公开(公告)号：US20180067524A1

公开(公告)日：2018-03-08

申请号：US15562063

申请日：2015-04-20

Applicant: Hewlett Packard Enterprise Development LP

Inventor： David A. Moore ,  John p. Franz ,  Wade D. Vinson

IPC: G06F1/20 ,  H05K7/20 ,  H01L23/467 ,  H01L23/40

CPC classification number: G06F1/20 ,  G06F1/203 ,  G06F2200/201 ,  H01L23/40 ,  H01L23/467 ,  H01L2023/4062 ,  H05K7/20736

Abstract: In one implementation, a system for supplemental air cooling includes a heat sink mounted to a computing device, a supplemental cooling device coupled to the heat sink by a number of heat pipes, and a fan coupled to the supplemental cooling device.

公开(公告)号：US20180046232A1

公开(公告)日：2018-02-15

申请号：US15560225

申请日：2015-04-07

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Zhikui Wang ,  Tuong Q. Tran ,  Tahir Cader ,  Chunjian Ni

IPC: G06F1/20 ,  H05K7/20

CPC classification number: G06F1/206 ,  G05D23/1919 ,  G06F2200/201 ,  H05K7/202 ,  H05K7/20281 ,  Y02D10/16

Abstract: In one implementation, a system for hybrid cooling control of a computing system includes a coordinated controller engine to: determine a number of liquid loop set-points and a number of air loop set-points, determine a number of system parameters corresponding to the number of liquid loop set-points and the number of air loop set-points, determine a correlation factor for the number of system parameters; and alter the number of liquid loop set-points and the number of air loop set-points based on the correlation factor to lower an energy consumption or to maximize energy reuse of a number of cooling resources associated with the number of system parameters,

公开(公告)号：US09826661B2

公开(公告)日：2017-11-21

申请号：US14630159

申请日：2015-02-24

Applicant: NIDEC CORPORATION

Inventor： Katsutoshi Kato ,  Takehito Tamaoka

IPC: F28F7/00 ,  H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20272 ,  G06F1/203 ,  G06F2200/201 ,  H05K7/20254 ,  H05K7/20263

Abstract: A heat module includes a heat receiving portion, a fluid channel, a fan, a radiator including heat dissipating fins and a radiator tube fluid channel, and a pump. The pump includes a stationary portion and a rotating portion. The rotating portion includes a rotor holder and a pump impeller. The pump further includes a casing, a pump fluid channel, a pump inlet, and a pump outlet. At least a portion of the rotor holder and at least a portion of the pump impeller are arranged to radially overlap with each other. The fluid channel includes a tube fluid channel. The tube fluid channel includes a pump inlet-side tube fluid channel, a pump outlet-side tube fluid channel, and a heat receiving portion tube fluid channel. No heat receiving portion tube fluid channel is arranged in the pump inlet-side tube fluid channel.

公开(公告)号：US09797408B2

公开(公告)日：2017-10-24

申请号：US14952837

申请日：2015-11-25

Applicant: Corsair Memory, Inc.

Inventor： Robert Michael Kinstle, III

IPC: H05K7/20 ,  F04D29/44 ,  F04D29/42 ,  H05K1/02 ,  F04D29/58 ,  G06F1/20

CPC classification number: F04D29/441 ,  F04D29/4226 ,  F04D29/582 ,  G06F1/20 ,  G06F2200/201 ,  H05K1/0203 ,  H05K7/20145

Abstract: A side-discharge blower fan unit with ductwork for controlling air flow is disclosed, according to certain embodiments.

公开(公告)号：US20170290202A1

公开(公告)日：2017-10-05

申请号：US15624633

申请日：2017-06-15

Applicant: Tango Tech, Inc.

Inventor： Bhavesh Shah

IPC: H05K7/20 ,  G06F13/40 ,  H05K7/14 ,  G06F1/20

CPC classification number: H05K7/20781 ,  G06F1/1632 ,  G06F1/20 ,  G06F1/206 ,  G06F13/4081 ,  G06F2200/201 ,  H05K7/1489 ,  Y02D10/14 ,  Y02D10/151 ,  Y02D10/16

Abstract: Embodiments of multiple server architecture with server modules and cooler modules wherein the server modules may be slide from the server architecture back to front to enable servers to be seated or removed transversely from a server module relative to server architecture front. Other embodiments may be described and claimed.

公开(公告)号：US20170251574A1

公开(公告)日：2017-08-31

申请号：US15595207

申请日：2017-05-15

Applicant: Elwha LLC

Inventor： Christian L. Belady ,  Douglas M. Carmean ,  William Gates ,  Shaun L. Harris ,  Roderick A. Hyde ,  Muriel Y. Ishikawa ,  Sean M. James ,  Brian A. Janous ,  Jordin T. Kare ,  Jie Liu ,  Max N. Mankin ,  Gregory J. McKnight ,  Craig J. Mundie ,  Nathan P. Myhrvold ,  Tony S. Pan ,  Clarence T. Tegreene ,  Yaroslav A. Urzhumov ,  Charles Whitmer ,  Lowell L. Wood,, JR. ,  Victoria Y.H. Wood

IPC: H05K7/20 ,  H01M8/20 ,  H01M8/18

CPC classification number: H05K7/20763 ,  G06F1/20 ,  G06F1/26 ,  G06F2200/201 ,  H01M8/18 ,  H01M8/186 ,  H01M8/188 ,  H01M8/20 ,  H05K7/20836

Abstract: A power supply system for a data center includes a cooling circuit, an electrochemical power generator, a sensor, and a processor. The cooling circuit includes a fluid configured to receive heat energy generated by a server located in the data center. The electrochemical power generator is configured to receive and/or generate the fluid of the cooling circuit and to generate electrical energy for the server using the fluid. The sensor is configured to obtain data regarding the server. The processor is configured to control an amount of heat energy transferred from the server to the fluid based on the data.

