Dry powder thermosetting resin composition

    公开(公告)号:US11584858B2

    公开(公告)日:2023-02-21

    申请号:US16778329

    申请日:2020-01-31

    Abstract: The present invention discloses a dry powder composition comprising a thermosetting resin in particulate form, wherein the dry powder composition has a particle size measured according to ISO 13320 (2009) characterized by a Dv90 of 50 μm or lower, a Dv50 in the range of 5.1 to 12.5 μm, and a ratio of Dv ⁢ ⁢ 90 - Dv ⁢ ⁢ 10 Dv ⁢ ⁢ 50 in the range of 1.5 to 4.2. The present invention also discloses processes for preparing the dry powder using jet milling, and processes of applying the dry powder composition to a metal surface. Furthermore, the present invention discloses the uses of the dry powder composition as a bonding material or as an adhesion promoter in a polymer compound.

    LOW POLYMER CONTENT PROPYLENE POLYMER-BASED HOT MELT ADHESIVE COMPOSITION

    公开(公告)号:US20230024582A1

    公开(公告)日:2023-01-26

    申请号:US17810986

    申请日:2022-07-06

    Abstract: The hot melt adhesive composition includes from 1% by weight to less than 10% by weight total polymer content, of which less than 10% by weight, based on the hot melt adhesive composition, is a single site-catalyzed propylene polymer selected from the group consisting of a single site-catalyzed propylene homopolymer, a single site-catalyzed propylene/alpha-olefin copolymer, and combinations thereof, liquid plasticizer, and at least 45% by weight of a hydrocarbon tackifying agent having a softening point greater than 90° C.

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