公开(公告)号：US10411646B2

公开(公告)日：2019-09-10

申请号：US16013917

申请日：2018-06-20

Applicant: CHROMA ATE INC.

Inventor： Cheng-Ting Tsai ,  Lan-Sheng Yang

IPC: H02S50/10 ,  G02B27/30 ,  H01L31/048 ,  H01L31/0224 ,  H02S50/15

Abstract: A method for inspecting a solar cell and configured to inspect a peeling state of a three-dimensional pattern of the solar cell includes obliquely illuminating the three-dimensional pattern of the solar cell using a light beam. An image of the solar cell is normally captured. An intensity of the light beam is increased to increase a contrast between the three-dimensional pattern and a shadow of the three-dimensional pattern in the image and increase a contrast between an ink pattern of the solar cell and the shadow in the image to overexpose the ink pattern in the image. Determine if the three-dimensional pattern is peeling according to the shadow of the three-dimensional pattern in the image.

公开(公告)号：US20190257762A1

公开(公告)日：2019-08-22

申请号：US16256578

申请日：2019-01-24

Applicant: CHROMA ATE INC.

Inventor： Shih-Yao PAN ,  Szuyen LIN

IPC: G01N21/88 ,  G01N21/956

Abstract: A detection device, applied to detect an object under test, includes a beam splitter, a pattern beam generator, an image-capturing device and a processor. The pattern beam generator and the image-capturing device are located to two different sides of the beam splitter in a conjugate arrangement. The pattern beam generator is to generate a preset pattern, and the preset pattern is then projected onto the object under test via the beam splitter. The image-capturing device is to capture a real pattern via the beam splitter, in which the real pattern is generated on the object under test after the preset pattern is projected onto the object under test. The processor is to compare the preset pattern and the real pattern and to further determine a quality of the object under test.

公开(公告)号：US20190067759A1

公开(公告)日：2019-02-28

申请号：US16108081

申请日：2018-08-21

Applicant: CHROMA ATE INC.

Inventor： Hsu-Chang HSU ,  Kuo-Yen HSU ,  Kuan-Chen CHEN ,  Chuan-Tse LIN

IPC: H01M10/48 ,  H01M10/42 ,  G01R31/36

CPC classification number: H01M10/482 ,  G01R31/385 ,  H01M2/1016 ,  H01M10/4207 ,  H01M10/4285 ,  H01M10/446 ,  H01M10/484

Abstract: A probe supporting structure, configured to support probe for testing battery cell, includes a base and at least two supporting members. The supporting members are detachably disposed on the base with an adjustable distance between the supporting members. The supporting members are arranged in parallel manner.

公开(公告)号：US20180292452A1

公开(公告)日：2018-10-11

申请号：US15841626

申请日：2017-12-14

Applicant: CHROMA ATE INC.

Inventor： Chi-Chen WU ,  Meng-Kung LU ,  Yun-Jui CHENG ,  Chien-Ming CHEN

IPC: G01R31/28 ,  G01R1/04

Abstract: A device for pressing an electronic component with different downward forces includes a first downward-pressure generating device, a depressing head, a second downward-pressure generating device and a depressing piston. The first downward-pressure generating device has the depressing head to apply a first downward pressure to the test socket and a portion of the electronic component. The second downward-pressure generating device has the depressing piston to apply a second downward pressure downward to another portion on the electronic component, so that the electronic component can couple electrically with a plurality of probe of the test socket. Thereupon, at least two downward-pressure generating devices are included to provide at least two different downward pressures to the electronic component solely or simultaneously to the electronic component and the testing equipment, such that specific downward-pressure requirements by precision electronic components can be fulfilled.

公开(公告)号：US20180188132A1

公开(公告)日：2018-07-05

申请号：US15846026

申请日：2017-12-18

Applicant: CHROMA ATE INC.