公开(公告)号：US20170227999A1

公开(公告)日：2017-08-10

申请号：US15502020

申请日：2015-08-05

Applicant: Cybula Ltd.

Inventor： James Austin

IPC: G06F1/18 ,  G06F1/20

CPC classification number: G06F1/182 ,  G06F1/1633 ,  G06F1/181 ,  G06F1/20 ,  G06F1/206 ,  G06F2200/1635 ,  G06F2200/201

Abstract: A modular computing unit 1 of a generally flat configuration has a housing (10) presenting external facets (10a, 10b), on each of which there is a respective set (11) of external electrical power and signal connectors (12) and physical coupling elements (13). The housing (10) is of generally hexagonal shape, the facets (10a, 10b) being arranged around the circumference of the hexagon. Facets (10a) are inclined upwardly at an angle and alternate with facets (10b) that are inclined downwardly at the same angle. The connector sets (11) are disposed on the facets (10a, 10b) in consistent positions and in a regular array around the housing (10). The physical coupling elements (13) are disposed within or alongside the connector sets (11). Any number of modular computing elements (1) may readily be connected to one another in various different 2D and 3D configurations, with power and signal connections via the connector sets (11).

公开(公告)号：US09721871B2

公开(公告)日：2017-08-01

申请号：US14958420

申请日：2015-12-03

Applicant: Intel Corporation

Inventor： Emery E. Frey ,  Eric D. McAfee ,  Shankar Krishnan ,  Juan G. Cevallos ,  Roger D. Flynn

IPC: H01L23/473 ,  H01L23/34 ,  H01L23/40 ,  H01L23/28 ,  H01L23/367 ,  H01L23/46 ,  B23P15/26 ,  G06F1/20 ,  H01L21/48 ,  H01L23/00 ,  H01L23/36 ,  H01L23/44

CPC classification number: H01L23/473 ,  B23P15/26 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/28 ,  H01L23/34 ,  H01L23/36 ,  H01L23/3677 ,  H01L23/40 ,  H01L23/44 ,  H01L23/46 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/1432

Abstract: Methods, apparatuses and systems associated with a heat exchanger for cooling an IC package are disclosed herein. In embodiments, a heat exchanger may include a base plate having a bottom side to be thermally coupled to the IC package, and a fin side, wherein the fin side is to include a plurality of fins to dissipate thermal energy emanated from the IC package. The heat exchanger may further include a manifold structure disposed on top of the base plate, having one or more layers, to regulate a coolant fluid flow to cool the plurality of fins, wherein the one or more layers are to include a plurality of channels and ports complementarily organized to distribute the coolant fluid flow to the plurality of fins tailored to a thermal energy emanation pattern of the integrated circuit package. Other embodiments may be described and/or claimed.

公开(公告)号：US09715260B2

公开(公告)日：2017-07-25

申请号：US15347938

申请日：2016-11-10

Applicant: Asetek Danmark A/S

Inventor： André Sloth Eriksen

IPC: G06F1/20 ,  H05K7/20 ,  F28D15/00

CPC classification number: G06F1/206 ,  F28D15/00 ,  F28F2250/08 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/20154 ,  H05K7/20263 ,  H05K7/20272

Abstract: A cooling system for a computer system comprises at least one unit such as a central processing unit (CPU) generating thermal energy and a reservoir having an amount of cooling liquid, said cooling liquid intended for accumulating and transferring of thermal energy dissipated from the processing unit to the cooling liquid. The cooling system has a heat exchanging interface for providing thermal contact between the processing unit and the cooling liquid for dissipating heat from the processing unit to the cooling liquid. Different embodiments of the heat exchanging system as well as means for establishing and controlling a flow of cooling liquid and a cooling strategy constitutes the invention of the cooling system.

公开(公告)号：US20170202112A1

公开(公告)日：2017-07-13

申请号：US15468752

申请日：2017-03-24

Applicant: FUJITSU LIMITED

Inventor： Gerhard Mühsam ,  Reinhard Salmen ,  Albert Schaur ,  Sebastian Schilling

IPC: H05K7/20

CPC classification number: H05K7/20736 ,  G06F1/181 ,  G06F1/20 ,  G06F1/206 ,  G06F2200/201 ,  H05K1/0203 ,  H05K7/20145 ,  H05K7/20172 ,  H05K7/20718 ,  H05K7/20727 ,  H05K7/20809

Abstract: A rack server that includes a housing having a front side and a rear side. A main board arranged in the housing is provided with at least one processor, on which a heat sink is arranged. Furthermore, fans are arranged in the housing upstream of the processor with respect to the insertion direction and suck cooling air into the housing via the front side and blow towards the rear side. The rack server includes a power supply in the housing downstream of the processor with respect to the insertion direction. An air guide element is arranged in the housing between the power supply and the heat sink in such a way that cooling air supplied to the heat sink is guided past the power supply to the rear side of the housing and cooling air supplied to the power supply is not preheated by the heat sink.