公开(公告)号：US20210257572A1

公开(公告)日：2021-08-19

申请号：US17186362

申请日：2021-02-26

Applicant: Apple Inc.

Inventor： Andreas Bibl ,  Kapil V. Sakariya ,  Charles R. Griggs ,  James Michael Perkins

IPC: H01L51/50 ,  H01L27/15 ,  G09G3/00 ,  H01L23/00 ,  H01L21/683

Abstract: A display panel and method of manufacture are described. In an embodiment, a display substrate includes a pixel area and a non-pixel area. An array of subpixels and corresponding array of bottom electrodes are in the pixel area. An array of micro LED devices are bonded to the array of bottom electrodes. One or more top electrode layers are formed in electrical contact with the array of micro LED devices. In one embodiment a redundant pair of micro LED devices are bonded to the array of bottom electrodes. In one embodiment, the array of micro LED devices are imaged to detect irregularities.

公开(公告)号：US10923023B1

公开(公告)日：2021-02-16

申请号：US15380860

申请日：2016-12-15

Applicant: Apple Inc.

Inventor： Andreas Bibl ,  Xia Li ,  John A. Higginson ,  Vaibhav D. Patel ,  Kapil V. Sakariya ,  Imran Hashim ,  Tore Nauta ,  Thomas Charisoulis

IPC: G09G3/32 ,  H01L27/32

Abstract: Hybrid chiplets, display backplanes, and displays with integrated hybrid chiplets are described. In an embodiment, a hybrid chiplet includes a micro LED chiplet stacked on a micro driver chiplet that includes at least one drive transistor and a bottom side including a plurality of bottom chiplet contacts for electrical connection with a display backplane.

公开(公告)号：US10814496B2

公开(公告)日：2020-10-27

申请号：US15839691

申请日：2017-12-12

Applicant: Apple Inc.

Inventor： Andreas Bibl ,  Paul A. Parks ,  Stephen P. Bathurst ,  Jon A. Williams ,  John A. Higginson ,  Shenshen Zhao

IPC: B25J15/00 ,  H01L21/677 ,  H01L21/683 ,  H01L21/67 ,  H01L21/68 ,  B25J7/00 ,  B25J15/04

Abstract: Structures and methods to actively control the shape of a micro pickup array (MPA) during micro device transfer are described. In an embodiment, a strain is applied to the MPA counteractive to strain arising during micro device transfer operations. For example, strain may be applied by a piezoelectric actuator element bonded to a back side of the base substrate to control a curvature of base substrate, and by extension the MPA.

公开(公告)号：US10593832B2

公开(公告)日：2020-03-17

申请号：US15223900

申请日：2016-07-29

Applicant: Apple Inc.

Inventor： Kelly McGroddy ,  Hsin-Hua Hu ,  Andreas Bibl ,  Clayton Ka Tsun Chan ,  Daniel Arthur Haeger

IPC: H01L33/14 ,  H01L27/01 ,  H01L33/06 ,  H01L23/00 ,  H01L25/075 ,  H01L27/15 ,  H01L33/00 ,  H01L33/30 ,  H01L33/42 ,  G09G3/32 ,  H01L33/16 ,  H01L33/20

Abstract: Methods and structures for forming arrays of LED devices are disclosed. The LED devices in accordance with embodiments of the invention may include an internally confined current injection area to reduce non-radiative recombination due to edge effects. Several manners for confining current may include etch removal of a current distribution layer, etch removal of a current distribution layer and active layer followed by mesa re-growth, isolation by ion implant or diffusion, quantum well intermixing, and oxide isolation.

公开(公告)号：US10573629B2

公开(公告)日：2020-02-25

申请号：US16284125

申请日：2019-02-25

Applicant: Apple Inc.

Inventor： Andreas Bibl ,  Charles R. Griggs

IPC: H01L25/16 ,  H01L33/44 ,  H01L33/08 ,  H01L33/52 ,  H01L33/60 ,  H01L27/02 ,  H01L23/00 ,  H01L25/075 ,  H01L27/12 ,  H01L33/20 ,  H01L33/48 ,  H01L33/06 ,  H01L33/30 ,  H01L33/62 ,  H01L33/00 ,  H01L33/54 ,  H01L33/56

Abstract: Light emitting devices and methods of integrating micro LED devices into light emitting device are described. In an embodiment a light emitting device includes a reflective bank structure within a bank layer, and a conductive line atop the bank layer and elevated above the reflective bank structure. A micro LED device is within the reflective bank structure and a passivation layer is over the bank layer and laterally around the micro LED device within the reflective bank structure. A portion of the micro LED device and a conductive line atop the bank layer protrude above a top surface of the passivation layer.

公开(公告)号：US10290774B2

公开(公告)日：2019-05-14

申请号：US15299346

申请日：2016-10-20

Applicant: Apple Inc.

