公开(公告)号：US4608941A

公开(公告)日：1986-09-02

申请号：US690140

申请日：1985-01-10

Applicant: Gilbert V. Morris

Inventor： Gilbert V. Morris

IPC: B23K1/08 ,  B23K3/06 ,  H05K3/34 ,  H05K3/22

CPC classification number: B23K3/0676 ,  B23K1/085 ,  B23K3/0653 ,  H05K3/3468 ,  B23K2201/42 ,  H05K2203/044 ,  H05K2203/081 ,  H05K2203/1509

Abstract: Apparatus for soldering printed circuit panels includes a roll configuration to convey the panels horizontally across a container carrying molten solder. The printed circuit panels are immersed in molten solder when they pass through the roll configuration. At least one air knife located at the output side of the roll configuration serves to level the molten solder on the panels as they exit from the rolls.

Abstract translation: 用于焊接印刷电路板的装置包括辊状结构，用于将面板水平地传送到承载熔融焊料的容器上。 当印刷电路板通过辊构型时，将其浸入熔融焊料中。 位于辊构造的输出侧的至少一个气刀用于使面板上的熔融焊料从辊子排出时升高。

公开(公告)号：US4595816A

公开(公告)日：1986-06-17

申请号：US645954

申请日：1984-08-31

Applicant: Richard L. Hall ,  Frieda S. Jenniches ,  James R. Kehoe ,  David G. Strong ,  Edward N. Silcott

Inventor： Richard L. Hall ,  Frieda S. Jenniches ,  James R. Kehoe ,  David G. Strong ,  Edward N. Silcott

IPC: B23K1/005 ,  B23K1/08 ,  B23K3/06 ,  H05K3/34

CPC classification number: B23K3/063 ,  B23K1/0056 ,  B23K1/08 ,  H05K3/3447 ,  H05K3/3478 ,  B23K2201/42 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/0415

Abstract: An automated program controlled discrete soldering system for plated holes of a printed wiring board, having a crucible for holding a discrete amount of solder and operable to travel in a substantial vertical path to a soldering position beneath the board. The solder is metered and deposited in the crucible prior to each application of laser energy to the crucible for melting the solder.

Abstract translation: 一种用于印刷线路板的电镀孔的自动程序控制分立焊接系统，具有用于保持离散量的焊料并可操作以在基本垂直路径上行进到板下方的焊接位置的坩埚。 在每次向坩埚施加激光能量以熔化焊料之前，将该焊料计量并沉积在坩埚中。

公开(公告)号：US4565917A

公开(公告)日：1986-01-21

申请号：US572163

申请日：1984-01-18

Applicant: Edward J. Furtek

Inventor： Edward J. Furtek

IPC: B23K1/005 ,  B23K1/008 ,  B23K1/19 ,  H05B3/62 ,  H05K3/34 ,  F27B9/06

CPC classification number: B23K1/0053 ,  B23K1/008 ,  B23K2201/42

Abstract: A multi-zone thermal process system utilizing nonfocused infrared panel emitters. An insulated housing has a plurality of zones each having separate panel emitters which heat a product load traveling through the zone and in close proximity to said panel(s) at different peak wavelengths in each zone. The panel emitters emit infrared wavelengths in the middle and far regions. The temperature differences across each zone and between the panel and product are held to a minimum. A specific application of the system is for accomplishing reflow soldering of surface mount devices to printed circuit boards.

Abstract translation: 利用非聚焦红外线面板发射器的多区域热处理系统。 绝缘壳体具有多个区域，每个区域具有单独的面板发射器，其加热穿过该区域并且在每个区域中以不同的峰值波长紧邻所述面板的产品负载。 面板发射器在中部和远部区域发射红外波长。 每个区域和面板和产品之间的温差都保持在最低限度。 该系统的具体应用是实现表面贴装器件对印刷电路板的回流焊接。

公开(公告)号：US4540114A

公开(公告)日：1985-09-10

申请号：US480057

申请日：1983-03-29

Applicant: Heino Pachschwoll

Inventor： Heino Pachschwoll

IPC: H05K3/34 ,  B23K1/08 ,  B23K3/06

CPC classification number: B23K3/0653 ,  B23K2201/42

Abstract: An apparatus for soldering workpieces (29) has a main solder bath (20) with main solder wave (15) and the workpiece (29) is brought into contact with the surface of the main solder wave. The surface can be modulated by means of at least one additional solder outlet or inlet nozzle (11), in order to solder even densely packed circuit boards without problem and with complete wetting of all solder locations (FIG. 1).

