公开(公告)号：US20160278218A1

公开(公告)日：2016-09-22

申请号：US15170444

申请日：2016-06-01

Applicant: Intel Corporation

Inventor： Yikang Deng

IPC: H05K3/42 ,  H05K1/09 ,  G01N21/95 ,  H05K1/11 ,  G01N21/64 ,  H05K3/00 ,  H05K1/02

CPC classification number: H05K3/42 ,  G01N21/64 ,  G01N21/643 ,  G01N21/6456 ,  G01N21/95 ,  G01N2021/6439 ,  G01N2021/646 ,  H05K1/0269 ,  H05K1/0274 ,  H05K1/0298 ,  H05K1/09 ,  H05K1/115 ,  H05K3/0011 ,  H05K3/426 ,  H05K3/4644 ,  H05K2201/0302 ,  H05K2201/0326 ,  H05K2201/0329 ,  H05K2203/163 ,  Y10T29/49165

Abstract: A microelectronic substrate having a substrate core with at least one plated through hole extending therethrough, wherein the plated through hole includes a fluorescent conductive fill material. In one embodiment, the plated through hole may comprise a hole defined to extend from a first surface to an opposing second surface of the substrate core, wherein a conductive material layer is formed on a sidewall(s) of the substrate core hole and a conductive fill material, having a fluorescent component, is disposed to fill the remaining substrate core hole after forming the conductive material layer. In another embodiment of the present description, the fluorescent conductive fill material is used for the detection of defects.