Abstract:
A magnetic refrigerating device includes: a magnetic refrigerating unit including a magnetic material “A” exhibiting a magneto-caloric effect that the temperature of the material “A” is increased by the application of a magnetic field and the temperature of the material “A” is decreased by the removal of a magnetic field, a magnetic material “B” exhibiting a magneto-caloric effect that the temperature of the material “B” is decreased by the application of a magnetic field and the temperature of the material “B” is increased by the removal of a magnetic field, a heat conductive material “a” exhibiting higher heat conductivity under the application of a magnetic field and lower heat conductivity under the removal of a magnetic field, and a heat conductive material “b” exhibiting lower heat conductivity under the application of a magnetic field and higher heat conductivity under the removal of a magnetic field, wherein the magnetic refrigerating unit is configured so as to include at least one layered structure denoted by “AaBb” or “AbBa”; and a magnetic field-applying means to apply a magnetic field to the magnetic refrigerating unit.
Abstract:
A compact and highly efficient hybrid magnetic refrigerator includes a hybrid refrigerating apparatus wherein an evaporator of a vapor compression refrigeration cycle and a heat exchanger of a magnetic refrigeration cycle are thermally connected. The magnetic refrigeration cycle is provided with a magnetic refrigeration unit in which a magnetic substance dissipates and absorbs heat according to the increase and decrease of a magnetic field in order to heat and cool a refrigerant circulating in its vicinity. The heated refrigerant is cooled by the evaporator of the vapor compression refrigeration cycle and the cooled refrigerant is supplied to the heat exchanger cooling the outside air.
Abstract:
Although sintered wire with lower resistance was preferable as a scan line and a signal line in conventional art in order to make a voltage drop small, there was a problem in electric connection with an electrode which constructs a cathode. In the present invention, a cathode which has an electron-emitting region 16 on a substrate 10 is constructed of a base electrode 11, a top electrode 13, and a protective insulating film 14 sandwiched by these electrodes, the base electrode 11 becomes a signal line, and sintered wire 18, used as a scan line, and the top electrode 13 are connected with an sub-electrode 17. The sub-electrode 17 includes metal included in the sintered wire 18, and metal included in the top electrode 13.
Abstract:
A tip of a wire formed in the shape of a ball is bonded to an electrode by using a tool. A part of the wire is drawn from the tip bonded to the electrode. A bump is formed on the electrode by deforming a portion of the wire continuous with the tip on the tip by using the tool. The wire is cut while leaving the bump on the electrode.
Abstract:
A liquid crystal display unit is used that has data lines made of a molybdenum-alloyed film having a chromium content from 2 wt. % or more, but up to 5 wt. %, or a molybdenum-alloyed film lamination (Mo—Cr) consisting of a first electroconductive film and a second electroconductive film, with the first electroconductive film having a chromium content from 2 wt. % or more, but up to 5 wt. % and the second electroconductive film being provided above the first electroconductive film and containing less chromium than the first electroconductive film does. The use of the data lines composed of these materials enables the following requirements to be satisfied: high dry-etching resistance, low resistance, low ACF contact resistance, low side etching rates, forward tapered wiring cross-sectional shape, and up to two lamination layers.
Abstract:
A polycrystalline Si thin film transistor substrate having a self-aligned LDD and provided with a gate made of a Mo—W alloy having a W concentration not lower than 5% by weight and lower than 25% by weight and preferably a W concentration of 17 to 22% by weight, which is formed by a process comprising a wet-etching step using an etching solution having a phosphoric acid concentration of 60% to 70% by weight, has uniform characteristic properties and is excellent in productivity.
Abstract:
A liquid crystal display device has good contact characteristics between an etched side end portion of a lower layer wiring line and an insulating film and the like, satisfactory step coverage, and satisfactory adhesion to a substrate so that disconnection of an upper layer wiring line and short-circuiting of the lower layer wiring line can be prevented to improve reliability. The liquid crystal display device comprises a wiring line having a laminated structure including a first layer which is made from a first metal layer formed over an insulating substrate and a second layer which is made from a second metal layer different from the first metal layer and is formed over the first metal layer, and the side end face of the first layer has a right-tapered shape with a taper angle of 60° or less, while the side end face of the second layer is approximately perpendicular to or counter-tapered with respect to the insulating substrate. The second layer has a thickness not greater than ½ of that of the first layer.
Abstract:
A spring contact 10 has a pair of round contact projections 11 and 12 symmetrically formed at both sides of a peak of a bending top thereof. The spring contact is fixed to an insulator 20 at a central portion thereof and has a second contact region 13 at a lower end thereof. The spring contact is located in a natural condition where no external force is applied. In this condition, the round contact projection 11 is located at a position remotest from the surface of the insulator. When an electronic part approaches perpendicularly to the surface of the insulator, a contact pad of the electronic part at first touches one of the round contact projections 11 and finally touches the other of the round contact projections 12 after the spring contact is deformed and displaced to a deformed position. At this time, the wiping displacement d of the spring contact in the direction perpendicular to the connecting direction of this connector is extremely small.