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公开(公告)号：US20170323144A1
公开(公告)日：2017-11-09
申请号：US15662238
申请日：2017-07-27
Applicant: Gingy Technology Inc.
Inventor： Jen-Chieh Wu , Cheng-Jyun Huang , Yu-Cheng Chiu
CPC classification number: G06K9/00046 , B32B7/12 , B32B2307/42 , G06K9/0004 , G06K9/00087
Abstract: A fingerprint identification module including a cover plate, a fingerprint identification sensor, a first adhesive layer, and at least one light source is provided. The cover plate has an inner surface, an outer surface opposite to the inner surface, and a plurality of microstructures located at the inner surface. The fingerprint identification sensor is located under the microstructures and attached to the microstructures through the first adhesive layer, wherein the first adhesive layer is adhered between a portion of the microstructures and a portion of the fingerprint identification sensor, and an air gap is located between the other portion of the microstructures and the other portion of the fingerprint identification sensor. The at least one light source is located under the inner surface and adjacent to the fingerprint identification sensor.
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公开(公告)号：US09813594B2
公开(公告)日：2017-11-07
申请号：US14700104
申请日：2015-04-29
Applicant: Gingy Technology Inc.
Inventor： Jen-Chieh Wu , Chun-Lang Hung
CPC classification number: H04N5/2252 , G06K9/00013 , G06K9/00033 , G06K9/0004 , G06K9/00087 , G06K9/209
Abstract: A photon-drive fingerprint identification module configured to detect a fingerprint of a finger is provided, and the photon-drive fingerprint identification module includes at least a light emitting unit and a light detecting semiconductor array. The light emitting unit is configured to emit a detecting light to the finger, and the finger and the fingerprint reflect the detecting light and turn it into a signal light. The light detecting semiconductor array includes a plurality of light detecting semiconductor units arranged in an array, and the light detecting semiconductor units are configured to receive the signal light reflected by the finger and generate a plurality of electrical signals. Each of the light detecting semiconductor units sequentially includes an antireflection structure, a first type doped semiconductor layer and a second type doped semiconductor layer. The first type doped semiconductor layer is stacked between the antireflection structure and the second type doped semiconductor layer.
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公开(公告)号：US20170011251A1
公开(公告)日：2017-01-12
申请号：US14973686
申请日：2015-12-17
Applicant: Gingy Technology Inc.
Inventor： Jen-Chieh Wu
IPC: G06K9/00
CPC classification number: G06K9/00087 , G06K9/0004 , G06K9/00046
Abstract: A fingerprint identification module including a cover plate, a fingerprint identification sensor, a first adhesive layer, and at least one light source is provided. The cover plate has an inner surface, an outer surface opposite to the inner surface, and a plurality of microstructures located at the inner surface. The fingerprint identification sensor is located under the microstructures and attached to the microstructures through the first adhesive layer. The at least one light source is located under the inner surface and adjacent to the fingerprint identification sensor.
Abstract translation: 提供了包括盖板，指纹识别传感器，第一粘合剂层和至少一个光源的指纹识别模块。 盖板具有内表面，与内表面相对的外表面和位于内表面的多个微结构。 指纹识别传感器位于微结构之下，并通过第一粘合剂层附着于微结构。 所述至少一个光源位于所述内表面下方且与所述指纹识别传感器相邻。
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