Inventor： Po-Kai CHENG ,  Chang-Chi YANG ,  Chi-Shu WANG

IPC: G01M3/32 ,  G01R1/067 ,  G01R31/26

CPC classification number: G01M3/3272 ,  G01M3/3263 ,  G01M3/3281 ,  G01R1/0416 ,  G01R1/06722 ,  G01R31/2601 ,  G01R31/2862 ,  G01R31/2881

Abstract: A method for testing air tightness includes connecting a testing chamber and a storage chamber, supplying negative pressure to the storage chamber, measuring the pressure in the storage or testing chamber to obtain a first pressure value, determining air tightness of the testing chamber according to the negative pressure and the first pressure value, stopping the negative pressure to the storage chamber, measuring the pressure in the storage chamber to obtain a second pressure value, measuring the pressure in the storage chamber after stopping the negative pressure to the storage chamber to obtain a third pressure value, and determining air tightness of the testing chamber according to the second and third pressure values. The device includes testing and storage chambers, a negative pressure generator, and a pressure gauge connected to the storage chamber, which is connected to the testing chamber. The negative pressure generator is connected to the storage chamber.

公开(公告)号：US20180113151A1

公开(公告)日：2018-04-26

申请号：US15790185

申请日：2017-10-23

Applicant: Chroma Ate Inc.

Inventor： Xin-Yi WU ,  Chien-Hung LO ,  Jui-Chih CHOU ,  Hao-Che YANG ,  Nan-Yi KUO

IPC: G01R1/04 ,  G01R31/28

CPC classification number: G01R1/0458 ,  G01R31/2831 ,  G01R31/2877 ,  G01R31/2881

Abstract: A dew resistant module for a test socket, and an electronic component testing device having the same are provided. An enclosure body is provided to circumscribe the test socket; and a test socket base plate provided on top of the test socket and enclosure body. A cover is provided to cover the test socket, enclosure body and test socket base plate. With the provision of the enclosure body and the cover, the test socket, test socket base plate and a portion of the thermal head are prevented from coming into contact directly with the atmosphere, whereby condensation or dewing is prevented, thermal insulation achieved and energy consumption minimized.

公开(公告)号：US20160341787A1

公开(公告)日：2016-11-24

申请号：US15092290

申请日：2016-04-06

Applicant: CHROMA ATE INC.

Inventor： Chien-Ming WU ,  Ming-Ying TSOU ,  Kuan-Hung WU ,  Kun-Che HE

IPC: G01R31/28 ,  G01R31/40

CPC classification number: G01R31/2846 ,  G01R31/3631

Abstract: A battery simulator for simulating the status of a battery connected to a load component includes a controllable current source, a voltage detector, and a gain controller. The controllable current source supplies an output current to the load component according to a current control signal. The voltage detector measures a detection voltage that is generated in response to the output current flowing through the load component. The gain controller is electrically connected to the controllable current source and the voltage detector and generates the current control signal according to a voltage control signal, a gain control signal and the detection voltage.

Abstract translation: 用于模拟连接到负载组件的电池的状态的电池模拟器包括可控电流源，电压检测器和增益控制器。 可控电流源根据电流控制信号向负载组件提供输出电流。 电压检测器测量响应于流过负载组件的输出电流而产生的检测电压。 增益控制器电连接到可控电流源和电压检测器，并根据电压控制信号，增益控制信号和检测电压产生电流控制信号。

公开(公告)号：US09494353B2

公开(公告)日：2016-11-15

申请号：US14302442

申请日：2014-06-12

Applicant: CHROMA ATE INC.

Inventor： Ben-Mou Yu ,  Ming-Chieh Lin ,  Ching-Wen Chang ,  Xin-Yi Wu

IPC: F25B21/02 ,  F25B49/00 ,  G05D23/19

CPC classification number: F25B49/00 ,  F25B21/02 ,  G05D23/1919

Abstract: A temperature control equipment is capable of controlling a tested object to a predetermined temperature. The temperature control equipment includes a thermal conducting plate, a temperature regulating module, a carrier plate, and a thermoelectric cooling module. The temperature regulating module is thermally connected to the thermal conducting plate for regulating the thermal conducting plate to a reference temperature. The carrier plate is used to accommodate the tested object. The thermoelectric cooling module is thermally connected between the thermal conducting plate and the carrier plate for controlling the tested object to the predetermined temperature via the carrier plate based on the reference temperature.

