the openings. The solder may be in liquid form, or in paste form, or in the form of solid solder balls. The applied solder, if in the form of paste or solid balls is melted. Thereafter, the solder is solidified on the pads to form solder balls, and the substrate is discharged from the conveyor with the solidified solder balls thereon.

Abstract translation: 公开了一种用于将焊料施加到其上具有预定图案的接收焊盘并且从所施加的焊料形成焊球的衬底的方法和装置。 提供具有支撑构件和连续计量构件的输送机。 计量构件具有与基板上的焊料接收垫相同的预选图案布置的开口。 衬底移动与支撑构件和计量构件接触，计量构件中的开口与衬底的焊料接收衬垫对齐。 提供了一种焊料容器，其向开口提供焊料。 焊料可以是液体形式，或以糊状形式，或以固体焊球的形式。 所施加的焊料，如果以糊状物或固体球的形式熔化。 此后，焊料在焊盘上固化以形成焊球，并且基板从其上的固化的焊球从输送机排出。

公开(公告)号：US5996219A

公开(公告)日：1999-12-07

申请号：US016044

申请日：1998-01-30

Applicant: Anastasios M. Golnas ,  Robert Merz ,  Fritz B. Prinz

Inventor： Anastasios M. Golnas ,  Robert Merz ,  Fritz B. Prinz

IPC: B23K1/00 ,  G01L1/22 ,  G01L1/24 ,  G02B6/36 ,  H01L23/28 ,  H01K43/00

CPC classification number: B23K1/0008 ,  G01L1/2287 ,  G01L1/24 ,  H01L23/28 ,  B23K2201/36 ,  G02B6/3624 ,  G02B6/3636 ,  H01L2924/0002 ,  Y10T29/49117

Abstract: This invention relates to a method of embedding electric components or optical components, such as sensors, in a high-temperature metal and the embedded products produced by the method. In the preferred embodiment the components are embedded on a substrate of the high-temperature metal by being placed on a first insulating layer. A second electrically insulating layer, a low thermal conductivity layer, a high thermal conductivity layer, and a primer layer are then deposited in order. The high thermal conductivity layer is in good thermal contact with the substrate. The high-temperature metal is deposited, preferably as molten drops, on the primer layer and the heat from the drops is conducted by high thermal conductivity layer to the substrate while the components are protected by the low thermal conductivity layer.

Abstract translation: 本发明涉及将电气元件或诸如传感器的光学部件嵌入高温金属中的方法以及通过该方法制造的嵌入式产品。 在优选实施例中，通过放置在第一绝缘层上将组件嵌入在高温金属的衬底上。 然后依次沉积第二电绝缘层，低导热层，高热导率层和底漆层。 高导热层与基板良好的热接触。 高温金属优选以熔滴形式沉积在底漆层上，并且来自液滴的热量通过高导热性层进行到基底，同时组分被低热导率层保护。

公开(公告)号：US5965197A

公开(公告)日：1999-10-12

申请号：US187885

申请日：1998-11-06

Applicant: Sungho Jin ,  Thomas Henry Tiefel

Inventor： Sungho Jin ,  Thomas Henry Tiefel

IPC: B23K35/02 ,  B23K35/14 ,  B23K35/26 ,  B23K35/32 ,  C22C11/06 ,  C22C13/00 ,  H01L21/60 ,  H05K3/34 ,  B05D1/12

CPC classification number: H05K3/3484 ,  B23K35/0244 ,  B23K35/26 ,  B23K2201/36 ,  B23K35/262 ,  B23K35/268 ,  B23K35/327 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2924/01322 ,  H01L2924/10253 ,  H05K2201/0209 ,  H05K2203/033 ,  H05K2203/0405 ,  H05K2203/043 ,  H05K3/3478

Abstract: New solder compositions having enhanced mechanical properties are disclosed. Relatively inert particles having a diameter of 2000 nm or less are dispersed in a solder material having an average grain size of 500 nm or less to produce such solder compositions. The dispersed particles act as physical barriers substantially impeding the motion of grain boundaries and inhibiting grain growth during thermal and stress cycling which substantially inhibits coarsening. As a consequence, the solder composition exhibits an advantageous level of superplasticity that is substantially resistant to joint failure. Methods for forming articles using such solder compositions is also disclosed.

