公开(公告)号：US10483253B1

公开(公告)日：2019-11-19

申请号：US15247249

申请日：2016-08-25

Applicant: Apple Inc.

Inventor： Hsin-Hua Hu

IPC: H01L25/16 ,  H01L21/56 ,  H01L23/00 ,  H01L33/62 ,  H01L25/18 ,  H01L23/538 ,  H01L25/00 ,  H01L27/088 ,  H01L27/15

Abstract: Embodiments describe a display integration scheme in which an array of pixel driver chips embedded front side up in an insulator layer. A front side redistribution layer (RDL) spans across and is in electrical connection with the front sides of the array of pixel driver chips, and an array of light emitting diodes (LEDs) is bonded to the front side RDL. The pixel driver chips may be located directly beneath the display area of the display panel.

公开(公告)号：US10297722B2

公开(公告)日：2019-05-21

申请号：US15542823

申请日：2015-09-30

Applicant: Apple Inc.

Inventor： Kevin K. C. Chang ,  Hsin-Hua Hu ,  Chien-Hsing Huang

IPC: H01L33/46 ,  H01L33/44 ,  H01L33/20 ,  H04N5/64 ,  H01L25/075

Abstract: Light emitting diodes and display systems are disclosed. In an embodiment a light emitting diode (150) includes a p-n diode (120) including a mesa structure (129) that protrudes from a base structure (131). A reflective metallization (130) laterally surrounds the mesa structure, which also includes a quantum well layer of the p-n diode.

公开(公告)号：US20190123032A1

公开(公告)日：2019-04-25

申请号：US16219896

申请日：2018-12-13

Applicant: Apple Inc.

Inventor： John A. Higginson ,  Andreas Bibl ,  Hsin-Hua Hu

IPC: H01L25/16 ,  H01L33/00 ,  H01L33/62 ,  H01L33/42 ,  H01L27/12 ,  H01L25/00 ,  H01L33/06 ,  H01L33/44 ,  H01L33/54 ,  H01L23/31 ,  H01L25/075

CPC classification number: H01L25/167 ,  H01L21/56 ,  H01L23/3171 ,  H01L25/0753 ,  H01L25/50 ,  H01L27/1214 ,  H01L27/1248 ,  H01L27/1262 ,  H01L33/005 ,  H01L33/06 ,  H01L33/42 ,  H01L33/44 ,  H01L33/54 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0016 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00

Abstract: A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.

公开(公告)号：US20190096846A1

公开(公告)日：2019-03-28

申请号：US16117414

申请日：2018-08-30

Applicant: Apple Inc.

Inventor： Andreas Bibl ,  John A. Higginson ,  Hung-Fai Stephen Law ,  Hsin-Hua Hu

IPC: H01L23/00 ,  H01L33/62

Abstract: A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.

公开(公告)号：US20190006329A1

公开(公告)日：2019-01-03

申请号：US16067865

申请日：2017-01-11

Applicant: Apple Inc.

Inventor： Imran Hashim ,  Vaibhav D. Patel ,  Hsin-Hua Hu ,  Kapil V. Sakariya ,  Ralph E. Kauffman

IPC: H01L25/075 ,  H01L33/62 ,  H01L33/44

Abstract: Display integration schemes are described for passivating LEDs and providing conductive terminal connections. In accordance with embodiments, a sidewall passivation layer is formed around the LEDs. The sidewall passivation layer may or may not be contained within a well structure. A top electrode layer is formed to electrically connect the LEDs to conductive terminal routing.

公开(公告)号：US10043784B2

公开(公告)日：2018-08-07

申请号：US15426947

申请日：2017-02-07

Applicant: Apple Inc.

Inventor： Kapil V. Sakariya ,  Andreas Bibl ,  Hsin-Hua Hu

IPC: H01L25/07 ,  H01L25/075 ,  H01L33/60 ,  H01L25/16 ,  H01L33/44 ,  H01L33/62 ,  H01L33/06 ,  H01L33/36

CPC classification number: H01L25/0753 ,  H01L25/167 ,  H01L33/06 ,  H01L33/36 ,  H01L33/44 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/18 ,  H01L2224/24137 ,  H01L2224/73267 ,  H01L2224/82 ,  H01L2224/83 ,  H01L2224/92244 ,  H01L2224/95 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Reflective bank structures for light emitting devices are described. The reflective bank structure may include a substrate, an insulating layer on the substrate, and an array of bank openings in the insulating layer with each bank opening including a bottom surface and sidewalls. A reflective layer spans sidewalls of each of the bank openings in the insulating layer.

公开(公告)号：US09620695B2

公开(公告)日：2017-04-11

申请号：US15192936

申请日：2016-06-24

Applicant: Apple Inc.

Inventor： Hsin-Hua Hu ,  Kevin K. C. Chang ,  Andreas Bibl

IPC: H01L29/06 ,  H01L33/62 ,  H01L25/075 ,  H01L33/60 ,  H01L33/06 ,  H01L33/32 ,  H01L33/00

CPC classification number: H01L33/62 ,  H01L24/75 ,  H01L24/83 ,  H01L24/95 ,  H01L25/0753 ,  H01L27/15 ,  H01L27/156 ,  H01L33/005 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/04 ,  H01L33/06 ,  H01L33/08 ,  H01L33/32 ,  H01L33/60 ,  H01L2224/83005 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2933/0066 ,  H01L2924/00

Abstract: A method and structure for stabilizing an array of micro devices is disclosed. A stabilization layer includes an array of stabilization cavities and array of stabilization posts. Each stabilization cavity includes sidewalls surrounding a stabilization post. The array of micro devices is on the array of stabilization posts. Each micro device in the array of micro devices includes a bottom surface that is wider than a corresponding stabilization post directly underneath the bottom surface.

公开(公告)号：US09505230B2

公开(公告)日：2016-11-29

申请号：US15157247

申请日：2016-05-17

Applicant: Apple Inc.

Inventor： Andreas Bibl ,  John A. Higginson ,  Hsin-Hua Hu

IPC: G01P15/125 ,  B41J2/39

CPC classification number: B41J2/385 ,  B25J15/0052 ,  B25J15/0085 ,  B41J2/39 ,  B81B2201/038 ,  B81C99/002 ,  H01L21/67144 ,  H01L21/6835 ,  H01L24/75 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/0079 ,  H01L2221/68322 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2224/29036 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/7565 ,  H01L2224/7598 ,  H01L2224/83815 ,  H01L2224/83855 ,  H01L2224/97 ,  H01L2924/12041 ,  H01L2924/00 ,  H01L2224/83 ,  H01L2924/00014

Abstract: A compliant micro device transfer head and head array are disclosed. In an embodiment a micro device transfer head includes a spring portion that is deflectable into a space between a base substrate and the spring portion.