公开(公告)号：US20220056373A1

公开(公告)日：2022-02-24

申请号：US17416420

申请日：2019-08-07

Applicant: KCTECH CO., LTD.

Inventor： Ga Young JUNG ,  Yong Ho JEONG ,  Kun Hee PARK ,  Young Gon KIM ,  Young Ho YOON ,  Young Lok YOON

IPC: C11D3/20 ,  C11D11/00 ,  C11D3/34 ,  C11D3/36 ,  C11D1/14 ,  C11D1/34

Abstract: The present disclosure relates to a cleaning liquid composition and a cleaning method using the same. A polishing slurry composition according to an embodiment of the present disclosure includes: a chelating agent containing an organic salt; and an anionic surfactant.

公开(公告)号：US20210229236A1

公开(公告)日：2021-07-29

申请号：US17158657

申请日：2021-01-26

Applicant: Samsung Display Co., Ltd. ,  KCTECH CO.,LTD.

Inventor： Junggun NAM ,  Seungik KANG ,  Seungbae KANG ,  Pungseok KIM ,  Heesung YANG ,  Keunwoo LEE ,  Woojin CHO ,  Byoungkwon CHOO

IPC: B24B37/07 ,  B32B38/00

Abstract: An apparatus for manufacturing a display device includes a moving part including a belt that circulates, a roller that circulates the belt, and at least one meandering prevention portion that moves in a first direction parallel to a direction of a rotation shaft of the roller and prevents meandering of the belt, and a polishing head disposed corresponding to the moving part, the polishing head polishing a surface of a base material disposed on a first surface of the belt. A part of the at least one meandering prevention portion faces a second surface of the belt, the second surface being a side surface of the belt.

公开(公告)号：US20210114163A1

公开(公告)日：2021-04-22

申请号：US17036062

申请日：2020-09-29

Applicant: Samsung Display Co., LTD. ,  KCTECH CO.,LTD.

Inventor： Seung Bae KANG ,  Sung Hyeon PARK ,  Jung Gun NAM ,  Joon-Hwa BAE ,  Kyung Bo LEE ,  Keun Woo LEE ,  Woo Jin CHO ,  Byoung Kwon CHOO

IPC: B24B37/015 ,  B24B37/04 ,  H01L27/32 ,  H01L51/00 ,  H01L51/56 ,  C03C19/00

Abstract: A substrate processing apparatus includes: a conveyor belt configured to have an outer surface on which a bottom surface of a substrate is seated; and a polishing head unit configured to face an upper surface of the substrate, wherein the polishing head unit includes: a polishing head connected to a driver; a polishing pad configured to face the polishing head; a polishing pad fixing ring disposed between the polishing head and the polishing pad; and a temperature sensor configured to overlap the polishing pad fixing ring and to be spaced apart from the polishing pad fixing ring.

公开(公告)号：US20210079262A1

公开(公告)日：2021-03-18

申请号：US16954350

申请日：2018-11-13

Applicant: KCTECH CO., LTD.

Inventor： Hae Won YANG ,  Jun Ha HWANG ,  Jung Yoon KIM ,  Kwang Soo PARK

IPC: C09G1/02 ,  H01L21/321

Abstract: The present invention relates to a polishing slurry composition for an STI process, the polishing slurry composition comprising: a polishing solution including polishing particles; and an additive solution containing a nitride film polishing barrier inclusive of a polymer having an amide bond.

公开(公告)号：US10784113B2

公开(公告)日：2020-09-22

申请号：US15773904

申请日：2016-08-08

Applicant: KCTECH CO., LTD.

Inventor： Kyunam Park

IPC: H01L21/304 ,  H01L21/306 ,  H01L21/67 ,  H01L21/02 ,  C09G1/02 ,  B24B37/12 ,  B24B37/20

Abstract: Provided are a chemical mechanical polishing apparatus and a control method thereof. The chemical mechanical polishing apparatus includes a plurality of polishing platens provided with a polishing pad on an upper surface thereof, and a polishing platen transferring unit for transferring the plurality of polishing platens to different process positions according to a predetermined process sequence. Here, different processes are performed at different process positions.