Abstract translation: 公开了具有增强的机械性能的新的焊料组合物。 将具有2000nm以下直径的相对惰性的粒子分散在平均粒径为500nm以下的焊料中，制成这样的焊料组合物。 分散的颗粒充当实质上阻碍晶界运动并抑制热和应力循环期间的晶粒生长的物理屏障，其基本上抑制粗化。 因此，焊料组合物显示出优异的超塑性水平，其基本上抵抗接合失效。 还公开了使用这种焊料组合物形成制品的方法。

公开(公告)号：US5866867A

公开(公告)日：1999-02-02

申请号：US865605

申请日：1997-05-29

Applicant: John G. Gore

Inventor： John G. Gore

IPC: B23K11/06

CPC classification number: B23K11/061 ,  B23K2201/36

Abstract: A seam welder for sealing a cover of a surface mount package to its carrier includes a table for receiving a fixture which itself carried surface mount packages to be welded for sealing an electronic component therein. Electrical current to welding electrodes is controlled for resistance welding the cover to the carrier. Electrode temperature and table temperature and monitored. Heat exchangers including a reservoir and heat transfer fluid interface with the electrodes and the table for controlling their respective temperatures and thus the temperature of the fixture and package during the welding of the cover to the carrier. Factors affecting the quality of the weld, including temperature, time/temperature profile, the temperature of the electrode just before current starts to flow, the temperature of the package/cover and carrier combination just before current starts to flow, the difference between the package/cover and carrier combination temperature and the electrode temperature just before current starts to flow, are monitored and controlled. As a result of such monitoring and control, induced stresses typically resulting in a package because of the differing coefficients of thermal expansion for the materials used in the package are reduced during and after sealing the cover to the carrier. Seal quality and integrity is improved and the range of seal parameter tolerances tightened.

Abstract translation: 用于将表面安装封装的盖密封到其托架上的缝焊机包括用于接收固定装置的工作台，其本身承载待焊接的表面安装封装以密封其中的电子部件。 对焊接电极的电流进行控制，以将盖焊接到载体上。 电极温度和表温度进行监测。 热交换器包括储存器和传热流体与电极和工作台的接口，用于控制它们各自的温度，并因此在盖子与载体焊接期间夹具和包装件的温度。 影响焊接质量的因素，包括温度，时间/温度曲线，电流开始流动前的电极温度，电流开始流动前的封装/盖子和载体组合的温度，封装之间的差异 /盖和载体组合温度和电流开始流动之前的电极温度被监测和控制。 作为这种监测和控制的结果，由于在将盖子密封到载体上期间和之后，在包装中使用的材料的不同的热膨胀系数通常导致封装的诱导应力减小。 密封质量和完整性得到提高，密封参数公差范围得到加强。

公开(公告)号：US5829689A

公开(公告)日：1998-11-03

申请号：US788498

申请日：1997-01-28

Applicant: Okazaki Tadao ,  Maebara Yoshikazu

Inventor： Okazaki Tadao ,  Maebara Yoshikazu

IPC: B05C5/00 ,  B23K3/06 ,  H05K3/00 ,  H05K3/34 ,  B05B3/14 ,  B05B3/18

CPC classification number: B23K3/0607 ,  B23K2201/36

Abstract: An apparatus for spreading a fluid substance, includes a container containing the fluid substance and a supporting unit. A lower holding unit, connected to the supporting unit, holds a lower end of the container. An upper holding unit, connected to the supporting unit, holds an upper end of the container. A driving unit, connected to the supporting unit, drives the container up or down. A rotating unit, connected to the supporting unit, rotates the container around a vertical axis. Finally, a needle, connected to the lower holding unit, spreads the fluid substance

Abstract translation: 用于扩散流体物质的装置包括容纳流体物质的容器和支撑单元。 连接到支撑单元的下保持单元保持容器的下端。 连接到支撑单元的上保持单元保持容器的上端。 连接到支撑单元的驱动单元向上或向下驱动容器。 连接到支撑单元的旋转单元围绕垂直轴旋转容器。 最后，连接到下保持单元的针扩散流体物质