Abstract:
The present invention relates to a packaged hot-melt pressure sensitive adhesive comprising a hot-melt pressure sensitive adhesive composition and a coextrusion coating consisting of neat low density polyethylene, neat polypropylene, or neat ethylene vinyl acetate. The present invention further relates to the use of the packaged adhesive formed as individual forms in an adhesive application process, and the use of the packaged adhesive in the production of laminated articles, including nonwoven hygiene articles, disposable medical drapes, and also laminate constructions such as tapes and labels.
Abstract:
The present invention concerns a hot melt composition having improved anti-blocking properties. In particular, the present invention is directed to a hot melt composition in the form of particulate units, the particulate units having a surface which is at least partially covered by hollow glass micro particles.
Abstract:
A reaction product and hot melt adhesive compositions that include the reaction product are disclosed. The reaction product includes the reaction product of a first polymer that includes at least one of polypropylene homopolymer and polypropylene-alpha-olefin copolymer, a first wax that includes at least one of polyethylene wax, Fischer Tropsch wax and paraffin wax, and a free radical initiator and has a viscosity of no greater than 12,000 centipoise at 177° C.
Abstract:
A colored composition including a resin system, and a colorized filler. The colorized filler includes particles including a polymer. The particles have a density less than 2.6 g/cc and an average particle size from 100 microns to 600 microns.
Abstract:
The invention features a hot melt composition in the form of a film including from 40% by weight to 80% by weight of a non-functionalized alkyl acrylate, from 14% by weight to 50% by weight of an olefin polymer, from 2% by weight to 15% by weight of a first functionalized polymer comprising a functional group selected from the group consisting of epoxides and carboxylic anhydrides, and from 2% by weight to 15% by weight of a second functionalized polymer comprising a functional group capable of reacting with the functional group of the first functionalized polymer. The hot melt composition in the form of a film has found utility as an encapsulant for thin film photovoltaic modules.
Abstract:
The present invention discloses a dry powder composition comprising a thermosetting resin in particulate form, wherein the dry powder composition has a particle size measured according to ISO 13320 (2009) characterized by a Dv90 of 50 μm or lower, a Dv50 in the range of 5.1 to 12.5 μm, and a ratio of Dv 90 - Dv 10 Dv 50 in the range of 1.5 to 4.2. The present invention also discloses processes for preparing the dry powder using jet milling, and processes of applying the dry powder composition to a metal surface. Furthermore, the present invention discloses the uses of the dry powder composition as a bonding material or as an adhesion promoter in a polymer compound.
Abstract:
The hot melt adhesive composition includes from 1% by weight to less than 10% by weight total polymer content, of which less than 10% by weight, based on the hot melt adhesive composition, is a single site-catalyzed propylene polymer selected from the group consisting of a single site-catalyzed propylene homopolymer, a single site-catalyzed propylene/alpha-olefin copolymer, and combinations thereof, liquid plasticizer, and at least 45% by weight of a hydrocarbon tackifying agent having a softening point greater than 90° C.
Abstract:
The HMPSA compositions of this invention include from 10% by weight to 35% by weight of a styrenic block copolymer, from 10% by weight to 60% by weight of a near white rosin ester tackifying agent having a neat Molten Garner Color of no greater than 2, and from 28% by weight to 45% by weight of a plasticizer. The HMPSA compositions are especially useful as positioning adhesives adhering well to both cotton and microfiber.