CONTACTLESS AUDIO ADAPTER, AND METHODS
    61.
    发明申请

    公开(公告)号:US20190215605A1

    公开(公告)日:2019-07-11

    申请号:US16197247

    申请日:2018-11-20

    Applicant: Keyssa, Inc.

    Abstract: A contactless, electromagnetic (EM) replacement for cabled Standards-based interfaces (such as USB, I2S) which handles data transfer requirements associated with the Standard, and capable of measuring and replicating relevant physical conditions on data lines so as to function compatibly and transparently with the Standard. A contactless link between devices having transceivers. A non-conducting housing enclosing the devices. A dielectric coupler facilitating communication between communications chips. Conductive paths or an inductive link providing power between devices. An audio adapter communicates over a contactless link with a source device, and via a physical link with a destination device such as a conventional headset. Power may be provided to the adapter from the source device, and by the adapter to the destination device.

    EHF receiver architecture with dynamically adjustable discrimination threshold

    公开(公告)号:US10250418B2

    公开(公告)日:2019-04-02

    申请号:US15226728

    申请日:2016-08-02

    Applicant: Keyssa, Inc.

    Abstract: An EHF receiver that determines an initial slicing voltage level and dynamically adjusts the slicing voltage level and/or amplifier gain levels to account for characteristics of the received EHF electromagnetic data signal. The architecture includes an amplifier, detector, adaptive signal slicer, and controller. The detector includes a main detector and replica detector that convert the received EHF electromagnetic data signal into a baseband signal and a reference signal. The controller uses the baseband signal and reference signal to determine an initial slicing voltage level, and dynamically adjust the slicing voltage level and the gain settings of the amplifier to compensate for changing signal conditions.

    Extremely high frequency communication chip

    公开(公告)号:US09960792B2

    公开(公告)日:2018-05-01

    申请号:US15406543

    申请日:2017-01-13

    Applicant: Keyssa, Inc.

    CPC classification number: H04B1/04 H04B1/44 H04B5/0031

    Abstract: An electromagnetic Extremely High Frequency (EHF) communication chip includes one or more local oscillator circuits, a transducer circuit and at least one of a modulator or a demodulator coupled to the transducer circuit. Each of the local oscillator circuits may have a local oscillator and configured collectively to generate first and second carrier signals having respective first and second EHF frequencies. The first EHF frequency may be different than the second EHF frequency. The transducer circuit may have a first transducer for transmitting and receiving EHF communication signals. The modulator may be coupled to the local oscillator circuits for modulating the first carrier signal or the second carrier signal with a first transmit base data signal. The demodulator may be for demodulating the first carrier signal or the second carrier signal to produce a first receive base data signal.

    Virtualized physical layer adapted for EHF contactless communication

    公开(公告)号:US09750068B2

    公开(公告)日:2017-08-29

    申请号:US15408937

    申请日:2017-01-18

    Applicant: Keyssa, Inc.

    CPC classification number: H04B5/0031 H04B5/0037 H04W76/10 H04W76/14

    Abstract: A Physical Layer (PHY) of a host system of an electronic device may be implemented as a contactless PHY (cPHY) for extremely high frequency (EHF) contactless communication and the operation of EHF transmitters (TX), receivers (RX) and transceivers (EHF-XCVR) in an extremely high frequency integrated circuit (EHF IC) of the electronic device. The Host-cPHY translates logical communications requests from the Link Layer (LINK) into hardware-specific operations to affect transmission or reception of signals over an EHF contactless link. The Link Layer (LINK) may also be optimized as a contactless Link Layer (cLINK) for EHF contactless communication. A virtualized contactless Physical Layer (VcPHY) may comprise a contactless Physical Layer (Host-cPHY), and a contactless Link Layer (cLINK) for coupling a conventional Link Layer (LINK) with the contactless Physical Layer (Host-cPHY). Multiple data streams may be transported over the EHF contactless link over a range of frequencies.

    CONTACTLESS AUDIO ADAPTER, AND METHODS
    69.
    发明申请

    公开(公告)号:US20170142516A1

    公开(公告)日:2017-05-18

    申请号:US15421181

    申请日:2017-01-31

    Applicant: Keyssa, Inc.

    Abstract: A contactless, electromagnetic (EM) replacement for cabled Standards-based interfaces (such as USB, I2S) which handles data transfer requirements associated with the Standard, and capable of measuring and replicating relevant physical conditions on data lines so as to function compatibly and transparently with the Standard. A contactless link between devices having transceivers. A non-conducting housing enclosing the devices. A dielectric coupler facilitating communication between communications chips. Conductive paths or an inductive link providing power between devices. An audio adapter communicates over a contactless link with a source device, and via a physical link with a destination device such as a conventional headset. Power may be provided to the adapter from the source device, and by the adapter to the destination device.

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