Abstract translation: 温度控制设备能够将测试对象控制到预定温度。 温度控制设备包括导热板，温度调节模块，承载板和热电冷却模块。 温度调节模块热连接到用于将导热板调节到参考温度的导热板。 承载板用于容纳被测物体。 热电冷却模块热连接在导热板和承载板之间，用于基于参考温度经由载板将测试对象控制到预定温度。

公开(公告)号：US20160191032A1

公开(公告)日：2016-06-30

申请号：US14971044

申请日：2015-12-16

Applicant: CHROMA ATE INC.

Inventor： Cheng-Hsien CHANG ,  Ching-Hua CHU ,  Shin-Wen LIN

IPC: H03K5/135 ,  G06F1/04

CPC classification number: H03K5/135 ,  G06F1/04 ,  G06F1/06 ,  H03K2005/00078

Abstract: A clock generating device includes a first timing delay module, a multiplexer, and a second timing delay module. The multiplexer is electrically connected to the first timing delay module. The second timing delay module is electrically connected to the multiplexer. The first timing delay module generates a plurality of delayed clock signals based on a reference clock signal. The multiplexer outputs a first delayed clock signal and a second delayed clock signal, among the plurality of delayed clock signals, based on a clock generating signal. The second timing delay module generates an output clock signal based on the clock generating signal, the first delayed clock signal and the second delayed clock signal.

Abstract translation: 时钟产生装置包括第一定时延迟模块，多路复用器和第二定时延迟模块。 多路复用器电连接到第一定时延迟模块。 第二定时延迟模块电连接到多路复用器。 第一定时延迟模块基于参考时钟信号产生多个延迟的时钟信号。 复用器基于时钟产生信号在多个延迟时钟信号之间输出第一延迟时钟信号和第二延迟时钟信号。 第二定时延迟模块基于时钟产生信号，第一延迟时钟信号和第二延迟时钟信号产生输出时钟信号。

公开(公告)号：US20150226794A1

公开(公告)日：2015-08-13

申请号：US14617892

申请日：2015-02-09

Applicant: CHROMA ATE INC.

Inventor： Chien-Ming CHEN

IPC: G01R31/28 ,  G01R1/04

CPC classification number: G01R31/2893 ,  G01R1/0433 ,  G01R31/2867 ,  G01R31/2887 ,  G01R31/2896 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012

Abstract: An apparatus for testing a package-on-package semiconductor device comprises a pick and place device for loading a first chip into or unloading the first chip from a test socket and a lifting and rotating arm for moving a chip placement module which receives a second chip to a position between the pick and place device and the test socket. The pick and place device and the chip placement module are lowered, and then a test process is performed. After the test process is completed, the pick and place device and the chip placement module are lifted, and the lifting and rotating arm moves the chip placement module to one side of the pick and place device. Accordingly, a method for testing the semiconductor device could be performed automatically so as to greatly enhance test efficiency and accuracy and to significantly reduce costs.

Abstract translation: 一种用于测试封装封装半导体器件的装置，包括用于将第一芯片从测试插座加载到第一芯片或从其卸载的拾取和放置装置，以及用于移动芯片放置模块的提升和旋转臂，芯片放置模块接收第二芯片 到拾取和放置设备与测试插座之间的位置。 拾取和放置装置和芯片放置模块降低，然后进行测试处理。 测试过程完成后，拾取和放置设备和芯片放置模块被提起，提升和旋转臂将芯片放置模块移动到拾取和放置设备的一侧。 因此，可以自动进行半导体装置的测试方法，大大提高测试效率和精度，并显着降低成本。