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    Wireless communication with dielectric medium
    61.
    发明授权
    Wireless communication with dielectric medium 有权

    公开(公告)号：US09525451B2

    公开(公告)日：2016-12-20

    申请号：US14533545

    申请日：2014-11-05

    Applicant: Keyssa, Inc.

    Inventor： Gary D. McCormack ,  Ian A. Kyles

    IPC: H04B7/00 ,  H04B1/40 ,  H04B1/18 ,  H04B5/00 ,  H05K1/14 ,  H01L23/48 ,  H01L23/66 ,  H01Q7/00 ,  H01Q9/26 ,  H01Q23/00 ,  H05K9/00 ,  H05K1/02 ,  H01L23/495 ,  H01L23/552 ,  H01L23/00 ,  H05K1/18

    Abstract: An electronic device may include a dielectric substrate, an electronic circuit supported by the substrate, for processing data, and a communication unit having an antenna. The communication unit may be mounted to the substrate in communication with the electronic circuit for converting between a first EHF electromagnetic signal containing digital information and a data signal conducted by the electronic circuit. The electromagnetic signal may be transmitted or received along a signal path by the antenna. An electromagnetic signal guide assembly may include a dielectric element made of a dielectric material disposed proximate the antenna in the signal path. The electromagnetic signal guide may have sides extending along the signal path. A sleeve element may extend around the dielectric element along sides of the dielectric element. The sleeve element may impede transmission of the electromagnetic signal through the sides of the dielectric element.

    CONTACTLESS SIGNAL SPLICING
    62.
    发明申请
    CONTACTLESS SIGNAL SPLICING 有权

    公开(公告)号：US20160323009A1

    公开(公告)日：2016-11-03

    申请号：US15204988

    申请日：2016-07-07

    Applicant: Keyssa, Inc.

    Inventor： Gary D. McCormack ,  Ian A. Kyles

    IPC: H04B1/40 ,  H04L12/46 ,  H01Q1/48 ,  H04B5/00

    CPC classification number: H04B1/40 ,  H01Q1/48 ,  H04B5/0031 ,  H04L12/4633 ,  H05K1/0243 ,  H05K2201/10098

    Abstract: A first electronic device may include a first electronic circuit and a second electronic circuit is provided. The first electronic device may include an internal communication link providing a signal path for conducting communication signals between the first electronic circuit and the second electronic circuit. An interface circuit may be operatively coupled to the internal communication link. The interface circuit may include an extremely high frequency (EHF) communications circuit configured to receive an EHF electromagnetic signal from another EHF communications circuit of a second electronic device. This EHF electromagnetic signal may enable the second electronic device to control or monitor the first electronic device.

    CONTACTLESS AUDIO ADAPTER, AND METHODS
    64.
    发明申请
    CONTACTLESS AUDIO ADAPTER, AND METHODS 审中-公开

    公开(公告)号：US20160100249A1

    公开(公告)日：2016-04-07

    申请号：US14958122

    申请日：2015-12-03

    Applicant: Keyssa, Inc.

    Inventor： Gary D. McCormack ,  Ian A. Kyles

    IPC: H04R3/00

    CPC classification number: H04R3/00 ,  H01L2224/48137 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01Q1/2283 ,  H04R2420/07 ,  H04R2420/09 ,  H01L2924/00

    Abstract: A contactless, electromagnetic (EM) replacement for cabled Standards-based interfaces (such as USB, I2S) which handles data transfer requirements associated with the Standard, and capable of measuring and replicating relevant physical conditions on data lines so as to function compatibly and transparently with the Standard. A contactless link between devices having transceivers. A non-conducting housing enclosing the devices. A dielectric coupler facilitating communication between communications chips. Conductive paths or an inductive link providing power between devices. An audio adapter communicates over a contactless link with a source device, and via a physical link with a destination device such as a conventional headset. Power may be provided to the adapter from the source device, and by the adapter to the destination device.

    Connectors providing haptic feedback
    65.
    发明授权
    Connectors providing haptic feedback 有权
    连接器提供触觉反馈

    公开(公告)号：US09197011B2

    公开(公告)日：2015-11-24

    申请号：US14596172

    申请日：2015-01-13

    Applicant: Keyssa, Inc.

    Inventor： Gary D. McCormack

    IPC: H01R13/62

    CPC classification number: H01R13/6205 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

    Abstract: A first connector may include a housing defining a first connector face to be positioned in a first position or a second position proximate to a second connector face of a second connector. A first extremely high frequency (EHF) communication unit may be disposed in the housing for communicating with a second EHF communication unit of the second connector when the first connector face is positioned in first or second position relative to the second connector face. A first magnet may be disposed in the housing. The first magnet may align with and repel a second magnet disposed relative to the second connector face when the first connector face is positioned in the second position. The first magnet may be configured not to align with and not to repel the second magnet when first connector face is positioned in the first position relative to the second connector face.