Inventor： Hsin-Hua Hu ,  Andreas Bibl

IPC: H01L33/48 ,  H01L27/15 ,  H01L33/62 ,  H01L51/00 ,  H01L25/075 ,  H01L33/44

Abstract: A conformable electronic device and methods for forming such devices are described. Embodiments of a conformable electronic device may include a silicon substrate having a thickness of 50 μm or less. An array of LEDs that are electrically coupled to a controller chip may be formed on a surface of the silicon substrate. In an embodiment, a top passivation layer is formed over the array of LEDs, the one or more controller chips, and the top surface of the silicon substrate. An embodiment also includes a bottom passivation layer formed on a bottom surface of the silicon substrate.

公开(公告)号：US20180374831A1

公开(公告)日：2018-12-27

申请号：US16028611

申请日：2018-07-06

Applicant: Apple Inc.

Inventor： Kapil V. Sakariya ,  Andreas Bibl ,  Hsin-Hua Hu

IPC: H01L25/075 ,  H01L33/36 ,  H01L33/06 ,  H01L33/62 ,  H01L33/44 ,  H01L25/16 ,  H01L33/60

Abstract: Reflective bank structures for light emitting devices are described. The reflective bank structure may include a substrate, an insulating layer on the substrate, and an array of bank openings in the insulating layer with each bank opening including a bottom surface and sidewalls. A reflective layer spans sidewalls of each of the bank openings in the insulating layer.

公开(公告)号：US10022859B2

公开(公告)日：2018-07-17

申请号：US15054977

申请日：2016-02-26

Applicant: Apple Inc.

Inventor： Dariusz Golda ,  John A. Higginson ,  Andreas Bibl ,  Paul Argus Parks ,  Stephen Paul Bathurst

IPC: B25J9/10 ,  H01L21/67 ,  B25J15/00 ,  B25J9/00 ,  B25J17/02 ,  H01L23/00 ,  B25J7/00 ,  H01L21/677 ,  H01L21/68 ,  H01L21/683

Abstract: Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool manipulator assembly allows active alignment between an array of electrostatic transfer heads on a micro pick up array and an array of micro devices on a carrier substrate. Displacement of a compliant element of the mass transfer tool manipulator assembly may be sensed to control alignment between the array of electrostatic transfer heads and the array of micro devices.

公开(公告)号：US20180182746A1

公开(公告)日：2018-06-28

申请号：US15850862

申请日：2017-12-21

Applicant: Apple Inc

Inventor： Andreas Bibl ,  Charles R. Griggs

IPC: H01L25/16 ,  H01L33/48 ,  H01L25/075 ,  H01L27/12 ,  H01L33/00 ,  H01L33/62 ,  H01L33/60 ,  H01L33/56 ,  H01L33/54 ,  H01L33/52 ,  H01L23/00 ,  H01L33/44 ,  H01L33/30 ,  H01L33/20 ,  H01L33/08 ,  H01L33/06

CPC classification number: H01L25/167 ,  H01L24/95 ,  H01L25/0753 ,  H01L25/165 ,  H01L27/0203 ,  H01L27/124 ,  H01L27/1244 ,  H01L33/0008 ,  H01L33/06 ,  H01L33/08 ,  H01L33/20 ,  H01L33/30 ,  H01L33/44 ,  H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00

Abstract: Light emitting devices and methods of integrating micro LED devices into light emitting device are described. In an embodiment a light emitting device includes a reflective bank structure within a bank layer, and a conductive line atop the bank layer and elevated above the reflective bank structure. A micro LED device is within the reflective bank structure and a passivation layer is over the bank layer and laterally around the micro LED device within the reflective bank structure. A portion of the micro LED device and a conductive line atop the bank layer protrude above a top surface of the passivation layer.

公开(公告)号：US09876000B2

公开(公告)日：2018-01-23

申请号：US15405060

申请日：2017-01-12

Applicant: Apple Inc

Inventor： Andreas Bibl ,  Charles R. Griggs

IPC: H01L25/16 ,  H01L33/54 ,  H01L33/00 ,  H01L33/56 ,  H01L33/62 ,  H01L33/30 ,  H01L33/06 ,  H01L27/12 ,  H01L23/00 ,  H01L33/20 ,  H01L25/075 ,  H01L33/48 ,  H01L33/44 ,  H01L33/60 ,  H01L33/08 ,  H01L33/52

CPC classification number: H01L25/167 ,  H01L24/95 ,  H01L25/0753 ,  H01L25/165 ,  H01L27/0203 ,  H01L27/124 ,  H01L27/1244 ,  H01L33/0008 ,  H01L33/06 ,  H01L33/08 ,  H01L33/20 ,  H01L33/30 ,  H01L33/44 ,  H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00

Abstract: Light emitting devices and methods of integrating micro LED devices into light emitting device are described. In an embodiment a light emitting device includes a reflective bank structure within a bank layer, and a conductive line atop the bank layer and elevated above the reflective bank structure. A micro LED device is within the reflective bank structure and a passivation layer is over the bank layer and laterally around the micro LED device within the reflective bank structure. A portion of the micro LED device and a conductive line atop the bank layer protrude above a top surface of the passivation layer.