公开(公告)号：US20200294832A1

公开(公告)日：2020-09-17

申请号：US16748834

申请日：2020-01-22

Applicant: KCTECH CO., LTD.

Inventor： DONG MIN KIM

IPC: H01L21/677 ,  B24B57/02

Abstract: The present disclosure relates to a substrate processing apparatus, and more specifically, to a substrate processing apparatus capable of blocking the introduction of external air and external particles into a chamber by forming an air curtain at a loading/unloading part when the chamber is open.The substrate processing apparatus of the present disclosure includes a chamber in which a space is formed, and a fluid injection part configured to inject a fluid from an outer side of a substrate loading/unloading part of the chamber through which a substrate is loaded and unloaded.

公开(公告)号：US20200243306A1

公开(公告)日：2020-07-30

申请号：US16750317

申请日：2020-01-23

Applicant: KCTECH CO.,LTD.

Inventor： Yong Ki HAN

IPC: H01J37/32 ,  H01L21/67 ,  E05F15/00

Abstract: Disclosed are an opening and shutting device and a substrate processing apparatus including the same. A device for opening and closing an entrance through which a substrate is carried into and out of a processing chamber includes an opening and shutting part that is disposed between the entrance and the processing chamber and that opens and closes the entrance while rotating so as to be brought into close contact with the entrance.

公开(公告)号：US20180355213A1

公开(公告)日：2018-12-13

申请号：US15883655

申请日：2018-01-30

Applicant: Samsung Electronics Co., Ltd. ,  KCTECH CO., LTD.

Inventor： Seung Ho Park ,  Hyun Goo KONG ,  Jung Hun KIM ,  Sang Mi LEE ,  Woo In LEE ,  Hee Sook CHEON ,  Sang Kyun KIM ,  Hao CUI ,  Jong Hyuk PARK ,  Il Young YOON

IPC: C09G1/02 ,  H01L21/28 ,  H01L27/108 ,  H01L21/321

CPC classification number: C09G1/02 ,  H01L21/28079 ,  H01L21/28123 ,  H01L21/3212 ,  H01L27/10814 ,  H01L27/10823 ,  H01L27/10876

Abstract: A slurry composition for polishing a metal layer and a method for fabricating a semiconductor device using the same are provided. The slurry composition for polishing a metal layer includes polishing particles including a metal oxide, an oxidizer including hydrogen peroxide, and a first polishing regulator including at least one selected from a group consisting of phosphate, phosphite, hypophosphite, and metaphosphate, wherein a content of the oxidizer is 0.01 wt % to 0.09 wt % with respect to 100 wt % of the slurry composition for polishing the metal layer.

公开(公告)号：US12247141B2

公开(公告)日：2025-03-11

申请号：US17415704

申请日：2019-11-04

Applicant: KCTECH CO., LTD.

Inventor： Nak Hyun Choi ,  Jung Yoon Kim ,  Hae Won Yang ,  Soo Wan Choi

IPC: C09G1/02 ,  C09G1/04 ,  B82Y40/00 ,  H01L21/304

Abstract: The present invention relates to a polishing slurry composition. A polishing slurry composition according to an embodiment of the present disclosure comprises: a nonionic polymer having at least one amide bond; a selectivity control agent; and abrasive particles.

公开(公告)号：US20240286243A1

公开(公告)日：2024-08-29

申请号：US18453322

申请日：2023-08-22

Applicant: KCTECH CO., LTD.

Inventor： Sung Ho SHIN ,  Hee Cheul JUNG ,  Soo Ho KIM

IPC: B24B37/015

CPC classification number: B24B37/015

Abstract: Provided is a substrate polishing apparatus. The substrate polishing apparatus includes a carrier configured to grip a substrate, a polishing pad configured to polish a surface to be polished of the substrate gripped by the carrier while rotating, and a temperature control assembly configured to control a temperature of the polishing pad, and the temperature control assembly includes Deionized water (DIW) spraying module configured to spray DIW toward the polishing pad and a guide vane configured to guide at least a portion of the DIW sprayed from the DIW spraying module to an outside of the polishing pad.