Abstract translation: 用于焊接工件（29）的装置具有主焊料槽（20），主焊料波（15）和工件（29）与主焊波的表面接触。 可以通过至少一个额外的焊料出口或入口喷嘴（11）来调节表面，以便焊接均匀密集的电路板，而无需任何问题，并且完全润湿所有的焊料位置（图1）。

公开(公告)号：US4390120A

公开(公告)日：1983-06-28

申请号：US216372

申请日：1980-12-15

Applicant: Alfred P. Broyer

Inventor： Alfred P. Broyer

IPC: B23K3/06 ,  H05K3/34 ,  B23K1/08

CPC classification number: B23K3/0653 ,  H05K3/3468 ,  B23K2201/42 ,  H05K2203/081 ,  H05K2203/1121

Abstract: Apparatus augmenting a wave soldering machine for mitigating warpage of a printed wiring board after it is processed by the soldering machine comprises heat dissipation means (200) and cooling means (202). The dissipation means directs a first gaseous stream over the a narrow, transverse strip on the underside of the board as it exits a crest of molten solder supplied by the soldering machine. The stream solidifies any liquid solder without disturbing the solder joints. The cooling means directs a second gaseous stream to substantially the centerline region of the board as it exits the dissipation means. The seriatim arrangement of heat reduction means produces a cooling characteristic which is the inverse of the temperature characteristic caused by the soldering operation.

Abstract translation: 用于减轻印刷线路板在被焊接机加工后的翘曲的波峰焊机的装置包括散热装置（200）和冷却装置（202）。 散热装置在第一气流离开由焊接机提供的熔融焊料的顶部时，将第一气流引导到板的下侧上的窄的横向条上。 流固化任何液体焊料，而不会干扰焊点。 当冷却装置离开散热装置时，冷却装置将第二气态物流引导到基板的大致中心线区域。 减热装置的串联布置产生与焊接操作引起的温度特性相反的冷却特性。

公开(公告)号：US4071367A

公开(公告)日：1978-01-31

申请号：US678931

申请日：1976-04-21

Applicant: John R. Collier ,  Yvan P. Pilette

Inventor： John R. Collier ,  Yvan P. Pilette

IPC: B23K1/20 ,  B23K3/08 ,  B29C59/02 ,  B29C63/02 ,  G03F7/16 ,  H05K3/00 ,  H05K3/28 ,  H05K3/38 ,  G03C1/72

CPC classification number: G03F7/161 ,  B23K1/20 ,  B23K3/08 ,  B29C59/022 ,  B29C63/02 ,  H05K3/281 ,  B23K2201/38 ,  B23K2201/42 ,  H05K2203/068 ,  H05K2203/0783 ,  H05K3/0079 ,  H05K3/381

Abstract: A channeled photosensitive element is described. In particular, the element has a substantially solid photosensitive, thermoplastic layer having grooves or channels therein, the layer being applied with pressure to a surface, e.g., having raised areas such as in a printed circuit board without entrapping air bubbles.

Abstract translation: 描述了通道感光元件。 特别地，元件具有在其中具有凹槽或通道的基本上固体的感光性热塑性层，该层被施加到表面的压力，例如具有凸起区域，例如在印刷电路板中，而不会夹带气泡。

公开(公告)号：US3859722A

公开(公告)日：1975-01-14

申请号：US36831873

申请日：1973-06-08

Applicant: SIEMENS AG

Inventor： KINSKY SIEGFRIED ,  SEGAERT JAN ,  MATUSCHEK MAX ,  KOEPPE WOLFGANG

IPC: B23K1/08 ,  H01L49/02 ,  H05K1/03 ,  H05K3/34

CPC classification number: H05K3/3468 ,  B23K1/08 ,  B23K2201/42 ,  H01L49/02 ,  H05K1/0306 ,  H05K2201/10636 ,  H05K2203/044 ,  H05K2203/1518 ,  H05K2203/1527 ,  H05K2203/1581 ,  Y02P70/611 ,  Y10T29/49144

Abstract: A method for dip-soldering circuit boards as, for example, ceramic substrates upon which are formed thin or thick film circuits and to which components are to be attached as, for example, miniature ceramic capacitors in which the components are attached to the board with their longitudinal axes extending in the same direction and with the portions of the conductive films to be attached to the components formed on the board so as to be right angles to the longitudinal axes of the components and wherein the board is dipped into the solder bath with an orientation such that the components are on the under-side of the board as it is emersed with the longitudinal axes of the components extending substantially horizontal and with the plane of the circuit board making an angle of approximately 45* with the surface of the solder bath. Portions of the conductive film may be treated to concentrate the solder in desired locations.

Abstract translation: 一种浸渍电路板的方法，例如是陶瓷基板，在其上形成薄膜或厚膜电路，并且组件将附接到其上，例如微型陶瓷电容器，其中部件附接到板上， 它们的纵向轴线沿相同的方向延伸并且导电膜的部分被附接到形成在板上的部件，以便与部件的纵向轴线成直角，并且其中板被浸入焊料槽中， 一种取向，使得当组件在组件的纵向轴线基本上水平延伸并且电路板的平面与焊料的表面形成大约45°的角度时，组件位于板的底侧上 浴。 可以处理部分导电膜以将焊料集中在所需位置。

公开(公告)号：US3815806A

公开(公告)日：1974-06-11

申请号：US30934072

申请日：1972-11-24

Applicant: SINGER CO

Inventor： PAXTON R

IPC: B23K3/06 ,  B23K1/00

CPC classification number: B23K3/0646 ,  B23K2201/42

Abstract: A fixture is described herein which is suitable for soldering or desoldering multiple electrical connections as might be found on a printed circuit board or on a printed wiring tape. The disclosure includes in combination a container made from a nonwetting material such as 303 Stainless Steel, connected to a source of heat such as a standard soldering iron or small solder pot. The container includes a cavity into which the solder is placed. This cavity is surrounded by a reservoir ledge which acts to restrain the overflow of solder when the leads to be soldered or unsoldered are immersed therein.