    Abstract translation: 第一连接器可以包括壳体，其限定要定位在第一位置的第一连接器面或靠近第二连接器的第二连接器面的第二位置。 当第一连接器面相对于第二连接器面定位在第一或第二位置时，第一极高频（EHF）通信单元可以设置在壳体中，用于与第二连接器的第二EHF通信单元通信。 第一磁体可以设置在壳体中。 当第一连接器面定位在第二位置时，第一磁体可以对准并排斥相对于第二连接器面设置的第二磁体。 当第一连接器面相对于第二连接器面定位在第一位置时，第一磁体可以被配置为不与第二磁体对准并且不排斥第二磁体。

    Virtualized physical layer adapted for EHF contactless communication
    66.
    发明授权
    Virtualized physical layer adapted for EHF contactless communication 有权

    公开(公告)号：US10903875B2

    公开(公告)日：2021-01-26

    申请号：US16520771

    申请日：2019-07-24

    Applicant: Keyssa, Inc.

    Inventor： Gary D. McCormack ,  Ian A. Kyles ,  Roger D. Isaac

    IPC: H04B5/00 ,  H04W76/10 ,  H04W76/14

    Abstract: A Physical Layer (PHY) of a host system of an electronic device may be implemented as a contactless PHY (cPHY) for extremely high frequency (EHF) contactless communication and the operation of EHF transmitters (TX), receivers (RX) and transceivers (EHF-XCVR) in an extremely high frequency integrated circuit (EHF IC) of the electronic device. The Host-cPHY translates logical communications requests from the Link Layer (LINK) into hardware-specific operations to affect transmission or reception of signals over an EHF contactless link. The Link Layer (LINK) may also be optimized as a contactless Link Layer (cLINK) for EHF contactless communication. A virtualized contactless Physical Layer (VcPHY) may comprise a contactless Physical Layer (Host-cPHY), and a contactless Link Layer (cLINK) for coupling a conventional Link Layer (LINK) with the contactless Physical Layer (Host-cPHY). Multiple data streams may be transported over the EHF contactless link over a range of frequencies.

    Wireless communication with dielectric medium
    67.
    发明授权
    Wireless communication with dielectric medium 有权

    公开(公告)号：US10707557B2

    公开(公告)日：2020-07-07

    申请号：US16450790

    申请日：2019-06-24

    Applicant: Keyssa, Inc.

    Inventor： Gary D. McCormack ,  Ian A. Kyles

    IPC: H04B7/00 ,  H01Q1/22 ,  H04B1/18 ,  H01L23/552 ,  H04B5/00 ,  H05K1/14 ,  H01L23/48 ,  H01L23/66 ,  H01Q7/00 ,  H01Q9/26 ,  H01Q23/00 ,  H05K9/00 ,  H05K1/02 ,  H01L23/495 ,  H04B1/40 ,  H01Q1/38 ,  H01Q9/04 ,  H01L23/00 ,  H05K1/18

    Abstract: An electronic device may include a dielectric substrate, an electronic circuit supported by the substrate, for processing data, and a communication unit having an antenna. The communication unit may be mounted to the substrate in communication with the electronic circuit for converting between a first EHF electromagnetic signal containing digital information and a data signal conducted by the electronic circuit. The electromagnetic signal may be transmitted or received along a signal path by the antenna. An electromagnetic signal guide assembly may include a dielectric element made of a dielectric material disposed proximate the antenna in the signal path. The electromagnetic signal guide may have sides extending along the signal path. A sleeve element may extend around the dielectric element along sides of the dielectric element. The sleeve element may impede transmission of the electromagnetic signal through the sides of the dielectric element.

    Full duplex contactless communication systems and methods for the use thereof
    68.
    发明授权
    Full duplex contactless communication systems and methods for the use thereof 有权

    公开(公告)号：US10595124B2

    公开(公告)日：2020-03-17

    申请号：US16197247

    申请日：2018-11-20

    Applicant: Keyssa, Inc.

    Inventor： Gary D. McCormack ,  Ian A. Kyles

    IPC: H04R1/00 ,  H04R3/00 ,  H01Q1/22

    Abstract: A contactless, electromagnetic (EM) replacement for cabled Standards-based interfaces (such as USB, I2S) which handles data transfer requirements associated with the Standard, and capable of measuring and replicating relevant physical conditions on data lines so as to function compatibly and transparently with the Standard. A contactless link between devices having transceivers. A non-conducting housing enclosing the devices. A dielectric coupler facilitating communication between communications chips. Conductive paths or an inductive link providing power between devices. An audio adapter communicates over a contactless link with a source device, and via a physical link with a destination device such as a conventional headset. Power may be provided to the adapter from the source device, and by the adapter to the destination device.

    CONTACTLESS DATA TRANSFER SYSTEMS AND METHODS
    69.
    发明申请
    CONTACTLESS DATA TRANSFER SYSTEMS AND METHODS 审中-公开

    公开(公告)号：US20180316394A1

    公开(公告)日：2018-11-01

    申请号：US15966711

    申请日：2018-04-30

    Applicant: Keyssa, Inc.

    Inventor： Gary D. McCormack ,  Roger D. Isaac

    IPC: H04B7/00 ,  H04W8/08

    Abstract: Data may be transferred from a communication subsystem of a first device to a communication subsystem of a second device contactlessly, at high speed, and without intervention by host processors of either device. Devices may be programmed or personalized at the factory or warehouse, and may personalized at a warehouse or at a point of sale while in the box. Various modes of operation and use scenarios are described. Portions of the devices themselves, or a transmission path between the devices may be shielded against snooping by a material which degrades an EHF signal passing therethrough.

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