Abstract translation: 本文描述了适用于在印刷电路板或印刷线路带上可能发现的焊接或拆焊多个电连接的夹具。 本公开包括组合由与诸如标准烙铁或小焊锡锅的热源连接的诸如303不锈钢的非润湿材料制成的容器。 容器包括其中放置焊料的空腔。 该空腔被储存器凸缘包围，当将要焊接或未焊接的引线浸入其中时，其用于抑制焊料溢出。

公开(公告)号：US3726465A

公开(公告)日：1973-04-10

申请号：US3726465D

申请日：1971-01-15

Applicant: HOLLIS ENGINEERING

Inventor： BOYNTON K ,  DIGGINS T

IPC: B23K3/06 ,  B23K1/08

CPC classification number: B23K3/0653 ,  B23K2201/42

Abstract: An apparatus for producing a soldering wave having a gradually curved upper soldering surface and including a passage communicating with a reservoir of the solder through a lower intake and having a discharge opening above the level of the solder in the reservoir, a wall forming part of the passage and discharge opening over which the solder flows to form the wave, a down-wardly extending return passage having its upper intake in communication with the downstream end of the wave and its lower discharge end beneath the level of the solder in the reservoir, a downwardly sloped wall for supporting the wave between the overflow wall and the upper end of the return passage and lengthening the wave between the upstream and downstream ends thereof, and a flow regulator within the return passage to maintain a column of solder within the return passage at a height substantially above the level of the solder in the reservoir to eliminate turbulence within the wave and the return passage.

Abstract translation: 一种用于生产具有逐渐弯曲的上焊接表面的焊接波的装置，并且包括通过下部入口与焊料的储存器连通的通道，并且在储存器中的焊料的高度上方具有排出口，壁形成 通过和排出开口，焊料流过其形成波浪，一个向下延伸的返回通道，其上部入口与波浪的下游端连通，其下部排出端位于储存器中的焊料水平面下方， 向下倾斜的壁，用于支撑溢流壁和返回通道的上端之间的波浪，并且在其上游和下游端之间延长波浪，以及在返回通道内的流量调节器，以将焊料柱保持在回流通道内 大体上高于储存器中的焊料水平的高度，以消除波浪和返回通道内的湍流。

公开(公告)号：US3705457A

公开(公告)日：1972-12-12

申请号：US3705457D

申请日：1970-11-02

Applicant: ELECTROVERT MFG CO LTD

Inventor： TARDOSKEGYI LOUIS V

IPC: B23K3/06 ,  B23K31/02 ,  B23K35/38

CPC classification number: B23K3/0653 ,  B23K2201/42

Abstract: Relatively flat workpieces, such as printed circuit boards, are pretinned and soldered using the wave solder technique in which molten solder is forced upwardly through a nozzle to form a standing wave of molten solder which is gently curved in a direction parallel to the work travel direction. A flat workpiece is moved in the work travel direction with its undersurface in contact with the standing wave and, as its forward end emerges from the wave, it defines, with the surface of the wave, a space. Inert gas under pressure is supplied to this space to exclude air from the solder coated undersurface of the workpiece to inhibit oxidation thereof. The disclosure apparatus includes a nozzle for forming a one-sided standing wave, and a second nozzle is positioned above and extends in the same direction as the solder wave-forming nozzle. The second nozzle is supplied with the inert gas under pressure to be discharged over the surface of the standing wave of solder, with the inert gas flowing over the undersurface of the workpiece and exiting at the side edges thereof.

Abstract translation: 相对平坦的工件（例如印刷电路板）使用波峰焊技术进行预先焊接和焊接，其中熔融焊料被向上通过喷嘴，以形成熔融焊料的驻波，其在平行于工作行进方向的方向上轻轻地弯曲 。 平坦的工件在其工作行进方向上移动，其下表面与驻波接触，并且当其前端从波浪出来时，其与波的表面限定了一个空间。 向该空间供给压力的惰性气体，以从工件的焊料涂布的下表面排除空气，以抑制其氧化。 本公开的装置包括形成单侧驻波的喷嘴，第二喷嘴位于与焊波形成喷嘴相同的方向上方并且与其相同的方向。 向第二喷嘴供给压力下的惰性气体，以在焊料的驻波的表面上排出，惰性气体流过工件的下表面并在其侧边缘处离开。